EP120SP

EP120SP Master Bond, Inc.

硕士邦德聚合物系统EP120SP是一种双组分环氧/高性能耐胶衣ancl为纤维缠绕结构的防护涂料酸酐体系。 它是100%反应,不含有任何溶剂或稀释剂。 硕士邦德系统EP120SP聚合物凝胶可以很容易地在低温度为100-120 ° C。 完全固化,在温度获得了125 ° C至150 ° C范围内。 固化后的聚合物特性优良的物理性能和强度有大约137​​ ° C的温度加热distortlon 硕士邦德EP120SP是提供在两个各有六(6)个月最低时形成稳定的液体成分在温度约为25 ± 5 ° C储存

Master Bond Polymer System EP120SP is a two-component epoxy/anhydride system for high performance resistant gel coats ancl protective coatings for filament wound structures. It is, 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP120SP can be readily gelled at temperatures as low as 100-120°C. Full cure is obtained at temperatures in the 125°C to 150°C range. The cured polymer features superior physical strength properties and has a heat distortlon temperature of around 137°C. Master Bond EP120SP is supplied in the form of two liquid components each having a minimum stability of six (6) months when stored at temperatures of around 25±5°C.

技术参数/Specifications

Material System
Chemical System Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Composition & Features
Features Electrically Conductive; EMI/RFI Shielding; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
Industry Electronics; Electric Power

EP120SP,硕士邦德公司,工业密封剂,EP120SP, Master Bond, Inc., Industrial Sealants

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EP120SP

EP120SP Master Bond, Inc.

硕士邦德聚合物系统EP120SP是一种双组分环氧/高性能耐胶衣ancl为纤维缠绕结构的防护涂料酸酐体系。 它是100%反应,不含有任何溶剂或稀释剂。 硕士邦德系统EP120SP聚合物凝胶可以很容易地在低温度为100-120 ° C。 完全固化,在温度获得了125 ° C至150 ° C范围内。 固化后的聚合物特性优良的物理性能和强度有大约137​​ ° C的温度加热distortlon 硕士邦德EP120SP是提供在两个各有六(6)个月最低时形成稳定的液体成分在温度约为25 ± 5 ° C储存

Master Bond Polymer System EP120SP is a two-component epoxy/anhydride system for high performance resistant gel coats ancl protective coatings for filament wound structures. It is, 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP120SP can be readily gelled at temperatures as low as 100-120°C. Full cure is obtained at temperatures in the 125°C to 150°C range. The cured polymer features superior physical strength properties and has a heat distortlon temperature of around 137°C. Master Bond EP120SP is supplied in the form of two liquid components each having a minimum stability of six (6) months when stored at temperatures of around 25±5°C.

技术参数/Specifications

Material System
Chemical System Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Composition & Features
Features Electrically Conductive; EMI/RFI Shielding; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
Industry Electronics; Electric Power

EP120SP,硕士邦德公司,工业密封剂,EP120SP, Master Bond, Inc., Industrial Sealants

Related posts

EP120SP

EP120SP Master Bond, Inc.

硕士邦德聚合物系统EP120SP是一种双组分环氧/高性能耐胶衣ancl为纤维缠绕结构的防护涂料酸酐体系。 它是100%反应,不含有任何溶剂或稀释剂。 硕士邦德系统EP120SP聚合物凝胶可以很容易地在低温度为100-120 ° C。 完全固化,在温度获得了125 ° C至150 ° C范围内。 固化后的聚合物特性优良的物理性能和强度有大约137​​ ° C的温度加热distortlon 硕士邦德EP120SP是提供在两个各有六(6)个月最低时形成稳定的液体成分在温度约为25 ± 5 ° C储存

Master Bond Polymer System EP120SP is a two-component epoxy/anhydride system for high performance resistant gel coats ancl protective coatings for filament wound structures. It is, 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP120SP can be readily gelled at temperatures as low as 100-120°C. Full cure is obtained at temperatures in the 125°C to 150°C range. The cured polymer features superior physical strength properties and has a heat distortlon temperature of around 137°C. Master Bond EP120SP is supplied in the form of two liquid components each having a minimum stability of six (6) months when stored at temperatures of around 25±5°C.

技术参数/Specifications

Material System
Chemical System Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Composition & Features
Features Electrically Conductive; EMI/RFI Shielding; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
Industry Electronics; Electric Power

EP120SP,硕士邦德公司,工业密封剂,EP120SP, Master Bond, Inc., Industrial Sealants

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