Potting compound / fire-resistant electronics EP21FRSPLV 灌封胶/耐火电子ep21frsplv
Characteristics
特点
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fire-resistant electronics
耐火电子
Description
描述
The Master Bond Polymer System EP21FRSPLV is a compound that can resist flame and is made for potting, encapsulating and casting. It has a one to one mix ratio, by weight. These compounds involve silicone, polyurethane, polysulfide, cyanoacrylate and UV cure systems and they are formulated to save energy costs and increase productivity.
主键的聚合物体系ep21frsplv是一种化合物，能够抵抗火焰和进行灌封，灌封和浇注。它有一一个一个混合比，重量。这些化合物包括硅酮、聚氨酯、聚硫、氰基丙烯酸酯和UV固化系统和他们制定节约能源成本和提高生产率。
They offer advantages like all-around cure schedules; ambient temperature cures, convenient mixing and good flow properties. These compounds comply with the UL 94V.0 flame retardant specification and it is red in color for identification purposes.
他们提供的优点，如全方位的治疗计划，环境温度治疗，方便的混合和良好的流动性。这些化合物符合UL94V阻燃规范。0是用于识别目的的颜色红色。
Potting compound / fire-resistant electronics EP21FRSPLV 灌封胶/耐火电子ep21frsplv