UV22

UV22 Master Bond, Inc.

硕士邦德聚合物系统UV22代表了纳米技术中的一个组成部分紫外线涂料,密封和封装应用固化环氧树脂配方的利用率显着的技术突破。 这种纳米二氧化硅填充系统功能出色的物理强度性能,高超的耐磨性,优良的低收缩伴随着异常的光学清晰度。 对UV22的性能属性超越了一个惊人的50-90%的类似系统的无筋。 二氧化硅阶段包括非常小的(<50纳米)和很窄的粒度分布表面改性合成二氧化硅纳米球。 尽管添加到UV2​​2纳米颗粒(> 35%)的比例相对较高,但仍保留高透明度无沉淀和低粘度由于结块无树脂中纳米胶体分散体的加固。 UV22使用发光迅速治愈250 – 365nm的与能源输出高达20-40毫瓦/厘米更高更快的固化促进输出²小波长的光源。 一经固化收缩率小于2%。 UV22可在-60到300 ° F温度范围宽,并治愈厚度达八分之一英寸。 此外,UV22具有优良的电绝缘性能。 高粘度的UV22版本也可用。 与许多其他紫外光固化产品,UV22没有氧气抑制和展品在室温下快速固化,即使在空气的存在。 固化后的UV22提高其温度电阻档。 添加热(90-125℃30分钟)会给它一个玻璃化转变温度为135℃,远远超过传统的紫外线系统更高。 后固化,也提高其耐化学溶剂,酸和碱有效。

Master Bond Polymer System UV22 represents a remarkable technological breakthrough in the utilization of nanotechnology in the formulation of a one component UV curable epoxy for coating, sealing, and encapsulation applications. This nanosilica filled system features outstanding physical strength properties, superb abrasion resistance, excellent optical clarity along with exceptionally low shrinkage. The performance properties of UV22 surpass those of similar unreinforced systems by an amazing 50-90%. The silica phase comprises surface modified synthetic silica nanospheres of very small size (<50nm) and with a very narrow particle size distribution. Despite the relatively high percentage of nano particles (>35%) added to the UV22, it still retains high transparency and low viscosity without sedimentation due to the agglomerate-free colloidal dispersion of the reinforcing nanoparticles in the resin. UV22 cures rapidly using light sources emitting a wavelength with 250-365nm with an energy output of as little as 20-40 milliwatts/cm² with higher outputs facilitating a faster cure. The shrinkage upon cure is less than 2%. UV22 can be used over the wide temperature range of -60 to 300°F and will cure in thicknesses up to 1/8th of an inch. Additionally, UV22 has excellent electrical insulation properties. Higher viscosity versions of UV22 are also available. Unlike many other UV curable products, UV22 is not oxygen inhibited and exhibits a fast cure at ambient temperatures, even in the presence of air. Post curing the UV22 enhances its temperature resistance profile. Adding heat (90-125°C for 30 minutes) will give it a glass transition temperature of 135°C, far higher than traditional UV systems. The post cure is also effective in increasing its chemical resistance to solvents, acids and bases.

技术参数/Specifications

Cure / Technology UV or Radiation Cured; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
Features High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC’s

UV22,硕士邦德公司,环氧胶粘剂,UV22, Master Bond, Inc., Epoxy Adhesives

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UV22

UV22 Master Bond, Inc.

硕士邦德聚合物系统UV22代表了纳米技术中的一个组成部分紫外线涂料,密封和封装应用固化环氧树脂配方的利用率显着的技术突破。 这种纳米二氧化硅填充系统功能出色的物理强度性能,高超的耐磨性,优良的低收缩伴随着异常的光学清晰度。 对UV22的性能属性超越了一个惊人的50-90%的类似系统的无筋。 二氧化硅阶段包括非常小的(<50纳米)和很窄的粒度分布表面改性合成二氧化硅纳米球。 尽管添加到UV2​​2纳米颗粒(> 35%)的比例相对较高,但仍保留高透明度无沉淀和低粘度由于结块无树脂中纳米胶体分散体的加固。 UV22使用发光迅速治愈250 – 365nm的与能源输出高达20-40毫瓦/厘米更高更快的固化促进输出²小波长的光源。 一经固化收缩率小于2%。 UV22可在-60到300 ° F温度范围宽,并治愈厚度达八分之一英寸。 此外,UV22具有优良的电绝缘性能。 高粘度的UV22版本也可用。 与许多其他紫外光固化产品,UV22没有氧气抑制和展品在室温下快速固化,即使在空气的存在。 固化后的UV22提高其温度电阻档。 添加热(90-125℃30分钟)会给它一个玻璃化转变温度为135℃,远远超过传统的紫外线系统更高。 后固化,也提高其耐化学溶剂,酸和碱有效。

Master Bond Polymer System UV22 represents a remarkable technological breakthrough in the utilization of nanotechnology in the formulation of a one component UV curable epoxy for coating, sealing, and encapsulation applications. This nanosilica filled system features outstanding physical strength properties, superb abrasion resistance, excellent optical clarity along with exceptionally low shrinkage. The performance properties of UV22 surpass those of similar unreinforced systems by an amazing 50-90%. The silica phase comprises surface modified synthetic silica nanospheres of very small size (<50nm) and with a very narrow particle size distribution. Despite the relatively high percentage of nano particles (>35%) added to the UV22, it still retains high transparency and low viscosity without sedimentation due to the agglomerate-free colloidal dispersion of the reinforcing nanoparticles in the resin. UV22 cures rapidly using light sources emitting a wavelength with 250-365nm with an energy output of as little as 20-40 milliwatts/cm² with higher outputs facilitating a faster cure. The shrinkage upon cure is less than 2%. UV22 can be used over the wide temperature range of -60 to 300°F and will cure in thicknesses up to 1/8th of an inch. Additionally, UV22 has excellent electrical insulation properties. Higher viscosity versions of UV22 are also available. Unlike many other UV curable products, UV22 is not oxygen inhibited and exhibits a fast cure at ambient temperatures, even in the presence of air. Post curing the UV22 enhances its temperature resistance profile. Adding heat (90-125°C for 30 minutes) will give it a glass transition temperature of 135°C, far higher than traditional UV systems. The post cure is also effective in increasing its chemical resistance to solvents, acids and bases.

技术参数/Specifications

Cure / Technology UV or Radiation Cured; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
Features High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC’s

UV22,硕士邦德公司,环氧胶粘剂,UV22, Master Bond, Inc., Epoxy Adhesives

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UV22

UV22 Master Bond, Inc.

硕士邦德聚合物系统UV22代表了纳米技术中的一个组成部分紫外线涂料,密封和封装应用固化环氧树脂配方的利用率显着的技术突破。 这种纳米二氧化硅填充系统功能出色的物理强度性能,高超的耐磨性,优良的低收缩伴随着异常的光学清晰度。 对UV22的性能属性超越了一个惊人的50-90%的类似系统的无筋。 二氧化硅阶段包括非常小的(<50纳米)和很窄的粒度分布表面改性合成二氧化硅纳米球。 尽管添加到UV2​​2纳米颗粒(> 35%)的比例相对较高,但仍保留高透明度无沉淀和低粘度由于结块无树脂中纳米胶体分散体的加固。 UV22使用发光迅速治愈250 – 365nm的与能源输出高达20-40毫瓦/厘米更高更快的固化促进输出²小波长的光源。 一经固化收缩率小于2%。 UV22可在-60到300 ° F温度范围宽,并治愈厚度达八分之一英寸。 此外,UV22具有优良的电绝缘性能。 高粘度的UV22版本也可用。 与许多其他紫外光固化产品,UV22没有氧气抑制和展品在室温下快速固化,即使在空气的存在。 固化后的UV22提高其温度电阻档。 添加热(90-125℃30分钟)会给它一个玻璃化转变温度为135℃,远远超过传统的紫外线系统更高。 后固化,也提高其耐化学溶剂,酸和碱有效。

Master Bond Polymer System UV22 represents a remarkable technological breakthrough in the utilization of nanotechnology in the formulation of a one component UV curable epoxy for coating, sealing, and encapsulation applications. This nanosilica filled system features outstanding physical strength properties, superb abrasion resistance, excellent optical clarity along with exceptionally low shrinkage. The performance properties of UV22 surpass those of similar unreinforced systems by an amazing 50-90%. The silica phase comprises surface modified synthetic silica nanospheres of very small size (<50nm) and with a very narrow particle size distribution. Despite the relatively high percentage of nano particles (>35%) added to the UV22, it still retains high transparency and low viscosity without sedimentation due to the agglomerate-free colloidal dispersion of the reinforcing nanoparticles in the resin. UV22 cures rapidly using light sources emitting a wavelength with 250-365nm with an energy output of as little as 20-40 milliwatts/cm² with higher outputs facilitating a faster cure. The shrinkage upon cure is less than 2%. UV22 can be used over the wide temperature range of -60 to 300°F and will cure in thicknesses up to 1/8th of an inch. Additionally, UV22 has excellent electrical insulation properties. Higher viscosity versions of UV22 are also available. Unlike many other UV curable products, UV22 is not oxygen inhibited and exhibits a fast cure at ambient temperatures, even in the presence of air. Post curing the UV22 enhances its temperature resistance profile. Adding heat (90-125°C for 30 minutes) will give it a glass transition temperature of 135°C, far higher than traditional UV systems. The post cure is also effective in increasing its chemical resistance to solvents, acids and bases.

技术参数/Specifications

Cure / Technology UV or Radiation Cured; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
Features High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC’s

UV22,硕士邦德公司,环氧胶粘剂,UV22, Master Bond, Inc., Epoxy Adhesives

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