EP21LVSP3

硕士邦德高分子胶粘剂EP21LVSP3是一种二组分高性能涂料，密封和制订治疗在室温或在高温下更迅速地粘接环氧化合物，具有非关键一对一的比例混合，重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂，是相对不敏感，混合比或基板清洗程序粘接强度高。 硕士邦德聚合物系统EP21LVSP3随时可以应用在两者的无机和有机基质种类繁多。 它生产的高强度和坚韧耐用的涂料，密封剂和债券是显着的抗热循环和包括水，油，化学品及大多数有机溶剂，在-60 ° F极宽的温度范围超过250 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化，和许多塑料是非常好的。 硬化化合物是一种电的绝缘体。 A部分颜色灰色，B部分琥珀。 硕士邦德EP21LVSP3胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。 这种固化环氧树脂配方也充分满足了MIL – A – 81236要求（OS），MMM – A – 134型1。 其特点是粘度低，便于应用和长罐的使用寿命。

Master Bond Polymer Adhesive EP21LVSP3 is a two component epoxy compound for high performance coating, sealing and bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer System EP21LVSP3 can be applied readily on a great variety of both inorganic and organic substrates. It produces durable high strength and tough coatings, sealants and bonds which are remarkably resistant to thermal cycling and chemicals including water, oil, and most organic solvents, over the exceptionally wide temperature range of -60°F to more than +250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers, and many plastics is excellent. The hardened compound is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21LVSP3 adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. This cured epoxy formulation also fully meets the requirements of MIL-A-81236 (OS), MMM-A-134 Type 1. It features low viscosity and a long pot life for easy application.