硕士邦德聚合物系统EP19HT是一个组件的存储稳定持久液体环氧树脂，高性能胶粘剂/密封剂，树脂浸渍和衬垫系统。 它具有相当长的保质期在常温下还容易在一个坚韧，坚强和抗化学腐蚀热固性塑料高温固化和优良的存储特性。 低粘度有利于在环境温度下操作，特别适合浸渍应用环境的理想。 硕士邦德EP19HT是100％反应，不含有任何溶剂或在最短的稀释剂，固化后收缩。 推荐固化时间为1小时，250 ° F。 固化时间较短，可以实现在气温之间350分之325° F。 固化后的材料具有较高的物理强度性能（拉伸强度超过10,000磅），是热稳定性（热变形温度超过280 ° F）和具有优越的电绝缘性能（体积电阻大于10 ¹⁵欧姆厘米），以及显着良好的耐化学品性能。 EP19HT广泛应用于作为粘合剂/密封胶机械/电气/电子应用。 它还可以用于金属和非金属多孔浸渍并形成高强度，耐化学腐蚀衬里。 EP19HT可在非常宽的温度范围-60 ° F至+400 ° F。 主键聚合物系统EP19HT有4个月的保质期在75 °时，在未开封的容器F存储。

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated temperatures to a tough, strong and chemically resistant thermoset plastic. Low viscosity facilitates handling at ambient temperatures and is particularly desirable for impregnation applications. Master Bond EP19HT is 100% reactive and does not contain any solvents or diluents, shrinkage upon cure in minimal. Recommended cure schedule is 1 hour at 250°F. Shorter cure times can be achieved at temperatures between 325/350°F. The cured material has high physical strength properties (tensile strength more than 10,000 psi), is thermally stable (heat deflection temperature more than 280°F) and has superior electrical insulation properties (volume resistivity greater than 10¹⁵ ohm cm) as well as remarkably good chemical resistant properties. EP19HT is widely used in mechanical/electrical/electronic applications as an adhesive/sealant. It can also be used to impregnate porous metals and nonmetals and form high strength, chemically resistant liners. EP19HT can be used over the remarkably wide temperature range of -60°F to +400°F. The Master Bond Polymer System EP19HT has a shelf life of 4 months when stored at 75°F in unopened containers.

硕士邦德聚合物系统EP19HT是一个组件的存储稳定持久液体环氧树脂，高性能胶粘剂/密封剂，树脂浸渍和衬垫系统。 它具有相当长的保质期在常温下还容易在一个坚韧，坚强和抗化学腐蚀热固性塑料高温固化和优良的存储特性。 低粘度有利于在环境温度下操作，特别适合浸渍应用环境的理想。 硕士邦德EP19HT是100％反应，不含有任何溶剂或在最短的稀释剂，固化后收缩。 推荐固化时间为1小时，250 ° F。 固化时间较短，可以实现在气温之间350分之325° F。 固化后的材料具有较高的物理强度性能（拉伸强度超过10,000磅），是热稳定性（热变形温度超过280 ° F）和具有优越的电绝缘性能（体积电阻大于10 ¹⁵欧姆厘米），以及显着良好的耐化学品性能。 EP19HT广泛应用于作为粘合剂/密封胶机械/电气/电子应用。 它还可以用于金属和非金属多孔浸渍并形成高强度，耐化学腐蚀衬里。 EP19HT可在非常宽的温度范围-60 ° F至+400 ° F。 主键聚合物系统EP19HT有4个月的保质期在75 °时，在未开封的容器F存储。

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated temperatures to a tough, strong and chemically resistant thermoset plastic. Low viscosity facilitates handling at ambient temperatures and is particularly desirable for impregnation applications. Master Bond EP19HT is 100% reactive and does not contain any solvents or diluents, shrinkage upon cure in minimal. Recommended cure schedule is 1 hour at 250°F. Shorter cure times can be achieved at temperatures between 325/350°F. The cured material has high physical strength properties (tensile strength more than 10,000 psi), is thermally stable (heat deflection temperature more than 280°F) and has superior electrical insulation properties (volume resistivity greater than 10¹⁵ ohm cm) as well as remarkably good chemical resistant properties. EP19HT is widely used in mechanical/electrical/electronic applications as an adhesive/sealant. It can also be used to impregnate porous metals and nonmetals and form high strength, chemically resistant liners. EP19HT can be used over the remarkably wide temperature range of -60°F to +400°F. The Master Bond Polymer System EP19HT has a shelf life of 4 months when stored at 75°F in unopened containers.

硕士邦德聚合物系统EP19HT是一个组件的存储稳定持久液体环氧树脂，高性能胶粘剂/密封剂，树脂浸渍和衬垫系统。 它具有相当长的保质期在常温下还容易在一个坚韧，坚强和抗化学腐蚀热固性塑料高温固化和优良的存储特性。 低粘度有利于在环境温度下操作，特别适合浸渍应用环境的理想。 硕士邦德EP19HT是100％反应，不含有任何溶剂或在最短的稀释剂，固化后收缩。 推荐固化时间为1小时，250 ° F。 固化时间较短，可以实现在气温之间350分之325° F。 固化后的材料具有较高的物理强度性能（拉伸强度超过10,000磅），是热稳定性（热变形温度超过280 ° F）和具有优越的电绝缘性能（体积电阻大于10 ¹⁵欧姆厘米），以及显着良好的耐化学品性能。 EP19HT广泛应用于作为粘合剂/密封胶机械/电气/电子应用。 它还可以用于金属和非金属多孔浸渍并形成高强度，耐化学腐蚀衬里。 EP19HT可在非常宽的温度范围-60 ° F至+400 ° F。 主键聚合物系统EP19HT有4个月的保质期在75 °时，在未开封的容器F存储。

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated temperatures to a tough, strong and chemically resistant thermoset plastic. Low viscosity facilitates handling at ambient temperatures and is particularly desirable for impregnation applications. Master Bond EP19HT is 100% reactive and does not contain any solvents or diluents, shrinkage upon cure in minimal. Recommended cure schedule is 1 hour at 250°F. Shorter cure times can be achieved at temperatures between 325/350°F. The cured material has high physical strength properties (tensile strength more than 10,000 psi), is thermally stable (heat deflection temperature more than 280°F) and has superior electrical insulation properties (volume resistivity greater than 10¹⁵ ohm cm) as well as remarkably good chemical resistant properties. EP19HT is widely used in mechanical/electrical/electronic applications as an adhesive/sealant. It can also be used to impregnate porous metals and nonmetals and form high strength, chemically resistant liners. EP19HT can be used over the remarkably wide temperature range of -60°F to +400°F. The Master Bond Polymer System EP19HT has a shelf life of 4 months when stored at 75°F in unopened containers.