Low Viscosity, Two Component Epoxy Compound for High Performance Sealing, Casting, Potting and Bonding Featuring Superior Electrical Insulation Properties and Lower Exotherm; Standard Color is Black.
Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or more rapidly at elevated temperatures. It has a lower exotherm and a longer working life, which makes it highly desirable for moderate to larger encapsulations. EP30M3LV polymer system features a forgiving two to one mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. The system also contains a special air release agent that enhances its ability to function as a potting and encapsulation compound. EP30M3LV offers excellent adhesion to both similar and dissimilar substrates including metals, glass, ceramics and many plastics. It is also noteworthy for its superior electrical insulation properties. EP30M3LV is serviceable over the wide temperature range of -60°F to +250°F. It offers good chemical resistance to water, acids, bases, fuels and oils. The color of Part A is black and Part B is amber. Master Bond Polymer System EP30M3LV is widely used in the electronic, electrical, aerospace, electro-optic and various OEM industries.
Product Advantages
- Convenient mix ratio: two to one by weight.
- Low viscosity, readily flowable; ideal for potting and encapsulation.
- Contains an air release agent; limited bubble formation.
- Lower exotherm; long open time.
- High bond strength to a wide variety of substrates.
- Outstanding electrical insulation properties.
- Superior chemical resistance.