EP21TDC-2AN

EP21TDC-2AN Master Bond, Inc.

硕士邦德聚合物系统EP21TDC – 2AN是一个高度灵活的双组份环氧粘接密封性能高,涂料,和封装树脂化合物。 这是制定治愈在室温或与方便的一至三个按重量配合比高温更迅速充分。 固化后的复合呈现出真正的高伸长率31%的高导热环氧例外。 由于很少在固化过程中放热是开发的主键EP21TDC – 2AN是很厚的灌封和封装,以及超薄切片配置合适的。 这种化合物具有优异的环氧树脂拉伸剪切连同粘接和密封应用优秀的剥离强度。 它产生于包括金属,玻璃,陶瓷木材,硫化橡胶和多种塑料基材耐用许多不同的高品质债券。 硬化成分是一个很好的具有突出的耐化学品侵蚀从水和汽油,以众多的酸基地和盐电绝缘体。 工作温度范围为-300 ° F至250 ° F。 它甚至已经成功地采用了低温应用。 硕士邦德EP21TDC – 2AN被广泛用于电子,电气,计算机,金属加工,家电,汽车和化工它表明在不同同期提高了长期聘用,如聚硫化合物组成灵活的短期表现的行业。 对服务的耐热性高达350 ° F的修改也可以。 EP21TDC – 2ANLV是低粘度版本 – 混合粘度> 70,000 CPS。

Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient one to three mix ratio by weight. The cured compound exhibits a high 31% elongation truly exceptional for a high thermal conductive epoxy. As very little exotherm is developed during cure the Master Bond EP21TDC-2AN is suitable for potting and encapsulation very thick as well as thin sectioned configurations. This epoxy resin compound exhibits superior tensile shear together with excellent peel strength for bonding and sealing applications. It produces durable high quality bonds on many different substrates including metals, glass, ceramics wood, vulcanized rubber and many plastics. The hardened composition is an excellent electrical insulator with outstanding resistance to chemicals erosions from water and gasoline to numerous acids bases and salts. Service temperature range is from -300°F to 250°F. It has even been employed successfully in a number of cryogenic applications. Master Bond EP21TDC-2AN is widely used in the electronic, electrical, computer, metalworking, appliance, automobile and chemical industries where it has shown improved long term performance over various earlier employed flexible compounds such as polysulfide compositions. A heat resistance modification for service up to 350°F is also available. EP21TDC-2ANLV is the low viscosity version – mixed viscosity is >70,000cps.

技术参数/Specifications

Compound Type Sealant; Thermally Conductive; Adhesive
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Cure / Technology Two Component  
Features Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working

EP21TDC2AN,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP21TDC-2AN, Master Bond, Inc., Polyurethane Adhesives and Sealants

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EP21TDC-2AN

EP21TDC-2AN Master Bond, Inc.

硕士邦德聚合物系统EP21TDC – 2AN是一个高度灵活的双组份环氧粘接密封性能高,涂料,和封装树脂化合物。 这是制定治愈在室温或与方便的一至三个按重量配合比高温更迅速充分。 固化后的复合呈现出真正的高伸长率31%的高导热环氧例外。 由于很少在固化过程中放热是开发的主键EP21TDC – 2AN是很厚的灌封和封装,以及超薄切片配置合适的。 这种化合物具有优异的环氧树脂拉伸剪切连同粘接和密封应用优秀的剥离强度。 它产生于包括金属,玻璃,陶瓷木材,硫化橡胶和多种塑料基材耐用许多不同的高品质债券。 硬化成分是一个很好的具有突出的耐化学品侵蚀从水和汽油,以众多的酸基地和盐电绝缘体。 工作温度范围为-300 ° F至250 ° F。 它甚至已经成功地采用了低温应用。 硕士邦德EP21TDC – 2AN被广泛用于电子,电气,计算机,金属加工,家电,汽车和化工它表明在不同同期提高了长期聘用,如聚硫化合物组成灵活的短期表现的行业。 对服务的耐热性高达350 ° F的修改也可以。 EP21TDC – 2ANLV是低粘度版本 – 混合粘度> 70,000 CPS。

Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient one to three mix ratio by weight. The cured compound exhibits a high 31% elongation truly exceptional for a high thermal conductive epoxy. As very little exotherm is developed during cure the Master Bond EP21TDC-2AN is suitable for potting and encapsulation very thick as well as thin sectioned configurations. This epoxy resin compound exhibits superior tensile shear together with excellent peel strength for bonding and sealing applications. It produces durable high quality bonds on many different substrates including metals, glass, ceramics wood, vulcanized rubber and many plastics. The hardened composition is an excellent electrical insulator with outstanding resistance to chemicals erosions from water and gasoline to numerous acids bases and salts. Service temperature range is from -300°F to 250°F. It has even been employed successfully in a number of cryogenic applications. Master Bond EP21TDC-2AN is widely used in the electronic, electrical, computer, metalworking, appliance, automobile and chemical industries where it has shown improved long term performance over various earlier employed flexible compounds such as polysulfide compositions. A heat resistance modification for service up to 350°F is also available. EP21TDC-2ANLV is the low viscosity version – mixed viscosity is >70,000cps.

技术参数/Specifications

Compound Type Sealant; Thermally Conductive; Adhesive
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Cure / Technology Two Component  
Features Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working

EP21TDC2AN,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP21TDC-2AN, Master Bond, Inc., Polyurethane Adhesives and Sealants

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