Epoxy adhesive / two-component / low-viscosity EP30DP

Epoxy adhesive / two-component / low-viscosity EP30DP 双组分环氧胶粘剂/ /低粘度ep30dp
Epoxy adhesive / two-component / low-viscosity EP30DP 双组分环氧胶粘剂/ /低粘度ep30dp

Characteristics
特点
Chemical composition:
化学成分:
epoxy
环氧树脂
Number of components:
零件编号:
two-component
双组分
Technical characteristics:
技术特点:
low-viscosity
低粘度
Description
描述
A two-component, epoxy-urethane, elastomeric compound, the EP30DP Master Bond Polymer System is a highly versatile product, ideal for a wide range of high performance applications including sealing, bonding, casting and encapsulation. This compound boasts of superior toughness and strength as well as abrasion resistance, combining the chemical resistance, adhesiveness and strength of epoxy resins. This compound can also manage Cryogenic temperatures and is able to cast thick cross sections without exotherm buildup while curing. This compound has been formulated to cure at ambient conditions while functioning faster in higher temperatures. Not containing any diluents and solvents, the Master Bond Polymer System is 100 reactive. While it performs well in different substrates, it can also be easily removed compared to other epoxies.
一种双组份环氧聚氨酯弹性体化合物的ep30dp,主键聚合物系统是一种多用途的产品,适合各种高性能应用,包括密封、粘接、铸造和封装。该化合物具有优良的韧性和强度以及耐磨性,结合化学性、粘附性和环氧树脂的强度。这种化合物也可以管理低温并能铸厚截面无堆积固化时放热。该化合物已被配制成在环境条件下固化,而在更高的温度下运转更快。不含任何稀释剂和溶剂,主键的聚合物系统是100无功。虽然它在不同的衬底上,它也可以很容易地删除相比其他环氧树脂。

Epoxy adhesive / two-component / low-viscosity EP30DP 双组分环氧胶粘剂/ /低粘度ep30dp

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Epoxy adhesive / two-component / low-viscosity EP30DP

Epoxy adhesive / two-component / low-viscosity EP30DP 双组分环氧胶粘剂/ /低粘度ep30dp
Epoxy adhesive / two-component / low-viscosity EP30DP 双组分环氧胶粘剂/ /低粘度ep30dp

Characteristics
特点
Chemical composition:
化学成分:
epoxy
环氧树脂
Number of components:
零件编号:
two-component
双组分
Technical characteristics:
技术特点:
low-viscosity
低粘度
Description
描述
A two-component, epoxy-urethane, elastomeric compound, the EP30DP Master Bond Polymer System is a highly versatile product, ideal for a wide range of high performance applications including sealing, bonding, casting and encapsulation. This compound boasts of superior toughness and strength as well as abrasion resistance, combining the chemical resistance, adhesiveness and strength of epoxy resins. This compound can also manage Cryogenic temperatures and is able to cast thick cross sections without exotherm buildup while curing. This compound has been formulated to cure at ambient conditions while functioning faster in higher temperatures. Not containing any diluents and solvents, the Master Bond Polymer System is 100 reactive. While it performs well in different substrates, it can also be easily removed compared to other epoxies.
一种双组份环氧聚氨酯弹性体化合物的ep30dp,主键聚合物系统是一种多用途的产品,适合各种高性能应用,包括密封、粘接、铸造和封装。该化合物具有优良的韧性和强度以及耐磨性,结合化学性、粘附性和环氧树脂的强度。这种化合物也可以管理低温并能铸厚截面无堆积固化时放热。该化合物已被配制成在环境条件下固化,而在更高的温度下运转更快。不含任何稀释剂和溶剂,主键的聚合物系统是100无功。虽然它在不同的衬底上,它也可以很容易地删除相比其他环氧树脂。

Epoxy adhesive / two-component / low-viscosity EP30DP 双组分环氧胶粘剂/ /低粘度ep30dp

Related posts

Epoxy adhesive / two-component / low-viscosity EP30DP

Epoxy adhesive / two-component / low-viscosity EP30DP 双组分环氧胶粘剂/ /低粘度ep30dp
Epoxy adhesive / two-component / low-viscosity EP30DP 双组分环氧胶粘剂/ /低粘度ep30dp

Characteristics
特点
Chemical composition:
化学成分:
epoxy
环氧树脂
Number of components:
零件编号:
two-component
双组分
Technical characteristics:
技术特点:
low-viscosity
低粘度
Description
描述
A two-component, epoxy-urethane, elastomeric compound, the EP30DP Master Bond Polymer System is a highly versatile product, ideal for a wide range of high performance applications including sealing, bonding, casting and encapsulation. This compound boasts of superior toughness and strength as well as abrasion resistance, combining the chemical resistance, adhesiveness and strength of epoxy resins. This compound can also manage Cryogenic temperatures and is able to cast thick cross sections without exotherm buildup while curing. This compound has been formulated to cure at ambient conditions while functioning faster in higher temperatures. Not containing any diluents and solvents, the Master Bond Polymer System is 100 reactive. While it performs well in different substrates, it can also be easily removed compared to other epoxies.
一种双组份环氧聚氨酯弹性体化合物的ep30dp,主键聚合物系统是一种多用途的产品,适合各种高性能应用,包括密封、粘接、铸造和封装。该化合物具有优良的韧性和强度以及耐磨性,结合化学性、粘附性和环氧树脂的强度。这种化合物也可以管理低温并能铸厚截面无堆积固化时放热。该化合物已被配制成在环境条件下固化,而在更高的温度下运转更快。不含任何稀释剂和溶剂,主键的聚合物系统是100无功。虽然它在不同的衬底上,它也可以很容易地删除相比其他环氧树脂。

Epoxy adhesive / two-component / low-viscosity EP30DP 双组分环氧胶粘剂/ /低粘度ep30dp

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