硕士邦德聚合物系统EP21ND是一种双组分，室温固化环氧胶粘剂具有出色的物理性能，非常宽容的1比1的重量或体积和特殊的应用功能无滴混合比例。 EP21ND具有能够调节通过改变混合比例的固化体系的性能不同寻常的特性。 添加更多的一个组成部分（如2:1的比例混合）将给予更为严格的治疗，同时增加更多的B部分（如1:2比例混合）给出了一个更加宽容的治疗。 EP21ND可应用于无下垂或垂直的表面上，甚至滴水。 EP21ND生产高强度，保持良好的热循环和抵制包括水，油，燃料，酸，碱和盐的许多化学品耐用债券。 这是维修过的宽温度范围为-60 ° F至+250 ° F。 它的债券以及以各种基材包括金属，玻璃，陶瓷，木材，橡胶和多种塑料。 一旦治愈，EP21ND是一个优良的电绝缘体。 这种异常灵活的系统，广泛应用于电子，电气，计算机，金属加工，家电，汽车，化工和OEM行业。 虽然固化材料标准颜色是灰色的，一个额外的颜色选择范围非常广泛，也可提供。 一个特殊版本，称为EP21ND – 4也可用于维护其无滴性能，即使增加热量，加速治愈。

Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume and a special no drip application feature. EP21ND has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more A part (e.g. 2:1 mix ratio) will give a more rigid cure while adding more B part (e.g. 1:2 mix ratio) gives a more forgiving cure. EP21ND can be applied without sagging or dripping even on vertical surfaces. EP21ND produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -60°F to +250°F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubber and many plastics. Once cured, EP21ND is an excellent electrical insulator. This exceptionally versatile system is widely used in the electronic, electrical, computer, metalworking, appliance, automotive, chemical and OEM industries. While the standard color of the cured material is gray, a wide variety of additional color choices are also available. A special version called EP21ND-4 is also available that maintains its no drip properties even if heat is added to accelerate the cure.

硕士邦德聚合物系统EP21ND是一种双组分，室温固化环氧胶粘剂具有出色的物理性能，非常宽容的1比1的重量或体积和特殊的应用功能无滴混合比例。 EP21ND具有能够调节通过改变混合比例的固化体系的性能不同寻常的特性。 添加更多的一个组成部分（如2:1的比例混合）将给予更为严格的治疗，同时增加更多的B部分（如1:2比例混合）给出了一个更加宽容的治疗。 EP21ND可应用于无下垂或垂直的表面上，甚至滴水。 EP21ND生产高强度，保持良好的热循环和抵制包括水，油，燃料，酸，碱和盐的许多化学品耐用债券。 这是维修过的宽温度范围为-60 ° F至+250 ° F。 它的债券以及以各种基材包括金属，玻璃，陶瓷，木材，橡胶和多种塑料。 一旦治愈，EP21ND是一个优良的电绝缘体。 这种异常灵活的系统，广泛应用于电子，电气，计算机，金属加工，家电，汽车，化工和OEM行业。 虽然固化材料标准颜色是灰色的，一个额外的颜色选择范围非常广泛，也可提供。 一个特殊版本，称为EP21ND – 4也可用于维护其无滴性能，即使增加热量，加速治愈。

Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume and a special no drip application feature. EP21ND has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more A part (e.g. 2:1 mix ratio) will give a more rigid cure while adding more B part (e.g. 1:2 mix ratio) gives a more forgiving cure. EP21ND can be applied without sagging or dripping even on vertical surfaces. EP21ND produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -60°F to +250°F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubber and many plastics. Once cured, EP21ND is an excellent electrical insulator. This exceptionally versatile system is widely used in the electronic, electrical, computer, metalworking, appliance, automotive, chemical and OEM industries. While the standard color of the cured material is gray, a wide variety of additional color choices are also available. A special version called EP21ND-4 is also available that maintains its no drip properties even if heat is added to accelerate the cure.

硕士邦德聚合物系统EP21ND是一种双组分，室温固化环氧胶粘剂具有出色的物理性能，非常宽容的1比1的重量或体积和特殊的应用功能无滴混合比例。 EP21ND具有能够调节通过改变混合比例的固化体系的性能不同寻常的特性。 添加更多的一个组成部分（如2:1的比例混合）将给予更为严格的治疗，同时增加更多的B部分（如1:2比例混合）给出了一个更加宽容的治疗。 EP21ND可应用于无下垂或垂直的表面上，甚至滴水。 EP21ND生产高强度，保持良好的热循环和抵制包括水，油，燃料，酸，碱和盐的许多化学品耐用债券。 这是维修过的宽温度范围为-60 ° F至+250 ° F。 它的债券以及以各种基材包括金属，玻璃，陶瓷，木材，橡胶和多种塑料。 一旦治愈，EP21ND是一个优良的电绝缘体。 这种异常灵活的系统，广泛应用于电子，电气，计算机，金属加工，家电，汽车，化工和OEM行业。 虽然固化材料标准颜色是灰色的，一个额外的颜色选择范围非常广泛，也可提供。 一个特殊版本，称为EP21ND – 4也可用于维护其无滴性能，即使增加热量，加速治愈。

Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume and a special no drip application feature. EP21ND has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more A part (e.g. 2:1 mix ratio) will give a more rigid cure while adding more B part (e.g. 1:2 mix ratio) gives a more forgiving cure. EP21ND can be applied without sagging or dripping even on vertical surfaces. EP21ND produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -60°F to +250°F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubber and many plastics. Once cured, EP21ND is an excellent electrical insulator. This exceptionally versatile system is widely used in the electronic, electrical, computer, metalworking, appliance, automotive, chemical and OEM industries. While the standard color of the cured material is gray, a wide variety of additional color choices are also available. A special version called EP21ND-4 is also available that maintains its no drip properties even if heat is added to accelerate the cure.