硕士邦德聚合物系统EP11HT是一种单组分，热固化，环氧树脂结构胶粘剂具有高剪切强度，易于处理和耐高温。 这是制定一个组件系统在高温下，如90-120分钟治愈250 ° F或60〜90分钟在300 ° F。 最低固化温度为250 ° F。 EP11HT达到在3300 psi和形式僵化，尺寸稳定的债券，多余的拉伸剪切强度。 使用温度范围为-60 ° F至400 ° F。 作为系统的一部分，它不需要事先混合使用，具有无限的工作在室温下生活。 EP11HT债券以及向承印物种类繁多，包括金属，玻璃，陶瓷和大多数塑料。 它具有优良的耐，包括酸，碱，油，盐和许多溶剂化学品广泛。 非滴版本称为EP11HTND – 2也可提供。 这两种系统是100％反应，不含有任何溶剂或挥发性物质。 标准颜色为棕褐色，但其他颜色可供选择。 固化后的胶粘剂完全符合MIL – MMM – A – 132的要求。

Master Bond Polymer System EP11HT is a one component, heat curing, structural epoxy adhesive featuring high shear strength, easy handling and high temperature resistance. This one component system is formulated to cure at elevated temperatures, e.g. 90-120 minutes at 250°F or 60-90 minutes at 300°F. The minimum cure temperature is 250°F. EP11HT attains tensile shear strengths in excess of 3,300 psi and forms rigid and dimensionally stable bonds. The service temperature range is -60°F to 400°F. As a one part system, it does not require mixing prior to use and has an unlimited working life at room temperature. EP11HT bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics. It has excellent resistance to a wide range of chemicals including acids, bases, oils, salts and many solvents. A non-drip version called EP11HTND-2 is also available. Both systems are 100% reactive and do not contain any solvents or volatiles. The standard color is tan, but other colors are available. The cured adhesive fully meets the requirements of MIL-MMM-A-132.

硕士邦德聚合物系统EP11HT是一种单组分，热固化，环氧树脂结构胶粘剂具有高剪切强度，易于处理和耐高温。 这是制定一个组件系统在高温下，如90-120分钟治愈250 ° F或60〜90分钟在300 ° F。 最低固化温度为250 ° F。 EP11HT达到在3300 psi和形式僵化，尺寸稳定的债券，多余的拉伸剪切强度。 使用温度范围为-60 ° F至400 ° F。 作为系统的一部分，它不需要事先混合使用，具有无限的工作在室温下生活。 EP11HT债券以及向承印物种类繁多，包括金属，玻璃，陶瓷和大多数塑料。 它具有优良的耐，包括酸，碱，油，盐和许多溶剂化学品广泛。 非滴版本称为EP11HTND – 2也可提供。 这两种系统是100％反应，不含有任何溶剂或挥发性物质。 标准颜色为棕褐色，但其他颜色可供选择。 固化后的胶粘剂完全符合MIL – MMM – A – 132的要求。

Master Bond Polymer System EP11HT is a one component, heat curing, structural epoxy adhesive featuring high shear strength, easy handling and high temperature resistance. This one component system is formulated to cure at elevated temperatures, e.g. 90-120 minutes at 250°F or 60-90 minutes at 300°F. The minimum cure temperature is 250°F. EP11HT attains tensile shear strengths in excess of 3,300 psi and forms rigid and dimensionally stable bonds. The service temperature range is -60°F to 400°F. As a one part system, it does not require mixing prior to use and has an unlimited working life at room temperature. EP11HT bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics. It has excellent resistance to a wide range of chemicals including acids, bases, oils, salts and many solvents. A non-drip version called EP11HTND-2 is also available. Both systems are 100% reactive and do not contain any solvents or volatiles. The standard color is tan, but other colors are available. The cured adhesive fully meets the requirements of MIL-MMM-A-132.