硕士邦德聚合物体系EP30 – T是一种低粘度，通用双组份粘接，涂装环氧粘合剂，密封和铸造配方，在室温下固化或与四（4）一（1）混合高温下更迅速按重量比例。 这种粘合剂是100％反应，不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和保税组件必须具有优异的尺寸稳定性。 治愈后线性收缩率是非常低0.0003英寸/英寸 更低粘度版本，称为EP30 – TLV也可用。 硕士邦德聚合物体系EP30 – T生产高强度，这是非常包括水，油和有机溶剂的耐化学品最严格的债券，以及冷杀菌剂，ETO和伽玛辐射。 附着力既相似，不同的材料，包括金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 该部分的颜色一个是明确和清晰的B部分。 硕士邦德聚合物体系EP30 – T被广泛应用于电子，电气，计算机，光学，金属加工，家电，汽车，化工等行业。

Master Bond Polymer System EP30-T is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is an exceptionally low 0.0003 inches/in. An even lower viscosity version called EP30-TLV is also available. Master Bond Polymer System EP30-T produces high strength, rigid bonds which are remarkably resistant chemicals including water, oil and most organic solvents, as well as cold sterilants, ETO and gamma radiation. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. The color of part A is clear and part B clear. Master Bond Polymer System EP30-T is widely used in electronic, electrical, computer, optical, metalworking, appliance, automotive and chemical industries.

硕士邦德聚合物体系EP30 – T是一种低粘度，通用双组份粘接，涂装环氧粘合剂，密封和铸造配方，在室温下固化或与四（4）一（1）混合高温下更迅速按重量比例。 这种粘合剂是100％反应，不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和保税组件必须具有优异的尺寸稳定性。 治愈后线性收缩率是非常低0.0003英寸/英寸 更低粘度版本，称为EP30 – TLV也可用。 硕士邦德聚合物体系EP30 – T生产高强度，这是非常包括水，油和有机溶剂的耐化学品最严格的债券，以及冷杀菌剂，ETO和伽玛辐射。 附着力既相似，不同的材料，包括金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 该部分的颜色一个是明确和清晰的B部分。 硕士邦德聚合物体系EP30 – T被广泛应用于电子，电气，计算机，光学，金属加工，家电，汽车，化工等行业。

Master Bond Polymer System EP30-T is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is an exceptionally low 0.0003 inches/in. An even lower viscosity version called EP30-TLV is also available. Master Bond Polymer System EP30-T produces high strength, rigid bonds which are remarkably resistant chemicals including water, oil and most organic solvents, as well as cold sterilants, ETO and gamma radiation. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. The color of part A is clear and part B clear. Master Bond Polymer System EP30-T is widely used in electronic, electrical, computer, optical, metalworking, appliance, automotive and chemical industries.

硕士邦德聚合物体系EP30 – T是一种低粘度，通用双组份粘接，涂装环氧粘合剂，密封和铸造配方，在室温下固化或与四（4）一（1）混合高温下更迅速按重量比例。 这种粘合剂是100％反应，不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和保税组件必须具有优异的尺寸稳定性。 治愈后线性收缩率是非常低0.0003英寸/英寸 更低粘度版本，称为EP30 – TLV也可用。 硕士邦德聚合物体系EP30 – T生产高强度，这是非常包括水，油和有机溶剂的耐化学品最严格的债券，以及冷杀菌剂，ETO和伽玛辐射。 附着力既相似，不同的材料，包括金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 该部分的颜色一个是明确和清晰的B部分。 硕士邦德聚合物体系EP30 – T被广泛应用于电子，电气，计算机，光学，金属加工，家电，汽车，化工等行业。

Master Bond Polymer System EP30-T is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is an exceptionally low 0.0003 inches/in. An even lower viscosity version called EP30-TLV is also available. Master Bond Polymer System EP30-T produces high strength, rigid bonds which are remarkably resistant chemicals including water, oil and most organic solvents, as well as cold sterilants, ETO and gamma radiation. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. The color of part A is clear and part B clear. Master Bond Polymer System EP30-T is widely used in electronic, electrical, computer, optical, metalworking, appliance, automotive and chemical industries.