硕士邦德聚合物系统EP11C是一个新的优势和成本效益的一个组成部分环氧树脂体系具有高电气，电气接触，粘接，密封和涂层结合了卓越的热冲击，耐热和耐化学性，包括水和高强度的物理性能优于导许多有机溶剂。 它具有-60 ° F温度范围超过300 ° F。 粘附到金属和非金属基材是非常好的。 硕士邦德聚合物系统EP11C提供了一种单组分导电环氧树脂系统，不需要任何外加灵活使用前混合治疗计划，以满足特定应用需求的最佳应用方便。 它是100％反应，不含有任何溶剂或稀释剂。 硕士邦德聚合物系统EP11C是提供在一个具有高粘度超过4个月以上的贮存稳定性糊状时，在大约75 +存放于温度 – 50 ° F。 制冷大大扩展了该环氧树脂体系的贮存稳定性。 凝胶时间和固化时间取决于温度。 在300 ° F凝胶时间是在20-25分钟的顺序。 在300 ° F固化时间在60-80分钟的秩序，在350 °在40-50分钟才能F。

Master Bond Polymer System EP11C is a new superior and cost effective one component epoxy resin system featuring high electrical, superior conductivity for electrical contacts, bonding, sealing and coating which combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water and many organic solvents. It has a service temperature range of -60°F to over 300°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11C offers the application convenience of a one component electrically conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP11C is supplied in the form of a high viscosity paste having a minimum storage stability of more than 4 months when stored at temperatures of around 75 +- 50°F. Refrigeration greatly extends the storage stability of this epoxy resin system. Gel times and cure schedules depend upon temperature. The gel time at 300°F is in the order of 20-25 minutes. The cure time at 300°F is in the order of 60-80 minutes and at 350°F in the order of 40-50 minutes.

硕士邦德聚合物系统EP11C是一个新的优势和成本效益的一个组成部分环氧树脂体系具有高电气，电气接触，粘接，密封和涂层结合了卓越的热冲击，耐热和耐化学性，包括水和高强度的物理性能优于导许多有机溶剂。 它具有-60 ° F温度范围超过300 ° F。 粘附到金属和非金属基材是非常好的。 硕士邦德聚合物系统EP11C提供了一种单组分导电环氧树脂系统，不需要任何外加灵活使用前混合治疗计划，以满足特定应用需求的最佳应用方便。 它是100％反应，不含有任何溶剂或稀释剂。 硕士邦德聚合物系统EP11C是提供在一个具有高粘度超过4个月以上的贮存稳定性糊状时，在大约75 +存放于温度 – 50 ° F。 制冷大大扩展了该环氧树脂体系的贮存稳定性。 凝胶时间和固化时间取决于温度。 在300 ° F凝胶时间是在20-25分钟的顺序。 在300 ° F固化时间在60-80分钟的秩序，在350 °在40-50分钟才能F。

Master Bond Polymer System EP11C is a new superior and cost effective one component epoxy resin system featuring high electrical, superior conductivity for electrical contacts, bonding, sealing and coating which combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water and many organic solvents. It has a service temperature range of -60°F to over 300°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11C offers the application convenience of a one component electrically conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP11C is supplied in the form of a high viscosity paste having a minimum storage stability of more than 4 months when stored at temperatures of around 75 +- 50°F. Refrigeration greatly extends the storage stability of this epoxy resin system. Gel times and cure schedules depend upon temperature. The gel time at 300°F is in the order of 20-25 minutes. The cure time at 300°F is in the order of 60-80 minutes and at 350°F in the order of 40-50 minutes.

硕士邦德聚合物系统EP11C是一个新的优势和成本效益的一个组成部分环氧树脂体系具有高电气，电气接触，粘接，密封和涂层结合了卓越的热冲击，耐热和耐化学性，包括水和高强度的物理性能优于导许多有机溶剂。 它具有-60 ° F温度范围超过300 ° F。 粘附到金属和非金属基材是非常好的。 硕士邦德聚合物系统EP11C提供了一种单组分导电环氧树脂系统，不需要任何外加灵活使用前混合治疗计划，以满足特定应用需求的最佳应用方便。 它是100％反应，不含有任何溶剂或稀释剂。 硕士邦德聚合物系统EP11C是提供在一个具有高粘度超过4个月以上的贮存稳定性糊状时，在大约75 +存放于温度 – 50 ° F。 制冷大大扩展了该环氧树脂体系的贮存稳定性。 凝胶时间和固化时间取决于温度。 在300 ° F凝胶时间是在20-25分钟的顺序。 在300 ° F固化时间在60-80分钟的秩序，在350 °在40-50分钟才能F。

Master Bond Polymer System EP11C is a new superior and cost effective one component epoxy resin system featuring high electrical, superior conductivity for electrical contacts, bonding, sealing and coating which combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water and many organic solvents. It has a service temperature range of -60°F to over 300°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11C offers the application convenience of a one component electrically conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP11C is supplied in the form of a high viscosity paste having a minimum storage stability of more than 4 months when stored at temperatures of around 75 +- 50°F. Refrigeration greatly extends the storage stability of this epoxy resin system. Gel times and cure schedules depend upon temperature. The gel time at 300°F is in the order of 20-25 minutes. The cure time at 300°F is in the order of 60-80 minutes and at 350°F in the order of 40-50 minutes.