硕士邦德聚合物体系EP30 – 1是一种低粘度，双组分高性能光纤粘接，涂料，灌封和固化配方在室温下或在高温下更迅速地封装环氧化合物，具有四（4）一（ 1）按重量比例混合。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和粘合，涂层或投集必须表现出优异的尺寸稳定性。 治愈后线性收缩率非常低0.0003英寸/英寸 固化后的环氧树脂化合物已超过97％（3100-9000 A）的光谱透射率。 硕士邦德聚合物体系EP30 – 1生产高强度刚性债券，涂料具有优良的耐化学性，水，油和大多数有机溶剂和铸件在-60 ° F极宽的温度范围内，超过250 ° F。 附着力既相似，不同的材料，包括金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化材料是优良的电绝缘体。 部分颜色A是明确的，清晰的B部分。 硕士邦德聚合物体系EP30 – 1被广泛应用在光纤用于从粘接密封垫圈和连接器，LED灌封设备以及光纤光学元件领域的应用。

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded, coated or cast assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is exceptionally low-0.0003 inches/in. The cured epoxy resin compound has a spectral transmittance of over 97% (3100-9000 A). Master Bond Polymer System EP30-1 produces high strength rigid bonds, coatings and castings with excellent chemical resistance to water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an excellent electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer System EP30-1 is widely used in the fiber optics field for applications ranging from bonding ferrules and connectors to potting LED devices as well as fiber optics components.

硕士邦德聚合物体系EP30 – 1是一种低粘度，双组分高性能光纤粘接，涂料，灌封和固化配方在室温下或在高温下更迅速地封装环氧化合物，具有四（4）一（ 1）按重量比例混合。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和粘合，涂层或投集必须表现出优异的尺寸稳定性。 治愈后线性收缩率非常低0.0003英寸/英寸 固化后的环氧树脂化合物已超过97％（3100-9000 A）的光谱透射率。 硕士邦德聚合物体系EP30 – 1生产高强度刚性债券，涂料具有优良的耐化学性，水，油和大多数有机溶剂和铸件在-60 ° F极宽的温度范围内，超过250 ° F。 附着力既相似，不同的材料，包括金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化材料是优良的电绝缘体。 部分颜色A是明确的，清晰的B部分。 硕士邦德聚合物体系EP30 – 1被广泛应用在光纤用于从粘接密封垫圈和连接器，LED灌封设备以及光纤光学元件领域的应用。

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded, coated or cast assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is exceptionally low-0.0003 inches/in. The cured epoxy resin compound has a spectral transmittance of over 97% (3100-9000 A). Master Bond Polymer System EP30-1 produces high strength rigid bonds, coatings and castings with excellent chemical resistance to water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an excellent electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer System EP30-1 is widely used in the fiber optics field for applications ranging from bonding ferrules and connectors to potting LED devices as well as fiber optics components.

硕士邦德聚合物体系EP30 – 1是一种低粘度，双组分高性能光纤粘接，涂料，灌封和固化配方在室温下或在高温下更迅速地封装环氧化合物，具有四（4）一（ 1）按重量比例混合。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和粘合，涂层或投集必须表现出优异的尺寸稳定性。 治愈后线性收缩率非常低0.0003英寸/英寸 固化后的环氧树脂化合物已超过97％（3100-9000 A）的光谱透射率。 硕士邦德聚合物体系EP30 – 1生产高强度刚性债券，涂料具有优良的耐化学性，水，油和大多数有机溶剂和铸件在-60 ° F极宽的温度范围内，超过250 ° F。 附着力既相似，不同的材料，包括金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化材料是优良的电绝缘体。 部分颜色A是明确的，清晰的B部分。 硕士邦德聚合物体系EP30 – 1被广泛应用在光纤用于从粘接密封垫圈和连接器，LED灌封设备以及光纤光学元件领域的应用。

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded, coated or cast assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is exceptionally low-0.0003 inches/in. The cured epoxy resin compound has a spectral transmittance of over 97% (3100-9000 A). Master Bond Polymer System EP30-1 produces high strength rigid bonds, coatings and castings with excellent chemical resistance to water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an excellent electrical insulator. Color of part A is clear, part B clear. Master Bond Polymer System EP30-1 is widely used in the fiber optics field for applications ranging from bonding ferrules and connectors to potting LED devices as well as fiber optics components.