硕士邦德高分子胶粘剂EP30HT是一种中等粘度,双组分的通用配方,固化在室温下或在高温下更迅速地粘接环氧树脂粘合剂,具有四(4)一(1)按重量比例混合。 这种粘合剂是100%反应,不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和保税组件必须具有优异的尺寸稳定性。 固化后收缩率是非常低0.0003英寸/英寸 EP30HT结合了精湛的光学清晰度耐高温。 EP30HT – LO版本完全满足NASA除气测试。 该EP30HT符合第21,美国联邦法规,FDA第1章,第175.105和175.300食品应用。 硕士邦德高分子胶粘剂EP30HT生产高强度,在-60 ° F极宽的温度范围是非常耐包括水,油和有机溶剂的化学品最严格的债券,超过400 ° F。 附着力既相似,不同的材料,包括金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 部分颜色A是明确的,清晰的B部分。 硕士邦德高分子胶粘剂EP30HT广泛应用于电子,电气,计算机,光学,光纤,医疗,汽车,化工等行业。
Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Shrinkage after cure is exceptionally low-0.0003 inches/in. EP30HT combines high temperature resistance with superb optical clarity. EP30HT-LO version fully meets NASA outgassing test. The EP30HT Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 & 175.300 for Food Applications. Master Bond Polymer Adhesive EP30HT produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 400°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer Adhesive EP30HT is widely used in the electronic, electrical, computer, optical, fiber optic, medical, automotive and chemical industries.
| Cure / Technology | Thermoplastic; Two Component ; Room Temperature Vulcanizing or Curing |
| Type / Form | Liquid |
| Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
| Composition & Features | |
| Features | High Dielectric |
| Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Optical; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working |
EP21AR,硕士邦德公司,热熔胶,EP21AR, Master Bond, Inc., Hot Melt Adhesives
EP21AR
硕士邦德高分子胶粘剂EP30HT是一种中等粘度,双组分的通用配方,固化在室温下或在高温下更迅速地粘接环氧树脂粘合剂,具有四(4)一(1)按重量比例混合。 这种粘合剂是100%反应,不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和保税组件必须具有优异的尺寸稳定性。 固化后收缩率是非常低0.0003英寸/英寸 EP30HT结合了精湛的光学清晰度耐高温。 EP30HT – LO版本完全满足NASA除气测试。 该EP30HT符合第21,美国联邦法规,FDA第1章,第175.105和175.300食品应用。 硕士邦德高分子胶粘剂EP30HT生产高强度,在-60 ° F极宽的温度范围是非常耐包括水,油和有机溶剂的化学品最严格的债券,超过400 ° F。 附着力既相似,不同的材料,包括金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 部分颜色A是明确的,清晰的B部分。 硕士邦德高分子胶粘剂EP30HT广泛应用于电子,电气,计算机,光学,光纤,医疗,汽车,化工等行业。
Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Shrinkage after cure is exceptionally low-0.0003 inches/in. EP30HT combines high temperature resistance with superb optical clarity. EP30HT-LO version fully meets NASA outgassing test. The EP30HT Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 & 175.300 for Food Applications. Master Bond Polymer Adhesive EP30HT produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 400°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer Adhesive EP30HT is widely used in the electronic, electrical, computer, optical, fiber optic, medical, automotive and chemical industries.
| Cure / Technology | Thermoplastic; Two Component ; Room Temperature Vulcanizing or Curing |
| Type / Form | Liquid |
| Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
| Composition & Features | |
| Features | High Dielectric |
| Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Optical; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working |
EP21AR,硕士邦德公司,热熔胶,EP21AR, Master Bond, Inc., Hot Melt Adhesives
EP21AR
硕士邦德高分子胶粘剂EP30HT是一种中等粘度,双组分的通用配方,固化在室温下或在高温下更迅速地粘接环氧树脂粘合剂,具有四(4)一(1)按重量比例混合。 这种粘合剂是100%反应,不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和保税组件必须具有优异的尺寸稳定性。 固化后收缩率是非常低0.0003英寸/英寸 EP30HT结合了精湛的光学清晰度耐高温。 EP30HT – LO版本完全满足NASA除气测试。 该EP30HT符合第21,美国联邦法规,FDA第1章,第175.105和175.300食品应用。 硕士邦德高分子胶粘剂EP30HT生产高强度,在-60 ° F极宽的温度范围是非常耐包括水,油和有机溶剂的化学品最严格的债券,超过400 ° F。 附着力既相似,不同的材料,包括金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 部分颜色A是明确的,清晰的B部分。 硕士邦德高分子胶粘剂EP30HT广泛应用于电子,电气,计算机,光学,光纤,医疗,汽车,化工等行业。
Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Shrinkage after cure is exceptionally low-0.0003 inches/in. EP30HT combines high temperature resistance with superb optical clarity. EP30HT-LO version fully meets NASA outgassing test. The EP30HT Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 & 175.300 for Food Applications. Master Bond Polymer Adhesive EP30HT produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 400°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer Adhesive EP30HT is widely used in the electronic, electrical, computer, optical, fiber optic, medical, automotive and chemical industries.
| Cure / Technology | Thermoplastic; Two Component ; Room Temperature Vulcanizing or Curing |
| Type / Form | Liquid |
| Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
| Composition & Features | |
| Features | High Dielectric |
| Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Optical; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working |
EP21AR,硕士邦德公司,热熔胶,EP21AR, Master Bond, Inc., Hot Melt Adhesives