EP120SP

EP120SP Master Bond, Inc.

硕士邦德的聚合物系统EP120SP是一个高性能耐凝胶大衣ancl纤维缠绕结构的防护涂料为双组分环氧/酸酐体系。 它是100%反应,不包含​​任何溶剂或稀释剂。 硕士邦德聚合物系统EP120SP,可以很容易地胶凝在低温度为100-120 ° C。 完全固化,温度在125 ° C至150 ° C范围内。 固化后的聚合物具有优良的物理强度性能,并有热distortlon温度约137 ° C。 硕士邦德EP120SP是提供在每两个有一个最低的六(6)个月稳定的液体成分的形式储存在温度约为25 ± 5 ° C。

Master Bond Polymer System EP120SP is a two-component epoxy/anhydride system for high performance resistant gel coats ancl protective coatings for filament wound structures. It is, 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP120SP can be readily gelled at temperatures as low as 100-120°C. Full cure is obtained at temperatures in the 125°C to 150°C range. The cured polymer features superior physical strength properties and has a heat distortlon temperature of around 137°C. Master Bond EP120SP is supplied in the form of two liquid components each having a minimum stability of six (6) months when stored at temperatures of around 25±5°C.

技术参数/Specifications

Chemical System Epoxy
Cure / Technology Thermoset; Two Component  
Features Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Industry Electronics; Electric Power

EP120SP,硕士邦德公司,特种胶粘剂,密封剂和化合物,EP120SP, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds

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EP120SP

EP120SP Master Bond, Inc.

硕士邦德的聚合物系统EP120SP是一个高性能耐凝胶大衣ancl纤维缠绕结构的防护涂料为双组分环氧/酸酐体系。 它是100%反应,不包含​​任何溶剂或稀释剂。 硕士邦德聚合物系统EP120SP,可以很容易地胶凝在低温度为100-120 ° C。 完全固化,温度在125 ° C至150 ° C范围内。 固化后的聚合物具有优良的物理强度性能,并有热distortlon温度约137 ° C。 硕士邦德EP120SP是提供在每两个有一个最低的六(6)个月稳定的液体成分的形式储存在温度约为25 ± 5 ° C。

Master Bond Polymer System EP120SP is a two-component epoxy/anhydride system for high performance resistant gel coats ancl protective coatings for filament wound structures. It is, 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP120SP can be readily gelled at temperatures as low as 100-120°C. Full cure is obtained at temperatures in the 125°C to 150°C range. The cured polymer features superior physical strength properties and has a heat distortlon temperature of around 137°C. Master Bond EP120SP is supplied in the form of two liquid components each having a minimum stability of six (6) months when stored at temperatures of around 25±5°C.

技术参数/Specifications

Chemical System Epoxy
Cure / Technology Thermoset; Two Component  
Features Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Industry Electronics; Electric Power

EP120SP,硕士邦德公司,特种胶粘剂,密封剂和化合物,EP120SP, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds

Related posts

EP120SP

EP120SP Master Bond, Inc.

硕士邦德的聚合物系统EP120SP是一个高性能耐凝胶大衣ancl纤维缠绕结构的防护涂料为双组分环氧/酸酐体系。 它是100%反应,不包含​​任何溶剂或稀释剂。 硕士邦德聚合物系统EP120SP,可以很容易地胶凝在低温度为100-120 ° C。 完全固化,温度在125 ° C至150 ° C范围内。 固化后的聚合物具有优良的物理强度性能,并有热distortlon温度约137 ° C。 硕士邦德EP120SP是提供在每两个有一个最低的六(6)个月稳定的液体成分的形式储存在温度约为25 ± 5 ° C。

Master Bond Polymer System EP120SP is a two-component epoxy/anhydride system for high performance resistant gel coats ancl protective coatings for filament wound structures. It is, 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP120SP can be readily gelled at temperatures as low as 100-120°C. Full cure is obtained at temperatures in the 125°C to 150°C range. The cured polymer features superior physical strength properties and has a heat distortlon temperature of around 137°C. Master Bond EP120SP is supplied in the form of two liquid components each having a minimum stability of six (6) months when stored at temperatures of around 25±5°C.

技术参数/Specifications

Chemical System Epoxy
Cure / Technology Thermoset; Two Component  
Features Electrically Conductive; EMI/RFI Shielding; Sealant; Adhesive
Industry Electronics; Electric Power

EP120SP,硕士邦德公司,特种胶粘剂,密封剂和化合物,EP120SP, Master Bond, Inc., Specialty Adhesives, Sealants and Compounds

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