单组份，导电（银填充），热冲击，耐热和耐化学性环氧粘接树脂体系，灌封，密封和涂层。 硕士邦德聚合物系统EP11SIC是一个新的优势和成本效益的一个组成部分环氧树脂体系具有极高的电气连接，粘接，密封和涂层结合了卓越的热冲击，耐热和耐化学性，包括水和许多高物理强度性能的导电性有机溶剂。 它具有-60 ° F温度范围超过3000 ° F。 粘附到金属和非金属基材是非常好的。 硕士邦德聚合物系统EP11SIC提供了一个组件的超低导电环氧树脂系统，不需要任何治疗，使用前加上灵活的时间表混合，以满足特定应用需求的最佳应用方便。 它是100％反应，不含有任何溶剂或稀释剂。 硕士邦德聚合物系统EP11SIC是提供在一个银色流动性有一个超过4个月以上的贮存稳定性糊状时，在大约75,50 ° F.存放于温度 制冷大大扩展了该环氧树脂体系的贮存稳定性。 凝胶时间和固化时间取决于温度。 在300 ° F凝胶时间是在20-25分钟的顺序。 在300 ° F固化时间是在60-80分钟蚂蚁在350 °在40-50分钟的顺序F秩序。

One component, Electrically Conductive (Silver Filled), Thermal Shock, Heat and Chemically Resistant Epoxy Resin System for Bonding, Potting, Sealing and Coating. Master Bond Polymer System EP11SIC is a new superior and cost effective one component epoxy resin system featuring exceptionally high electrical conductivity for electrical connections, bonding, sealing and coating which combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water and many organic solvents. It has a service temperature range of -60°F to over 3000°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11SIC offers the application convenience of a one component extra low conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP11SIC is supplied in the form of a silver colored flowable paste having a minimum storage stability of more than 4 months when stored at temperatures of around 75,50°F. Refrigeration greatly extends the storage stability of this epoxy resin system. Gel times and cure schedules depend upon temperature. The gel time at 300°F is in the order of 20-25 minute. The cure time at 300°F is in the order of 60-80 minutes ant at 350°F in the order of 40-50 minutes.

单组份，导电（银填充），热冲击，耐热和耐化学性环氧粘接树脂体系，灌封，密封和涂层。 硕士邦德聚合物系统EP11SIC是一个新的优势和成本效益的一个组成部分环氧树脂体系具有极高的电气连接，粘接，密封和涂层结合了卓越的热冲击，耐热和耐化学性，包括水和许多高物理强度性能的导电性有机溶剂。 它具有-60 ° F温度范围超过3000 ° F。 粘附到金属和非金属基材是非常好的。 硕士邦德聚合物系统EP11SIC提供了一个组件的超低导电环氧树脂系统，不需要任何治疗，使用前加上灵活的时间表混合，以满足特定应用需求的最佳应用方便。 它是100％反应，不含有任何溶剂或稀释剂。 硕士邦德聚合物系统EP11SIC是提供在一个银色流动性有一个超过4个月以上的贮存稳定性糊状时，在大约75,50 ° F.存放于温度 制冷大大扩展了该环氧树脂体系的贮存稳定性。 凝胶时间和固化时间取决于温度。 在300 ° F凝胶时间是在20-25分钟的顺序。 在300 ° F固化时间是在60-80分钟蚂蚁在350 °在40-50分钟的顺序F秩序。

One component, Electrically Conductive (Silver Filled), Thermal Shock, Heat and Chemically Resistant Epoxy Resin System for Bonding, Potting, Sealing and Coating. Master Bond Polymer System EP11SIC is a new superior and cost effective one component epoxy resin system featuring exceptionally high electrical conductivity for electrical connections, bonding, sealing and coating which combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water and many organic solvents. It has a service temperature range of -60°F to over 3000°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11SIC offers the application convenience of a one component extra low conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP11SIC is supplied in the form of a silver colored flowable paste having a minimum storage stability of more than 4 months when stored at temperatures of around 75,50°F. Refrigeration greatly extends the storage stability of this epoxy resin system. Gel times and cure schedules depend upon temperature. The gel time at 300°F is in the order of 20-25 minute. The cure time at 300°F is in the order of 60-80 minutes ant at 350°F in the order of 40-50 minutes.

单组份，导电（银填充），热冲击，耐热和耐化学性环氧粘接树脂体系，灌封，密封和涂层。 硕士邦德聚合物系统EP11SIC是一个新的优势和成本效益的一个组成部分环氧树脂体系具有极高的电气连接，粘接，密封和涂层结合了卓越的热冲击，耐热和耐化学性，包括水和许多高物理强度性能的导电性有机溶剂。 它具有-60 ° F温度范围超过3000 ° F。 粘附到金属和非金属基材是非常好的。 硕士邦德聚合物系统EP11SIC提供了一个组件的超低导电环氧树脂系统，不需要任何治疗，使用前加上灵活的时间表混合，以满足特定应用需求的最佳应用方便。 它是100％反应，不含有任何溶剂或稀释剂。 硕士邦德聚合物系统EP11SIC是提供在一个银色流动性有一个超过4个月以上的贮存稳定性糊状时，在大约75,50 ° F.存放于温度 制冷大大扩展了该环氧树脂体系的贮存稳定性。 凝胶时间和固化时间取决于温度。 在300 ° F凝胶时间是在20-25分钟的顺序。 在300 ° F固化时间是在60-80分钟蚂蚁在350 °在40-50分钟的顺序F秩序。

One component, Electrically Conductive (Silver Filled), Thermal Shock, Heat and Chemically Resistant Epoxy Resin System for Bonding, Potting, Sealing and Coating. Master Bond Polymer System EP11SIC is a new superior and cost effective one component epoxy resin system featuring exceptionally high electrical conductivity for electrical connections, bonding, sealing and coating which combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water and many organic solvents. It has a service temperature range of -60°F to over 3000°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11SIC offers the application convenience of a one component extra low conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP11SIC is supplied in the form of a silver colored flowable paste having a minimum storage stability of more than 4 months when stored at temperatures of around 75,50°F. Refrigeration greatly extends the storage stability of this epoxy resin system. Gel times and cure schedules depend upon temperature. The gel time at 300°F is in the order of 20-25 minute. The cure time at 300°F is in the order of 60-80 minutes ant at 350°F in the order of 40-50 minutes.