硕士邦德聚合物系统EP121是一个新的优势和成本效益的双组分环氧树脂电器灌封和封装，它结合了高物理强度性能，显着的热冲击和耐热性，惰性水和化学品具有良好的电气绝缘特性的树脂体系。 它的服务，从-60 ° F的温度范围超过250 ° F。 金属和非金属基材的附着力非常出色。 硕士邦德的聚合物系统EP121提供的两个组成部分，加上灵活的固化时间表的应用方便的一个非关键混合比例，以更好地满足特定的加工要求。 硕士邦德聚合物系统EP121提供在两个液体成分超过9个月的最低稳定的形式储存在温度约为75 5 ° F。 它是随时准备为盆栽或通过简单的两部分组成的混合，封装在一个一个非关键的混合比例，重量或体积。 凝胶时间和固化时间表取决于温度。 建议凝胶时间是1至11小时在212-225 ° F。 一个额外的1-2个小时完全固化，可达到加热凝胶EP121环氧树脂体系在250 ° F。 POST在较高温度下固化，如1-3个小时，在300华氏度是可选的，他们的主要好处是增加的热变形温度。

Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical insulation characteristics. It has a service temperature range from -60°F to over 250°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP121 offers the application convenience of a one-to-one non critical mix ratio for the two components plus flexible cure schedules so as to best meet specific processing requirements. Master Bond Polymer System EP121 is supplied in the form of two liquid components each having a minimum stability of more than 9 months when stored at temperatures of around 75+5°F. It is readily prepared for potting or encapsulation by simple mixing of the two components in a one-to-one non critical mix ratio, weight or volume. Gel times and cure schedules depend upon temperature. A recommended gel time is 1 to 11 hours at 212-225°F. Full cure can be achieved by heating the gelled EP121 epoxy resin system for an additional 1-2 hours at 250°F. Post cures at higher temperatures e.g. 1-3 hours at 300°F are optional, their main benefit being an increase in the heat distortion temperature.

硕士邦德聚合物系统EP121是一个新的优势和成本效益的双组分环氧树脂电器灌封和封装，它结合了高物理强度性能，显着的热冲击和耐热性，惰性水和化学品具有良好的电气绝缘特性的树脂体系。 它的服务，从-60 ° F的温度范围超过250 ° F。 金属和非金属基材的附着力非常出色。 硕士邦德的聚合物系统EP121提供的两个组成部分，加上灵活的固化时间表的应用方便的一个非关键混合比例，以更好地满足特定的加工要求。 硕士邦德聚合物系统EP121提供在两个液体成分超过9个月的最低稳定的形式储存在温度约为75 5 ° F。 它是随时准备为盆栽或通过简单的两部分组成的混合，封装在一个一个非关键的混合比例，重量或体积。 凝胶时间和固化时间表取决于温度。 建议凝胶时间是1至11小时在212-225 ° F。 一个额外的1-2个小时完全固化，可达到加热凝胶EP121环氧树脂体系在250 ° F。 POST在较高温度下固化，如1-3个小时，在300华氏度是可选的，他们的主要好处是增加的热变形温度。

Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical insulation characteristics. It has a service temperature range from -60°F to over 250°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP121 offers the application convenience of a one-to-one non critical mix ratio for the two components plus flexible cure schedules so as to best meet specific processing requirements. Master Bond Polymer System EP121 is supplied in the form of two liquid components each having a minimum stability of more than 9 months when stored at temperatures of around 75+5°F. It is readily prepared for potting or encapsulation by simple mixing of the two components in a one-to-one non critical mix ratio, weight or volume. Gel times and cure schedules depend upon temperature. A recommended gel time is 1 to 11 hours at 212-225°F. Full cure can be achieved by heating the gelled EP121 epoxy resin system for an additional 1-2 hours at 250°F. Post cures at higher temperatures e.g. 1-3 hours at 300°F are optional, their main benefit being an increase in the heat distortion temperature.

硕士邦德聚合物系统EP121是一个新的优势和成本效益的双组分环氧树脂电器灌封和封装，它结合了高物理强度性能，显着的热冲击和耐热性，惰性水和化学品具有良好的电气绝缘特性的树脂体系。 它的服务，从-60 ° F的温度范围超过250 ° F。 金属和非金属基材的附着力非常出色。 硕士邦德的聚合物系统EP121提供的两个组成部分，加上灵活的固化时间表的应用方便的一个非关键混合比例，以更好地满足特定的加工要求。 硕士邦德聚合物系统EP121提供在两个液体成分超过9个月的最低稳定的形式储存在温度约为75 5 ° F。 它是随时准备为盆栽或通过简单的两部分组成的混合，封装在一个一个非关键的混合比例，重量或体积。 凝胶时间和固化时间表取决于温度。 建议凝胶时间是1至11小时在212-225 ° F。 一个额外的1-2个小时完全固化，可达到加热凝胶EP121环氧树脂体系在250 ° F。 POST在较高温度下固化，如1-3个小时，在300华氏度是可选的，他们的主要好处是增加的热变形温度。

Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical insulation characteristics. It has a service temperature range from -60°F to over 250°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP121 offers the application convenience of a one-to-one non critical mix ratio for the two components plus flexible cure schedules so as to best meet specific processing requirements. Master Bond Polymer System EP121 is supplied in the form of two liquid components each having a minimum stability of more than 9 months when stored at temperatures of around 75+5°F. It is readily prepared for potting or encapsulation by simple mixing of the two components in a one-to-one non critical mix ratio, weight or volume. Gel times and cure schedules depend upon temperature. A recommended gel time is 1 to 11 hours at 212-225°F. Full cure can be achieved by heating the gelled EP121 epoxy resin system for an additional 1-2 hours at 250°F. Post cures at higher temperatures e.g. 1-3 hours at 300°F are optional, their main benefit being an increase in the heat distortion temperature.