EP121, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds
Substrate Compatibility: ; Chemical System: Epoxy ; Type / Form: ; Composition: Unfilled ; Cure / Technology: Thermoset; Two Component ; Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Adhesive ; Industry: Electronics; Electric Power ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity (cP): ; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity (W/m-K): ; CTE (µin/in-F): ; Mechanical: ; Tensile (Break): 10600 psi; Elongation: 3.0 %; Electrical & Optical: ; Dielectric Strength (kV/in): ; Dielectric Constant: 3.38 to 3.42 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Notes: Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin…
EP121专业,硕士邦德公司,粘合剂,密封剂和化合物,EP121, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds

EP121, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds
Substrate Compatibility: ; Chemical System: Epoxy ; Type / Form: ; Composition: Unfilled ; Cure / Technology: Thermoset; Two Component ; Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Adhesive ; Industry: Electronics; Electric Power ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity (cP): ; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity (W/m-K): ; CTE (µin/in-F): ; Mechanical: ; Tensile (Break): 10600 psi; Elongation: 3.0 %; Electrical & Optical: ; Dielectric Strength (kV/in): ; Dielectric Constant: 3.38 to 3.42 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Notes: Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin…
EP121专业,硕士邦德公司,粘合剂,密封剂和化合物,EP121, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds

EP121, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds
Substrate Compatibility: ; Chemical System: Epoxy ; Type / Form: ; Composition: Unfilled ; Cure / Technology: Thermoset; Two Component ; Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Adhesive ; Industry: Electronics; Electric Power ; Material Properties (Nominal / Typical): ; Process & Physical: ; Viscosity (cP): ; Gap Fill (inch): ; Thermal: ; Use Temperature: -60 to 250 F; Thermal Conductivity (W/m-K): ; CTE (µin/in-F): ; Mechanical: ; Tensile (Break): 10600 psi; Elongation: 3.0 %; Electrical & Optical: ; Dielectric Strength (kV/in): ; Dielectric Constant: 3.38 to 3.42 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Notes: Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin…
EP121专业,硕士邦德公司,粘合剂,密封剂和化合物,EP121, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds