硕士邦德聚合物系统EP121 – 1是一种双组分高性能环氧树脂复合自我加冕（水珠顶）等半导体封装材料应用特殊配方。 它具有卓越的抗热冲击，防潮，高基质附着力和优良的电绝缘特性。 硕士邦德聚合物系统EP121 – 1很容易准备使用混合在方便，非关键一对一的比例混合这两种成分，并很容易在与各种基材粘接性能优异应用。 治疗可以达到的加热时间表的数目，以最好地满足特定的加工要求。 一个典型的建议具有快速凝胶固化时间为4小时，302 ° F（150 ° C）。 另一种固化时间为2 ° F在275小时由3小时随后在320 ° F。 固化后的主键聚合物系统EP121 – 1可以在非常宽的温度范围-67使用° F（-55 ° C）到+302 ° F（150 ° C）。 对于自我加冕（水珠顶）应用在印刷电路板，电路板预热的温度范围为212 ° F（100 ° C）到302 ° F（150 ° C），建议获得最佳效果。 而相对于水珠的直径高度依赖于作为水珠和电路板的预热温度，提高质量等变量与板预热温度显着。

Master Bond Polymer System EP121-1 is a two component high performance epoxy resin compound specially formulated for self crowning (glob-top) and other semiconductor encapsulant applications. It features remarkable resistance to thermal shock and moisture, high substrate adhesion and excellent electrical insulation characteristics. Master Bond Polymer System EP121-1 is readily prepared for use by mixing the two components in a convenient, non-critical one-to-one mix ratio and is readily applied on a variety of substrates with excellent adhesive properties. Cure can be achieved with a number of heating schedules so as to best meet specific processing requirements. A typical recommended cure schedule with fast gelation is 4 hours at 302°F (150°C). An alternate cure schedule is 2 hours at 275°F followed by 3 hours at 320°F. The cured Master Bond Polymer System EP121-1 can be used over the remarkably wide temperature range of -67°F (-55°C) to +302°F (+150°C). For self crowning (glob-top) applications on printed circuit board, preheating of the boards to temperatures in the range of 212°F (100°C) to 302°F (150°C) is recommended to obtain best results. The height of the glob in relation to the diameter depends on such variables as the mass of the glob and the circuit board preheat temperature and increases significantly with the board preheat temperature.

硕士邦德聚合物系统EP121 – 1是一种双组分高性能环氧树脂复合自我加冕（水珠顶）等半导体封装材料应用特殊配方。 它具有卓越的抗热冲击，防潮，高基质附着力和优良的电绝缘特性。 硕士邦德聚合物系统EP121 – 1很容易准备使用混合在方便，非关键一对一的比例混合这两种成分，并很容易在与各种基材粘接性能优异应用。 治疗可以达到的加热时间表的数目，以最好地满足特定的加工要求。 一个典型的建议具有快速凝胶固化时间为4小时，302 ° F（150 ° C）。 另一种固化时间为2 ° F在275小时由3小时随后在320 ° F。 固化后的主键聚合物系统EP121 – 1可以在非常宽的温度范围-67使用° F（-55 ° C）到+302 ° F（150 ° C）。 对于自我加冕（水珠顶）应用在印刷电路板，电路板预热的温度范围为212 ° F（100 ° C）到302 ° F（150 ° C），建议获得最佳效果。 而相对于水珠的直径高度依赖于作为水珠和电路板的预热温度，提高质量等变量与板预热温度显着。

Master Bond Polymer System EP121-1 is a two component high performance epoxy resin compound specially formulated for self crowning (glob-top) and other semiconductor encapsulant applications. It features remarkable resistance to thermal shock and moisture, high substrate adhesion and excellent electrical insulation characteristics. Master Bond Polymer System EP121-1 is readily prepared for use by mixing the two components in a convenient, non-critical one-to-one mix ratio and is readily applied on a variety of substrates with excellent adhesive properties. Cure can be achieved with a number of heating schedules so as to best meet specific processing requirements. A typical recommended cure schedule with fast gelation is 4 hours at 302°F (150°C). An alternate cure schedule is 2 hours at 275°F followed by 3 hours at 320°F. The cured Master Bond Polymer System EP121-1 can be used over the remarkably wide temperature range of -67°F (-55°C) to +302°F (+150°C). For self crowning (glob-top) applications on printed circuit board, preheating of the boards to temperatures in the range of 212°F (100°C) to 302°F (150°C) is recommended to obtain best results. The height of the glob in relation to the diameter depends on such variables as the mass of the glob and the circuit board preheat temperature and increases significantly with the board preheat temperature.

硕士邦德聚合物系统EP121 – 1是一种双组分高性能环氧树脂复合自我加冕（水珠顶）等半导体封装材料应用特殊配方。 它具有卓越的抗热冲击，防潮，高基质附着力和优良的电绝缘特性。 硕士邦德聚合物系统EP121 – 1很容易准备使用混合在方便，非关键一对一的比例混合这两种成分，并很容易在与各种基材粘接性能优异应用。 治疗可以达到的加热时间表的数目，以最好地满足特定的加工要求。 一个典型的建议具有快速凝胶固化时间为4小时，302 ° F（150 ° C）。 另一种固化时间为2 ° F在275小时由3小时随后在320 ° F。 固化后的主键聚合物系统EP121 – 1可以在非常宽的温度范围-67使用° F（-55 ° C）到+302 ° F（150 ° C）。 对于自我加冕（水珠顶）应用在印刷电路板，电路板预热的温度范围为212 ° F（100 ° C）到302 ° F（150 ° C），建议获得最佳效果。 而相对于水珠的直径高度依赖于作为水珠和电路板的预热温度，提高质量等变量与板预热温度显着。

Master Bond Polymer System EP121-1 is a two component high performance epoxy resin compound specially formulated for self crowning (glob-top) and other semiconductor encapsulant applications. It features remarkable resistance to thermal shock and moisture, high substrate adhesion and excellent electrical insulation characteristics. Master Bond Polymer System EP121-1 is readily prepared for use by mixing the two components in a convenient, non-critical one-to-one mix ratio and is readily applied on a variety of substrates with excellent adhesive properties. Cure can be achieved with a number of heating schedules so as to best meet specific processing requirements. A typical recommended cure schedule with fast gelation is 4 hours at 302°F (150°C). An alternate cure schedule is 2 hours at 275°F followed by 3 hours at 320°F. The cured Master Bond Polymer System EP121-1 can be used over the remarkably wide temperature range of -67°F (-55°C) to +302°F (+150°C). For self crowning (glob-top) applications on printed circuit board, preheating of the boards to temperatures in the range of 212°F (100°C) to 302°F (150°C) is recommended to obtain best results. The height of the glob in relation to the diameter depends on such variables as the mass of the glob and the circuit board preheat temperature and increases significantly with the board preheat temperature.