硕士邦德高分子胶粘剂EP21LP – IND是一种双组分，高强度高性能通用粘接，制定了在室温下为特色锅寿命长（2-4小时），中度高温固化环氧胶粘剂及密封例如148 ° F （60 ° C）或更迅速地在更高的温度，例如212-300 ° F（100-150 ° C）。 它易于开发了超过2500磅室温粘接强度高。 硕士邦德高分子胶粘剂EP21LP – IND可以经过简单的应用很容易在许多不同的表面这两种成分混合。 它生产的高强度和坚韧耐用的债券是非常耐热循环和包括水，石油和在-60 ° F极宽的温度范围内大多数有机溶剂的化学品超过250 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 A部分颜色灰色，B部分晒黑。 硕士邦德EP21LP – IND胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。 固化后的材料完全符合MIL – A – 82136（0S）的性能要求，并MMM – A – 134型一。

Master Bond Polymer Adhesive EP21LP-IND is a two component, high strength epoxy adhesive for high performance general purpose bonding and sealing formulated to feature long pot life (2-4 hours) at room temperature and cure well at moderately elevated temperatures e.g. 148°F (60°C) or more rapidly at higher temperatures e.g. 212-300°F (100-150°C). It readily develops a high bonding strength of more than 2500 psi at room temperature. Master Bond Polymer Adhesive EP21LP-IND can be applied readily after simple mixing of the two components on many different surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B tan. Master Bond EP21LP-IND adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. The cured material fully meets the performance requirements of MIL-A-82136(0S) and also MMM-A-134 Type I.

硕士邦德高分子胶粘剂EP21LP – IND是一种双组分，高强度高性能通用粘接，制定了在室温下为特色锅寿命长（2-4小时），中度高温固化环氧胶粘剂及密封例如148 ° F （60 ° C）或更迅速地在更高的温度，例如212-300 ° F（100-150 ° C）。 它易于开发了超过2500磅室温粘接强度高。 硕士邦德高分子胶粘剂EP21LP – IND可以经过简单的应用很容易在许多不同的表面这两种成分混合。 它生产的高强度和坚韧耐用的债券是非常耐热循环和包括水，石油和在-60 ° F极宽的温度范围内大多数有机溶剂的化学品超过250 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 A部分颜色灰色，B部分晒黑。 硕士邦德EP21LP – IND胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。 固化后的材料完全符合MIL – A – 82136（0S）的性能要求，并MMM – A – 134型一。

Master Bond Polymer Adhesive EP21LP-IND is a two component, high strength epoxy adhesive for high performance general purpose bonding and sealing formulated to feature long pot life (2-4 hours) at room temperature and cure well at moderately elevated temperatures e.g. 148°F (60°C) or more rapidly at higher temperatures e.g. 212-300°F (100-150°C). It readily develops a high bonding strength of more than 2500 psi at room temperature. Master Bond Polymer Adhesive EP21LP-IND can be applied readily after simple mixing of the two components on many different surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B tan. Master Bond EP21LP-IND adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. The cured material fully meets the performance requirements of MIL-A-82136(0S) and also MMM-A-134 Type I.

硕士邦德高分子胶粘剂EP21LP – IND是一种双组分，高强度高性能通用粘接，制定了在室温下为特色锅寿命长（2-4小时），中度高温固化环氧胶粘剂及密封例如148 ° F （60 ° C）或更迅速地在更高的温度，例如212-300 ° F（100-150 ° C）。 它易于开发了超过2500磅室温粘接强度高。 硕士邦德高分子胶粘剂EP21LP – IND可以经过简单的应用很容易在许多不同的表面这两种成分混合。 它生产的高强度和坚韧耐用的债券是非常耐热循环和包括水，石油和在-60 ° F极宽的温度范围内大多数有机溶剂的化学品超过250 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 A部分颜色灰色，B部分晒黑。 硕士邦德EP21LP – IND胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。 固化后的材料完全符合MIL – A – 82136（0S）的性能要求，并MMM – A – 134型一。

Master Bond Polymer Adhesive EP21LP-IND is a two component, high strength epoxy adhesive for high performance general purpose bonding and sealing formulated to feature long pot life (2-4 hours) at room temperature and cure well at moderately elevated temperatures e.g. 148°F (60°C) or more rapidly at higher temperatures e.g. 212-300°F (100-150°C). It readily develops a high bonding strength of more than 2500 psi at room temperature. Master Bond Polymer Adhesive EP21LP-IND can be applied readily after simple mixing of the two components on many different surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B tan. Master Bond EP21LP-IND adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. The cured material fully meets the performance requirements of MIL-A-82136(0S) and also MMM-A-134 Type I.