硕士邦德聚合物系统EP21TDC – 2LO是一种低气体释放两个组件非常灵活，导热环氧粘接密封性能高，涂料，和封装树脂化合物。 这是制定治愈在室温或与方便的一至三个按重量配合比高温更迅速充分。 该固化物具有高伸长率和优良的韧性。 由于很少在固化过程中放热是开发的主键EP21TDC – 2LO是灌封和封装厚超薄切片以及配置合适的。 这种化合物具有优异的环氧树脂拉伸剪切和剥离粘接强度和密封应用。 它坚持好，包括金属，玻璃，陶瓷，橡胶和塑料许多不同的基板。 硬化成分是一个很好的具有突出的耐包括水，酸，碱和盐化工电绝缘体。 使用温度范围是从4K到250 ° F使其成为许多低温应用。 硕士邦德EP21TDC – 2LO被广泛用于电子，电气，光学，光纤，航空航天等行业，在低释气性，灵活性和热导率是可取的。

Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient one to three mix ratio by weight. The cured compound exhibits high elongation and excellent toughness. As very little exotherm is developed during cure the Master Bond EP21TDC-2LO is suitable for potting and encapsulating thick as well as thin sectioned configurations. This epoxy resin compound exhibits superior tensile shear and peel strength for bonding and sealing applications. It adheres well to many different substrates including metals, glass, ceramics, rubber and plastics. The hardened composition is an excellent electrical insulator with outstanding resistance to chemicals including water, acids, bases and salts. The service temperature range is from 4K to 250°F making it suitable for many cryogenic applications. Master Bond EP21TDC-2LO is widely used in the electronic, electrical, optical, fiberoptic, aerospace and other industries where low outgassing, flexibility, and thermal conductivity are desirable.

硕士邦德聚合物系统EP21TDC – 2LO是一种低气体释放两个组件非常灵活，导热环氧粘接密封性能高，涂料，和封装树脂化合物。 这是制定治愈在室温或与方便的一至三个按重量配合比高温更迅速充分。 该固化物具有高伸长率和优良的韧性。 由于很少在固化过程中放热是开发的主键EP21TDC – 2LO是灌封和封装厚超薄切片以及配置合适的。 这种化合物具有优异的环氧树脂拉伸剪切和剥离粘接强度和密封应用。 它坚持好，包括金属，玻璃，陶瓷，橡胶和塑料许多不同的基板。 硬化成分是一个很好的具有突出的耐包括水，酸，碱和盐化工电绝缘体。 使用温度范围是从4K到250 ° F使其成为许多低温应用。 硕士邦德EP21TDC – 2LO被广泛用于电子，电气，光学，光纤，航空航天等行业，在低释气性，灵活性和热导率是可取的。

Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient one to three mix ratio by weight. The cured compound exhibits high elongation and excellent toughness. As very little exotherm is developed during cure the Master Bond EP21TDC-2LO is suitable for potting and encapsulating thick as well as thin sectioned configurations. This epoxy resin compound exhibits superior tensile shear and peel strength for bonding and sealing applications. It adheres well to many different substrates including metals, glass, ceramics, rubber and plastics. The hardened composition is an excellent electrical insulator with outstanding resistance to chemicals including water, acids, bases and salts. The service temperature range is from 4K to 250°F making it suitable for many cryogenic applications. Master Bond EP21TDC-2LO is widely used in the electronic, electrical, optical, fiberoptic, aerospace and other industries where low outgassing, flexibility, and thermal conductivity are desirable.

硕士邦德聚合物系统EP21TDC – 2LO是一种低气体释放两个组件非常灵活，导热环氧粘接密封性能高，涂料，和封装树脂化合物。 这是制定治愈在室温或与方便的一至三个按重量配合比高温更迅速充分。 该固化物具有高伸长率和优良的韧性。 由于很少在固化过程中放热是开发的主键EP21TDC – 2LO是灌封和封装厚超薄切片以及配置合适的。 这种化合物具有优异的环氧树脂拉伸剪切和剥离粘接强度和密封应用。 它坚持好，包括金属，玻璃，陶瓷，橡胶和塑料许多不同的基板。 硬化成分是一个很好的具有突出的耐包括水，酸，碱和盐化工电绝缘体。 使用温度范围是从4K到250 ° F使其成为许多低温应用。 硕士邦德EP21TDC – 2LO被广泛用于电子，电气，光学，光纤，航空航天等行业，在低释气性，灵活性和热导率是可取的。

Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient one to three mix ratio by weight. The cured compound exhibits high elongation and excellent toughness. As very little exotherm is developed during cure the Master Bond EP21TDC-2LO is suitable for potting and encapsulating thick as well as thin sectioned configurations. This epoxy resin compound exhibits superior tensile shear and peel strength for bonding and sealing applications. It adheres well to many different substrates including metals, glass, ceramics, rubber and plastics. The hardened composition is an excellent electrical insulator with outstanding resistance to chemicals including water, acids, bases and salts. The service temperature range is from 4K to 250°F making it suitable for many cryogenic applications. Master Bond EP21TDC-2LO is widely used in the electronic, electrical, optical, fiberoptic, aerospace and other industries where low outgassing, flexibility, and thermal conductivity are desirable.