EP21TDCAOHT

Product Description

Master Bond EP21TDCAOHT is a two component, thermally conductive, electrically insulating epoxy system that can be used as an adhesive, sealant or coating. It is a paste consistency epoxy with a forgiving one to one mix ratio by weight or volume. It cures at ambient temperatures in 2-3 days or more rapidly at elevated temperatures. The optimum schedule being overnight at room temperature followed by 2-4 hours at 150-200°F. It has low shrinkage upon curing, much less than 0.1%.

EP21TDCAOHT adheres well to a wide variety of substrates, including metals, composites, ceramics, glass, rubbers and plastics. It is a toughened system that is intended to bond dissimilar substrates and to withstand rigorous thermal cycling as well as thermal and mechanical shock. Some other desirable properties include a low coefficient of thermal expansion, standout dimensional stability and very high compressive strength. Its service temperature range is -100°F to +250°F. The color of Part A is gray and Part B is off-white. EP21TDCAOHT can be used in electronic, aerospace and specialty OEM applications, where a toughened, high strength, thermally conductive, electrically insulating epoxy is needed.

Key Features

  • Thermally conductive and electrically insulative
  • Convenient handling
  • Toughened system
  • Higher temperature resistance

Product Advantages

  • Convenient mixing and handling
  • Versatile cure schedules
  • High bonding strength to a wide variety of substrates
  • Toughened system, compatible for bonding dissimilar materials
  • Thermally conductive and electrically insulative
  • Very low shrinkage and high dimensional stability

Packaging

Cans

Pails

EP21TDCAOHT is available is various sizes and units to accommodate customer’s needs.

Related posts

EP21TDCAOHT

Product Description

Master Bond EP21TDCAOHT is a two component, thermally conductive, electrically insulating epoxy system that can be used as an adhesive, sealant or coating. It is a paste consistency epoxy with a forgiving one to one mix ratio by weight or volume. It cures at ambient temperatures in 2-3 days or more rapidly at elevated temperatures. The optimum schedule being overnight at room temperature followed by 2-4 hours at 150-200°F. It has low shrinkage upon curing, much less than 0.1%.

EP21TDCAOHT adheres well to a wide variety of substrates, including metals, composites, ceramics, glass, rubbers and plastics. It is a toughened system that is intended to bond dissimilar substrates and to withstand rigorous thermal cycling as well as thermal and mechanical shock. Some other desirable properties include a low coefficient of thermal expansion, standout dimensional stability and very high compressive strength. Its service temperature range is -100°F to +250°F. The color of Part A is gray and Part B is off-white. EP21TDCAOHT can be used in electronic, aerospace and specialty OEM applications, where a toughened, high strength, thermally conductive, electrically insulating epoxy is needed.

Key Features

  • Thermally conductive and electrically insulative
  • Convenient handling
  • Toughened system
  • Higher temperature resistance

Product Advantages

  • Convenient mixing and handling
  • Versatile cure schedules
  • High bonding strength to a wide variety of substrates
  • Toughened system, compatible for bonding dissimilar materials
  • Thermally conductive and electrically insulative
  • Very low shrinkage and high dimensional stability

Packaging

Cans

Pails

EP21TDCAOHT is available is various sizes and units to accommodate customer’s needs.

Related posts

EP21TDCAOHT

Product Description

Master Bond EP21TDCAOHT is a two component, thermally conductive, electrically insulating epoxy system that can be used as an adhesive, sealant or coating. It is a paste consistency epoxy with a forgiving one to one mix ratio by weight or volume. It cures at ambient temperatures in 2-3 days or more rapidly at elevated temperatures. The optimum schedule being overnight at room temperature followed by 2-4 hours at 150-200°F. It has low shrinkage upon curing, much less than 0.1%.

EP21TDCAOHT adheres well to a wide variety of substrates, including metals, composites, ceramics, glass, rubbers and plastics. It is a toughened system that is intended to bond dissimilar substrates and to withstand rigorous thermal cycling as well as thermal and mechanical shock. Some other desirable properties include a low coefficient of thermal expansion, standout dimensional stability and very high compressive strength. Its service temperature range is -100°F to +250°F. The color of Part A is gray and Part B is off-white. EP21TDCAOHT can be used in electronic, aerospace and specialty OEM applications, where a toughened, high strength, thermally conductive, electrically insulating epoxy is needed.

Key Features

  • Thermally conductive and electrically insulative
  • Convenient handling
  • Toughened system
  • Higher temperature resistance

Product Advantages

  • Convenient mixing and handling
  • Versatile cure schedules
  • High bonding strength to a wide variety of substrates
  • Toughened system, compatible for bonding dissimilar materials
  • Thermally conductive and electrically insulative
  • Very low shrinkage and high dimensional stability

Packaging

Cans

Pails

EP21TDCAOHT is available is various sizes and units to accommodate customer’s needs.

Related posts