硕士邦德聚合物系统EP21FRLVSP是一种二组分火焰通用粘接性化合物,密封和铸造,制定在室温下固化。 以一比一的比例混合,按重量只,它容易发展超过2000PSI在室温粘接强度高它不像其他许多环氧粘合剂,是相对不敏感基板清洗程序。 固化后的树脂系统功能的耐久性,韧性一个高强度的特性,是非常热循环和耐化学品,包括燃料,润滑油,水,酸,碱和盐以及许多积极的有机溶剂,在-60极宽的温度范围, ° F至300 ° F。 粘附于金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化化合物是一种电的绝缘体。 部分颜色A是红色,B部分的颜色为白色。 硕士邦德EP21FRLVSP化合物是电子,电气,计算机,建筑,金属加工,家电,汽车,化工等行业。 它符合UL94V – O和其他关键阻燃规格。
Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to substrate cleaning procedures. The cured resin system features durability, toughness an high strength properties and is remarkably resistant to thermal cycling and chemicals including fuels, lubricants, water, acids and alkalis and salts as well as many aggressive organic solvents, over the exceptionally wide temperature range of -60°F up to 300°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened compound is an electrical insulator. Color of Part A is red, color of Part B is white. Master Bond EP21FRLVSP compound is an electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. it complies with UL94V-O and other critical flame retardant specifications.
| Type | High Dielectric |
| Material System | |
| Chemical System | Epoxy |
| Composition | Filled |
| Cure / Technology | Two Component |
| Form / Shape | Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Grease, Paste; Optional Premixed and Frozen |
| Composition & Features | |
| Industry | Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
| Features | Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Flexible; Dissimilar Substrates |
EP21FRLVSP,硕士邦德公司,导热胶和导热界面材料,EP21FRLVSP, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials