Epoxy adhesive / two-component / high thermal conductivity -100 to 350 °F | EP21TDCHT 双组分环氧胶粘剂/ /高导热系数的100到350°F | ep21tdcht
Characteristics
特点
Chemical composition:
化学成分：
epoxy
环氧树脂
Number of components:
零件编号：
two-component
双组分
Technical characteristics:
技术特点：
high thermal conductivity
高导热系数
Description
描述
The Masterbond’s EP21TDCHT is a two component adhesive which has the ability to cure and bond substrates under room temperature heat condition and under slightly high temperature condition. It is built with a high sheer and peal advantages. It is an epoxy which is integrated with a low viscosity features. It is created for various cryogenic applications in substrates like glass, composites, metals and several types of plastics.
的开发设计的ep21tdcht一二组分胶粘剂具有固化和粘结基材的热条件下的室温稍高的温度条件下的能力。这是一个高纯珍珠的优势建立。它是一种环氧树脂，它是一种低粘度的特性。它是为各种低温应用在基板，如玻璃，复合材料，金属和几种类型的塑料。
The EP21TDCHT is able to seal, bond, adhere and coat substrates under a working temperature of -100°F to 350°F. It is equipped with a resistance feature against water, oils, organic solvents and other relative chemicals. Its system can be utilized in different fields like aerospace, medical, electronic, OEM and structural industries.
的ep21tdcht能密封、粘结、坚持和涂层基材工作温度在100°F 350°F.设有电阻特性对水、油、有机溶剂及其他相关化学品。它的系统可用于航空航天，医疗，电子，工业和结构等领域的不同领域。
Epoxy adhesive / two-component / high thermal conductivity -100 to 350 °F | EP21TDCHT 双组分环氧胶粘剂/ /高导热系数的100到350°F | ep21tdcht