硕士邦德聚合物系统EP21HTTDC是一个独特的双组分，高性能粘结增韧环氧树脂复合，封口，铸造具有高剥离强度，优越的抗振动，冲击和震撼服务达400 ° F。 这是制定治愈在环境温度或与非关键一到一的比例混合高温下更为迅速。 主键EP21HTTDC化合物具有很高的物理，包括超过2800磅抗拉，抗剪强度在常温下，超过35 PLI剥离强度，优良的电气绝缘特性，良好的抗热震性和高度的阻力的强度特性行动，例如水，酸，碱，燃料和各种有机溶剂的许多化学物质。 它可用于在极宽的温度范围-65 ° F至+400 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和大多数塑料是Excel的借出。 硕士邦德EP21HTTDC是100％反应，不含有任何溶剂或dilutents。 它广泛用于电子，电气，计算机，建筑，金属加工，家电，汽车和化学加工工业。

Master Bond Polymer System EP21HTTDC is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and shock for service up to 400°F. It is formulated to cure at ambient temperatures or more rapidly at elevated temperatures with a noncritical one-to-one mix ratio. The Master Bond EP21HTTDC compound features high physical strength properties including a tensile shear strength of more than 2800 psi at ambient temperatures, a peel strength of more than 35 pli, excellent electrical insulation characteristics, good thermal shock resistance and a high degree of resistance to the action of many chemicals such as water, acids, bases, fuels and various organic solvents. It can be used over the exceptionally wide temperature range of -65°F to +400°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and most plastics is excel-lent. Master Bond EP21HTTDC is 100% reactive and does not contain any solvents or dilutents. It is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical process industries.

硕士邦德聚合物系统EP21HTTDC是一个独特的双组分，高性能粘结增韧环氧树脂复合，封口，铸造具有高剥离强度，优越的抗振动，冲击和震撼服务达400 ° F。 这是制定治愈在环境温度或与非关键一到一的比例混合高温下更为迅速。 主键EP21HTTDC化合物具有很高的物理，包括超过2800磅抗拉，抗剪强度在常温下，超过35 PLI剥离强度，优良的电气绝缘特性，良好的抗热震性和高度的阻力的强度特性行动，例如水，酸，碱，燃料和各种有机溶剂的许多化学物质。 它可用于在极宽的温度范围-65 ° F至+400 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和大多数塑料是Excel的借出。 硕士邦德EP21HTTDC是100％反应，不含有任何溶剂或dilutents。 它广泛用于电子，电气，计算机，建筑，金属加工，家电，汽车和化学加工工业。

Master Bond Polymer System EP21HTTDC is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and shock for service up to 400°F. It is formulated to cure at ambient temperatures or more rapidly at elevated temperatures with a noncritical one-to-one mix ratio. The Master Bond EP21HTTDC compound features high physical strength properties including a tensile shear strength of more than 2800 psi at ambient temperatures, a peel strength of more than 35 pli, excellent electrical insulation characteristics, good thermal shock resistance and a high degree of resistance to the action of many chemicals such as water, acids, bases, fuels and various organic solvents. It can be used over the exceptionally wide temperature range of -65°F to +400°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and most plastics is excel-lent. Master Bond EP21HTTDC is 100% reactive and does not contain any solvents or dilutents. It is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical process industries.

硕士邦德聚合物系统EP21HTTDC是一个独特的双组分，高性能粘结增韧环氧树脂复合，封口，铸造具有高剥离强度，优越的抗振动，冲击和震撼服务达400 ° F。 这是制定治愈在环境温度或与非关键一到一的比例混合高温下更为迅速。 主键EP21HTTDC化合物具有很高的物理，包括超过2800磅抗拉，抗剪强度在常温下，超过35 PLI剥离强度，优良的电气绝缘特性，良好的抗热震性和高度的阻力的强度特性行动，例如水，酸，碱，燃料和各种有机溶剂的许多化学物质。 它可用于在极宽的温度范围-65 ° F至+400 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和大多数塑料是Excel的借出。 硕士邦德EP21HTTDC是100％反应，不含有任何溶剂或dilutents。 它广泛用于电子，电气，计算机，建筑，金属加工，家电，汽车和化学加工工业。

Master Bond Polymer System EP21HTTDC is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and shock for service up to 400°F. It is formulated to cure at ambient temperatures or more rapidly at elevated temperatures with a noncritical one-to-one mix ratio. The Master Bond EP21HTTDC compound features high physical strength properties including a tensile shear strength of more than 2800 psi at ambient temperatures, a peel strength of more than 35 pli, excellent electrical insulation characteristics, good thermal shock resistance and a high degree of resistance to the action of many chemicals such as water, acids, bases, fuels and various organic solvents. It can be used over the exceptionally wide temperature range of -65°F to +400°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and most plastics is excel-lent. Master Bond EP21HTTDC is 100% reactive and does not contain any solvents or dilutents. It is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical process industries.