硕士邦德聚合物系统EP11S是一个新的优越的性能和成本效益的一个组成部分环氧树脂体系具有优良的电气接触，粘接密封和涂层的导电性和结合了卓越的抗热震性能高物理强度，耐热和耐化学品包括水，燃料和许多有机溶剂。 它具有-60 ° F温度范围超过300 ° F。 粘附到金属和非金属基材是非常好的。 硕士邦德聚合物系统EP11S提供了一种单组分导电环氧树脂系统，不需要任何外加灵活使用前混合治疗计划，以满足特定应用需求的最佳应用方便。 它是100％反应，不含有任何溶剂或稀释剂。 硕士邦德系统EP11S是特殊配方，以尽量减少不良，如水解氯化物离子杂质。

Master Bond Polymer System EP11S is a new superior performance and cost effective one component epoxy resin system featuring excellent electrical conductivity for electrical contacts, bonding sealing and coating and combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water, fuels and many organic solvents. It has a service temperature range of -60°F to over 300°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11S offers the application convenience of a one component electrically conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents. Master Bond System EP11S is specially formulated to minimize objectionable ionic impurities such as hydrolyzable chlorides.

硕士邦德聚合物系统EP11S是一个新的优越的性能和成本效益的一个组成部分环氧树脂体系具有优良的电气接触，粘接密封和涂层的导电性和结合了卓越的抗热震性能高物理强度，耐热和耐化学品包括水，燃料和许多有机溶剂。 它具有-60 ° F温度范围超过300 ° F。 粘附到金属和非金属基材是非常好的。 硕士邦德聚合物系统EP11S提供了一种单组分导电环氧树脂系统，不需要任何外加灵活使用前混合治疗计划，以满足特定应用需求的最佳应用方便。 它是100％反应，不含有任何溶剂或稀释剂。 硕士邦德系统EP11S是特殊配方，以尽量减少不良，如水解氯化物离子杂质。

Master Bond Polymer System EP11S is a new superior performance and cost effective one component epoxy resin system featuring excellent electrical conductivity for electrical contacts, bonding sealing and coating and combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water, fuels and many organic solvents. It has a service temperature range of -60°F to over 300°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11S offers the application convenience of a one component electrically conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents. Master Bond System EP11S is specially formulated to minimize objectionable ionic impurities such as hydrolyzable chlorides.