UV10LV

UV10LV Master Bond, Inc.

硕士邦德UV10LV是一种单组分UV固化改性环氧化合物,准备使用所提供的高性能铸造,涂料和粘接应用。 UV10LV是在室温下具有temeprature范围小于200 CPS粘度低粘度液体。 当暴露在紫外线光源的这些化合物的形式强劲,以及优异的耐化学性债券,在宽广的温度范围(320-360 millimicrons最大紫外吸收)。 铸件可达1 / 4“厚,可以多准备。硕士邦德UV10LV是不是氧抑制,因此不需要惰性气氛,这种化合物并不需要完全治愈紫外光源聚合将继续曝光后。不像其他的紫外线系统,UV10LV复合可以在较大范围内的部分厚度。治愈,高粘结强度与金属,陶瓷,玻璃,纸张,许多塑料和弹性体获得长期债券优势的长期耐用性非常出色,即使暴露在恶劣的环境条件,包括热量和水分。硕士邦德UV10LV复合优越的性能配置,是由于其独特的化学成分。硕士邦德UV10LV是基于一个多官能环氧树脂,并包含一个非常有效的潜在的紫外固化剂系统。快速固化的机制被触发任何方便的紫外灯,中压水银灯等来源。随着商业的紫外灯,治疗已经在很短的时间周期,例如,1分钟,在环境温度影响。,即使与低强度的紫外线的来源,专治可以在几分钟内获得。无溶剂或其他挥发性物质在固化过程中释放的粘结强度等于或超过那些获得温度从传统的室温固化双组份环氧树脂胶粘剂组成。

Master Bond UV10LV is a one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings and bonding applications. UV10LV is a low viscosity liquid at room temperature featuring a viscosity of less than 200 cps temeprature range. When exposed to a source of UV light these compounds form strong as well as superior chemical resistant bonds over a wide temperature range (maximum UV absorption at 320-360 millimicrons). Castings up to 1/4″ thick and more can be prepared. Master Bond UV10LV is not oxygen inhibited and therefore do not require an inert atmosphere. Also this compound does not need to be fully cured by the UV source as polymerization will continue after exposure. Unlike other UV systems, the UV10LV compound can be cured in a wide range of section thicknesses. High bond strengths are obtained with metals, ceramics, glass, paper, many plastic and elastomers. Long term durability of the bond strengths is excellent even when exposed to adverse environmental conditions including heat and moisture. The superior performance profile of the Master Bond UV10LV compound is due to its unique chemical composition. Master Bond UV10LV is based on a polyfunctional epoxy resin and contains an exceptionally effective latent UV curing agent system. The fast curing mechanism is triggered by any convenient source of UV light such as medium pressure mercury vapor lamps. With commercial UV lamps, cures have been effected in very short time periods, e.g., 1 minute and less at ambient temperatures. Even with low intensity UV sources, cures can be obtained in minutes. No solvents or other volatiles are released during the curing process. Bond strengths equal or exceed those obtain from conventional room temperature curing two component epoxy resin adhesive compositions.

技术参数/Specifications

Type High Dielectric; Optical; Thermal Insulation
Form / Function Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
Cure / Technology UV or Radiation Cured; Single Component
Composition & Features
Features Non-corrosive; Dissimilar Substrates
Industry Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC’s

UV10LV,硕士债券公司,灌封及灌封化合物,UV10LV, Master Bond, Inc., Encapsulants and Potting Compounds

Related posts

UV10LV

UV10LV Master Bond, Inc.

硕士邦德UV10LV是一种单组分UV固化改性环氧化合物,准备使用所提供的高性能铸造,涂料和粘接应用。 UV10LV是在室温下具有temeprature范围小于200 CPS粘度低粘度液体。 当暴露在紫外线光源的这些化合物的形式强劲,以及优异的耐化学性债券,在宽广的温度范围(320-360 millimicrons最大紫外吸收)。 铸件可达1 / 4“厚,可以多准备。硕士邦德UV10LV是不是氧抑制,因此不需要惰性气氛,这种化合物并不需要完全治愈紫外光源聚合将继续曝光后。不像其他的紫外线系统,UV10LV复合可以在较大范围内的部分厚度。治愈,高粘结强度与金属,陶瓷,玻璃,纸张,许多塑料和弹性体获得长期债券优势的长期耐用性非常出色,即使暴露在恶劣的环境条件,包括热量和水分。硕士邦德UV10LV复合优越的性能配置,是由于其独特的化学成分。硕士邦德UV10LV是基于一个多官能环氧树脂,并包含一个非常有效的潜在的紫外固化剂系统。快速固化的机制被触发任何方便的紫外灯,中压水银灯等来源。随着商业的紫外灯,治疗已经在很短的时间周期,例如,1分钟,在环境温度影响。,即使与低强度的紫外线的来源,专治可以在几分钟内获得。无溶剂或其他挥发性物质在固化过程中释放的粘结强度等于或超过那些获得温度从传统的室温固化双组份环氧树脂胶粘剂组成。

Master Bond UV10LV is a one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings and bonding applications. UV10LV is a low viscosity liquid at room temperature featuring a viscosity of less than 200 cps temeprature range. When exposed to a source of UV light these compounds form strong as well as superior chemical resistant bonds over a wide temperature range (maximum UV absorption at 320-360 millimicrons). Castings up to 1/4″ thick and more can be prepared. Master Bond UV10LV is not oxygen inhibited and therefore do not require an inert atmosphere. Also this compound does not need to be fully cured by the UV source as polymerization will continue after exposure. Unlike other UV systems, the UV10LV compound can be cured in a wide range of section thicknesses. High bond strengths are obtained with metals, ceramics, glass, paper, many plastic and elastomers. Long term durability of the bond strengths is excellent even when exposed to adverse environmental conditions including heat and moisture. The superior performance profile of the Master Bond UV10LV compound is due to its unique chemical composition. Master Bond UV10LV is based on a polyfunctional epoxy resin and contains an exceptionally effective latent UV curing agent system. The fast curing mechanism is triggered by any convenient source of UV light such as medium pressure mercury vapor lamps. With commercial UV lamps, cures have been effected in very short time periods, e.g., 1 minute and less at ambient temperatures. Even with low intensity UV sources, cures can be obtained in minutes. No solvents or other volatiles are released during the curing process. Bond strengths equal or exceed those obtain from conventional room temperature curing two component epoxy resin adhesive compositions.

技术参数/Specifications

Type High Dielectric; Optical; Thermal Insulation
Form / Function Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
Cure / Technology UV or Radiation Cured; Single Component
Composition & Features
Features Non-corrosive; Dissimilar Substrates
Industry Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC’s

UV10LV,硕士债券公司,灌封及灌封化合物,UV10LV, Master Bond, Inc., Encapsulants and Potting Compounds

Related posts

UV10LV

UV10LV Master Bond, Inc.

硕士邦德UV10LV是一种单组分UV固化改性环氧化合物,准备使用所提供的高性能铸造,涂料和粘接应用。 UV10LV是在室温下具有temeprature范围小于200 CPS粘度低粘度液体。 当暴露在紫外线光源的这些化合物的形式强劲,以及优异的耐化学性债券,在宽广的温度范围(320-360 millimicrons最大紫外吸收)。 铸件可达1 / 4“厚,可以多准备。硕士邦德UV10LV是不是氧抑制,因此不需要惰性气氛,这种化合物并不需要完全治愈紫外光源聚合将继续曝光后。不像其他的紫外线系统,UV10LV复合可以在较大范围内的部分厚度。治愈,高粘结强度与金属,陶瓷,玻璃,纸张,许多塑料和弹性体获得长期债券优势的长期耐用性非常出色,即使暴露在恶劣的环境条件,包括热量和水分。硕士邦德UV10LV复合优越的性能配置,是由于其独特的化学成分。硕士邦德UV10LV是基于一个多官能环氧树脂,并包含一个非常有效的潜在的紫外固化剂系统。快速固化的机制被触发任何方便的紫外灯,中压水银灯等来源。随着商业的紫外灯,治疗已经在很短的时间周期,例如,1分钟,在环境温度影响。,即使与低强度的紫外线的来源,专治可以在几分钟内获得。无溶剂或其他挥发性物质在固化过程中释放的粘结强度等于或超过那些获得温度从传统的室温固化双组份环氧树脂胶粘剂组成。

Master Bond UV10LV is a one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings and bonding applications. UV10LV is a low viscosity liquid at room temperature featuring a viscosity of less than 200 cps temeprature range. When exposed to a source of UV light these compounds form strong as well as superior chemical resistant bonds over a wide temperature range (maximum UV absorption at 320-360 millimicrons). Castings up to 1/4″ thick and more can be prepared. Master Bond UV10LV is not oxygen inhibited and therefore do not require an inert atmosphere. Also this compound does not need to be fully cured by the UV source as polymerization will continue after exposure. Unlike other UV systems, the UV10LV compound can be cured in a wide range of section thicknesses. High bond strengths are obtained with metals, ceramics, glass, paper, many plastic and elastomers. Long term durability of the bond strengths is excellent even when exposed to adverse environmental conditions including heat and moisture. The superior performance profile of the Master Bond UV10LV compound is due to its unique chemical composition. Master Bond UV10LV is based on a polyfunctional epoxy resin and contains an exceptionally effective latent UV curing agent system. The fast curing mechanism is triggered by any convenient source of UV light such as medium pressure mercury vapor lamps. With commercial UV lamps, cures have been effected in very short time periods, e.g., 1 minute and less at ambient temperatures. Even with low intensity UV sources, cures can be obtained in minutes. No solvents or other volatiles are released during the curing process. Bond strengths equal or exceed those obtain from conventional room temperature curing two component epoxy resin adhesive compositions.

技术参数/Specifications

Type High Dielectric; Optical; Thermal Insulation
Form / Function Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
Cure / Technology UV or Radiation Cured; Single Component
Composition & Features
Features Non-corrosive; Dissimilar Substrates
Industry Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC’s

UV10LV,硕士债券公司,灌封及灌封化合物,UV10LV, Master Bond, Inc., Encapsulants and Potting Compounds

Related posts