硕士邦德聚合物系统EP21SC是双组份环氧树脂含有碳化硅高性能耐磨，坚韧涂层，衬垫和胶粘剂/配方，固化在室温下或在高温下更迅速密封剂复合树脂，具有方便，非关键的一年对一的比例混合，重量或体积。 它是100％反应，不含有任何溶剂或最小的收缩稀释剂和固化。 硕士邦德聚合物系统EP21SC容易开发超过3000 psi到室温金属和许多非金属基材粘接强度高。 硕士邦德聚合物体系EP21 SC产生非常耐磨，坚韧，高强度涂​​层，衬垫和胶粘剂/密封胶是显着的抗热循环和包括水，油，液压油，盐溶液，并在广泛的温度范围内大多数有机溶剂的化学品为-60 ° F至250 ° F.以上 粘附于金属，玻璃，陶瓷，水泥，木材，橡胶硫化和许多塑料是非常好的。 硬化环氧树脂复合展品出奇良好的导热性比其他各种环氧树脂系统，是电绝缘体。 热膨胀系数是刻意低。 A部分颜色灰色，B部分晒黑。 硕士邦德聚合物系统EP21SC被广泛用于建筑，维修，化工工艺，金属加工，电器和电气/电子在耐用高性能，坚韧耐磨涂层，衬垫和胶粘剂/密封剂需行业。

Master Bond Polymer System EP21SC is a two component silicon carbide containing epoxy resin compound for high performance abrasion resistant, tough coatings, liners and adhesive/sealants formulated to cure at room temperature or more rapidly at elevated temperatures, with a convenient, non-critical one-to-one mix ratio, weight or volume. It is 100% reactive, does not contain any solvents or diluents and cures with minimal shrinkage. Master Bond Polymer System EP21SC readily develops a high bonding strength of more than 3000 psi at room temperature to both metallic and many non-metallic substrates. Master Bond Polymer System EP21 SC produces exceptionally abrasion resistant, tough and high strength coatings, liners and adhesive/sealants which are remarkably resistant to thermal cycling and chemicals including water, oils, hydraulic fluids, salt solutions and most organic solvents over the wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, cements, wood, vulcanized rubbers and many plastics is excellent. The hardened epoxy resin compound exhibits surprisingly good thermal conductivity compared to various other epoxy resin systems and is an electrical insulator. The thermal expansion coefficient is desirably low. Color of part A gray, part B tan. Master Bond Polymer System EP21SC is widely used in the construction, maintenance and repair, chemical process, metalworking, appliance and electrical/electronic industries where durable high performance, abrasion resistant tough coatings, liners and adhesive/sealants are required.

硕士邦德聚合物系统EP21SC是双组份环氧树脂含有碳化硅高性能耐磨，坚韧涂层，衬垫和胶粘剂/配方，固化在室温下或在高温下更迅速密封剂复合树脂，具有方便，非关键的一年对一的比例混合，重量或体积。 它是100％反应，不含有任何溶剂或最小的收缩稀释剂和固化。 硕士邦德聚合物系统EP21SC容易开发超过3000 psi到室温金属和许多非金属基材粘接强度高。 硕士邦德聚合物体系EP21 SC产生非常耐磨，坚韧，高强度涂​​层，衬垫和胶粘剂/密封胶是显着的抗热循环和包括水，油，液压油，盐溶液，并在广泛的温度范围内大多数有机溶剂的化学品为-60 ° F至250 ° F.以上 粘附于金属，玻璃，陶瓷，水泥，木材，橡胶硫化和许多塑料是非常好的。 硬化环氧树脂复合展品出奇良好的导热性比其他各种环氧树脂系统，是电绝缘体。 热膨胀系数是刻意低。 A部分颜色灰色，B部分晒黑。 硕士邦德聚合物系统EP21SC被广泛用于建筑，维修，化工工艺，金属加工，电器和电气/电子在耐用高性能，坚韧耐磨涂层，衬垫和胶粘剂/密封剂需行业。

Master Bond Polymer System EP21SC is a two component silicon carbide containing epoxy resin compound for high performance abrasion resistant, tough coatings, liners and adhesive/sealants formulated to cure at room temperature or more rapidly at elevated temperatures, with a convenient, non-critical one-to-one mix ratio, weight or volume. It is 100% reactive, does not contain any solvents or diluents and cures with minimal shrinkage. Master Bond Polymer System EP21SC readily develops a high bonding strength of more than 3000 psi at room temperature to both metallic and many non-metallic substrates. Master Bond Polymer System EP21 SC produces exceptionally abrasion resistant, tough and high strength coatings, liners and adhesive/sealants which are remarkably resistant to thermal cycling and chemicals including water, oils, hydraulic fluids, salt solutions and most organic solvents over the wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, cements, wood, vulcanized rubbers and many plastics is excellent. The hardened epoxy resin compound exhibits surprisingly good thermal conductivity compared to various other epoxy resin systems and is an electrical insulator. The thermal expansion coefficient is desirably low. Color of part A gray, part B tan. Master Bond Polymer System EP21SC is widely used in the construction, maintenance and repair, chemical process, metalworking, appliance and electrical/electronic industries where durable high performance, abrasion resistant tough coatings, liners and adhesive/sealants are required.

硕士邦德聚合物系统EP21SC是双组份环氧树脂含有碳化硅高性能耐磨，坚韧涂层，衬垫和胶粘剂/配方，固化在室温下或在高温下更迅速密封剂复合树脂，具有方便，非关键的一年对一的比例混合，重量或体积。 它是100％反应，不含有任何溶剂或最小的收缩稀释剂和固化。 硕士邦德聚合物系统EP21SC容易开发超过3000 psi到室温金属和许多非金属基材粘接强度高。 硕士邦德聚合物体系EP21 SC产生非常耐磨，坚韧，高强度涂​​层，衬垫和胶粘剂/密封胶是显着的抗热循环和包括水，油，液压油，盐溶液，并在广泛的温度范围内大多数有机溶剂的化学品为-60 ° F至250 ° F.以上 粘附于金属，玻璃，陶瓷，水泥，木材，橡胶硫化和许多塑料是非常好的。 硬化环氧树脂复合展品出奇良好的导热性比其他各种环氧树脂系统，是电绝缘体。 热膨胀系数是刻意低。 A部分颜色灰色，B部分晒黑。 硕士邦德聚合物系统EP21SC被广泛用于建筑，维修，化工工艺，金属加工，电器和电气/电子在耐用高性能，坚韧耐磨涂层，衬垫和胶粘剂/密封剂需行业。

Master Bond Polymer System EP21SC is a two component silicon carbide containing epoxy resin compound for high performance abrasion resistant, tough coatings, liners and adhesive/sealants formulated to cure at room temperature or more rapidly at elevated temperatures, with a convenient, non-critical one-to-one mix ratio, weight or volume. It is 100% reactive, does not contain any solvents or diluents and cures with minimal shrinkage. Master Bond Polymer System EP21SC readily develops a high bonding strength of more than 3000 psi at room temperature to both metallic and many non-metallic substrates. Master Bond Polymer System EP21 SC produces exceptionally abrasion resistant, tough and high strength coatings, liners and adhesive/sealants which are remarkably resistant to thermal cycling and chemicals including water, oils, hydraulic fluids, salt solutions and most organic solvents over the wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, cements, wood, vulcanized rubbers and many plastics is excellent. The hardened epoxy resin compound exhibits surprisingly good thermal conductivity compared to various other epoxy resin systems and is an electrical insulator. The thermal expansion coefficient is desirably low. Color of part A gray, part B tan. Master Bond Polymer System EP21SC is widely used in the construction, maintenance and repair, chemical process, metalworking, appliance and electrical/electronic industries where durable high performance, abrasion resistant tough coatings, liners and adhesive/sealants are required.