EP21ND-2

硕士邦德高分子胶粘剂EP21ND – 2是一种双组份通用粘接，制定了在室温下固化，或在高温下更迅速环氧密封胶，以一比一的比例混合，重量或体积。 它易于开发超过3000磅室温粘接强度高。 硕士邦德高分子胶粘剂EP21ND – 2可应用于无下垂或垂直的表面上，甚至滴水。 它产生持久的高强度的，哪些是显着的抗热循环和包括水，油和多种有机溶剂的化学品强硬债券，在-60 ° F宽的温度范围超过250 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 固化后的环氧树脂是电绝缘体，具有良好的电介质。 A部分颜色灰色，B部分琥珀。 硕士邦德EP21ND – 2胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车和化工等行业。 固化后的胶粘剂充分满足了MIL – A – 81236要求（OS），MMM – A – 134型1。

Master Bond Polymer Adhesive EP21ND-2 is a two component epoxy adhesive for general purpose bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature. Master Bond Polymer Adhesive EP21ND-2 can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and many organic solvents, over the wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured epoxy is an electrical insulator, with good dielectrics. Color of part A gray, part B amber. Master Bond EP21ND-2 adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. The cured adhesive fully meets the requirements of MIL-A-81236 (OS), MMM-A-134 Type 1.