硕士邦德高分子胶粘剂EP21TPLV是一种二组分，粘度低，特别坚韧环氧树脂聚硫组成配方，在室温下快速固化和与非关键的，用户友好的一对一的比例混合，重量或体积更是急剧升温。 它开发的高物理性能，卓越的粘接和密封，以多种不同的金属和非金属基材，优良的电绝缘性能和耐化学性非常高。 在固化过程中收缩率很小。 其他适宜的性能特点是最长的耐冲击性的热循环以及机械振动和冲击。 EP21TPLV具有优良的耐有机和无机溶剂和燃料种类繁多。 硕士邦德聚合物系统EP21TPLV债券以及金属，玻璃，陶瓷，木材，橡胶硫化和许多不同的塑料。 固化后的化合物是一种卓越的电气绝缘。 使用温度范围从低至-80 °，超过F到250 ° F。 硕士邦德聚合物系统EP21TPLV是找到在电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业的许多重要的应用。 Availabe明确和广泛的颜色范围。

Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures with a noncritical, user-friendly one-to-one mix ratio, weight or volume. It develops high physical properties, superior bonding and sealing to many different metallic and nonmetallic substrates, excellent electrical insulation properties and remarkably high chemical resistance. Shrinkage during cure is minimal. Other desirable performance properties are maximun impact resistance to thermal cycling as well as mechanical vibration and shock. EP21TPLV has excellent resistance to a wide variety of organic and inorganic solvents and fuels. Master Bond Polymer System EP21TPLV bonds well to metal, glass, ceramic, wood, vulcanized elastomers and many different plastics. The cured compound is a superior electrical insulator. The service temperature range extends from as low as -80°F to in excess of 250°F. Master Bond Polymer System EP21TPLV is finding many significant applications in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. Availabe clear and in a wide range of colors.

硕士邦德高分子胶粘剂EP21TPLV是一种二组分，粘度低，特别坚韧环氧树脂聚硫组成配方，在室温下快速固化和与非关键的，用户友好的一对一的比例混合，重量或体积更是急剧升温。 它开发的高物理性能，卓越的粘接和密封，以多种不同的金属和非金属基材，优良的电绝缘性能和耐化学性非常高。 在固化过程中收缩率很小。 其他适宜的性能特点是最长的耐冲击性的热循环以及机械振动和冲击。 EP21TPLV具有优良的耐有机和无机溶剂和燃料种类繁多。 硕士邦德聚合物系统EP21TPLV债券以及金属，玻璃，陶瓷，木材，橡胶硫化和许多不同的塑料。 固化后的化合物是一种卓越的电气绝缘。 使用温度范围从低至-80 °，超过F到250 ° F。 硕士邦德聚合物系统EP21TPLV是找到在电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业的许多重要的应用。 Availabe明确和广泛的颜色范围。

Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures with a noncritical, user-friendly one-to-one mix ratio, weight or volume. It develops high physical properties, superior bonding and sealing to many different metallic and nonmetallic substrates, excellent electrical insulation properties and remarkably high chemical resistance. Shrinkage during cure is minimal. Other desirable performance properties are maximun impact resistance to thermal cycling as well as mechanical vibration and shock. EP21TPLV has excellent resistance to a wide variety of organic and inorganic solvents and fuels. Master Bond Polymer System EP21TPLV bonds well to metal, glass, ceramic, wood, vulcanized elastomers and many different plastics. The cured compound is a superior electrical insulator. The service temperature range extends from as low as -80°F to in excess of 250°F. Master Bond Polymer System EP21TPLV is finding many significant applications in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. Availabe clear and in a wide range of colors.