Epoxy adhesive / two-component / electrically-conductive EP21TDCS 双组分环氧胶粘剂/ /导电ep21tdcs

Characteristics
特点
Chemical composition:
化学成分：
epoxy
环氧树脂
Number of components:
零件编号：
two-component
双组分
Technical characteristics:
技术特点：
electrically-conductive
导电
Description
描述
The Master Bond Polymer System EP21TDCS is a dual component, silver packed adhesive that is electrically condusive. It serves a sealant fluid for superior bonding and sealing developed to cure at room temperature or faster at high temperatures. This product has a 1:1 mix ratio either by weight or volum. It produces a high bonding strength that reaches more thatn 850 psi tensile shear. When measured and cure at 75°F, it develps a T-peel of greater than 10 pli. Containing zero diluents or solvents, it is completely reactive and cured system volume resistance is lower that 10-3 ohm-cm. It can be utilized with reduced sagging or driping even on vertical surfaces.
主键的聚合物体系ep21tdcs是一种双组分、银填料的粘合剂，电助。它为优良的粘接和密封的密封液提供了在室温下固化或在高温下固化的密封液。本产品具有混合比1:1的重量或体积。它产生的粘结强度高，达到大于850 psi拉伸剪切。测量时，在75°F治疗，它发展了T型剥离大于10 PLI。含零稀释剂或溶剂，它完全反应和固化体系的体积电阻低于10-3Ωcm。它可以被用来减少下垂或滴甚至在垂直的表面上。

Epoxy adhesive / two-component / electrically-conductive EP21TDCS 双组分环氧胶粘剂/ /导电ep21tdcs

Epoxy adhesive / two-component / electrically-conductive EP21TDCS 双组分环氧胶粘剂/ /导电ep21tdcs

Characteristics
特点
Chemical composition:
化学成分：
epoxy
环氧树脂
Number of components:
零件编号：
two-component
双组分
Technical characteristics:
技术特点：
electrically-conductive
导电
Description
描述
The Master Bond Polymer System EP21TDCS is a dual component, silver packed adhesive that is electrically condusive. It serves a sealant fluid for superior bonding and sealing developed to cure at room temperature or faster at high temperatures. This product has a 1:1 mix ratio either by weight or volum. It produces a high bonding strength that reaches more thatn 850 psi tensile shear. When measured and cure at 75°F, it develps a T-peel of greater than 10 pli. Containing zero diluents or solvents, it is completely reactive and cured system volume resistance is lower that 10-3 ohm-cm. It can be utilized with reduced sagging or driping even on vertical surfaces.
主键的聚合物体系ep21tdcs是一种双组分、银填料的粘合剂，电助。它为优良的粘接和密封的密封液提供了在室温下固化或在高温下固化的密封液。本产品具有混合比1:1的重量或体积。它产生的粘结强度高，达到大于850 psi拉伸剪切。测量时，在75°F治疗，它发展了T型剥离大于10 PLI。含零稀释剂或溶剂，它完全反应和固化体系的体积电阻低于10-3Ωcm。它可以被用来减少下垂或滴甚至在垂直的表面上。

Epoxy adhesive / two-component / electrically-conductive EP21TDCS 双组分环氧胶粘剂/ /导电ep21tdcs

Epoxy adhesive / two-component / electrically-conductive EP21TDCS 双组分环氧胶粘剂/ /导电ep21tdcs

Characteristics
特点
Chemical composition:
化学成分：
epoxy
环氧树脂
Number of components:
零件编号：
two-component
双组分
Technical characteristics:
技术特点：
electrically-conductive
导电
Description
描述
The Master Bond Polymer System EP21TDCS is a dual component, silver packed adhesive that is electrically condusive. It serves a sealant fluid for superior bonding and sealing developed to cure at room temperature or faster at high temperatures. This product has a 1:1 mix ratio either by weight or volum. It produces a high bonding strength that reaches more thatn 850 psi tensile shear. When measured and cure at 75°F, it develps a T-peel of greater than 10 pli. Containing zero diluents or solvents, it is completely reactive and cured system volume resistance is lower that 10-3 ohm-cm. It can be utilized with reduced sagging or driping even on vertical surfaces.
主键的聚合物体系ep21tdcs是一种双组分、银填料的粘合剂，电助。它为优良的粘接和密封的密封液提供了在室温下固化或在高温下固化的密封液。本产品具有混合比1:1的重量或体积。它产生的粘结强度高，达到大于850 psi拉伸剪切。测量时，在75°F治疗，它发展了T型剥离大于10 PLI。含零稀释剂或溶剂，它完全反应和固化体系的体积电阻低于10-3Ωcm。它可以被用来减少下垂或滴甚至在垂直的表面上。

Epoxy adhesive / two-component / electrically-conductive EP21TDCS 双组分环氧胶粘剂/ /导电ep21tdcs