硕士邦德聚合物系统EP21FLVSP是一种双组分，低粘度环氧树脂高性能粘接，密封，涂料，封装和铸造树脂体系。 这是配方治愈室温或高温下更快速容易。 它具有重量或体积非常宽容的1比1的比例混合。 事实上，EP21FLVSP具有能够调节通过改变混合比例的固化体系的性能不同寻常的特性。 添加更多的一个组成部分（如2:1比例混合）提供，同时增加更多的B部分（如1:2比例混合）给出了一个更加宽容的治疗（影响较大阻力）更严格的治疗（增强可加工性）。 该EP21FLVSP生产高强度，保持良好的热循环耐久包括债券和抗水，油，燃料，酸，碱和盐的许多化学物质。 这是维修过的宽温度范围-65 ° F至+250 ° F。 它的债券以及以各种基材包括金属，玻璃，陶瓷，木材，橡胶，塑料及许多。 一旦治愈，EP21FLVSP是一个优秀的电绝缘体。 这一点，再加上其低粘度，使之成为优良的封装和灌封环氧树脂。 EP21FLVSP不含溶剂或稀释剂。 虽然固化材料的标准颜色是琥珀色清晰，有更多的颜色选择范围非常广泛，也可提供。

Master Bond Polymer System EP21FLVSP is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a very forgiving 1 to 1 mix ratio by weight or volume. In fact, EP21FLVSP has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more A part (e.g. 2:1 mix ratio) gives a more rigid cure (enhanced machinability) while adding more B part (e.g. 1:2 mix ratio) gives a more forgiving cure (greater impact resistance). The EP21FLVSP produces high strength, durable bonds which hold up well to thermal cycling and resists many chemicals including water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -65°F to +250°F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21FLVSP is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. EP21FLVSP contains no solvents or diluents. While the standard color of the cured material is amber-clear, a wide variety of additional color choices are also available.

硕士邦德聚合物系统EP21FLVSP是一种双组分，低粘度环氧树脂高性能粘接，密封，涂料，封装和铸造树脂体系。 这是配方治愈室温或高温下更快速容易。 它具有重量或体积非常宽容的1比1的比例混合。 事实上，EP21FLVSP具有能够调节通过改变混合比例的固化体系的性能不同寻常的特性。 添加更多的一个组成部分（如2:1比例混合）提供，同时增加更多的B部分（如1:2比例混合）给出了一个更加宽容的治疗（影响较大阻力）更严格的治疗（增强可加工性）。 该EP21FLVSP生产高强度，保持良好的热循环耐久包括债券和抗水，油，燃料，酸，碱和盐的许多化学物质。 这是维修过的宽温度范围-65 ° F至+250 ° F。 它的债券以及以各种基材包括金属，玻璃，陶瓷，木材，橡胶，塑料及许多。 一旦治愈，EP21FLVSP是一个优秀的电绝缘体。 这一点，再加上其低粘度，使之成为优良的封装和灌封环氧树脂。 EP21FLVSP不含溶剂或稀释剂。 虽然固化材料的标准颜色是琥珀色清晰，有更多的颜色选择范围非常广泛，也可提供。

Master Bond Polymer System EP21FLVSP is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a very forgiving 1 to 1 mix ratio by weight or volume. In fact, EP21FLVSP has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more A part (e.g. 2:1 mix ratio) gives a more rigid cure (enhanced machinability) while adding more B part (e.g. 1:2 mix ratio) gives a more forgiving cure (greater impact resistance). The EP21FLVSP produces high strength, durable bonds which hold up well to thermal cycling and resists many chemicals including water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -65°F to +250°F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21FLVSP is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. EP21FLVSP contains no solvents or diluents. While the standard color of the cured material is amber-clear, a wide variety of additional color choices are also available.

硕士邦德聚合物系统EP21FLVSP是一种双组分，低粘度环氧树脂高性能粘接，密封，涂料，封装和铸造树脂体系。 这是配方治愈室温或高温下更快速容易。 它具有重量或体积非常宽容的1比1的比例混合。 事实上，EP21FLVSP具有能够调节通过改变混合比例的固化体系的性能不同寻常的特性。 添加更多的一个组成部分（如2:1比例混合）提供，同时增加更多的B部分（如1:2比例混合）给出了一个更加宽容的治疗（影响较大阻力）更严格的治疗（增强可加工性）。 该EP21FLVSP生产高强度，保持良好的热循环耐久包括债券和抗水，油，燃料，酸，碱和盐的许多化学物质。 这是维修过的宽温度范围-65 ° F至+250 ° F。 它的债券以及以各种基材包括金属，玻璃，陶瓷，木材，橡胶，塑料及许多。 一旦治愈，EP21FLVSP是一个优秀的电绝缘体。 这一点，再加上其低粘度，使之成为优良的封装和灌封环氧树脂。 EP21FLVSP不含溶剂或稀释剂。 虽然固化材料的标准颜色是琥珀色清晰，有更多的颜色选择范围非常广泛，也可提供。

Master Bond Polymer System EP21FLVSP is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a very forgiving 1 to 1 mix ratio by weight or volume. In fact, EP21FLVSP has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more A part (e.g. 2:1 mix ratio) gives a more rigid cure (enhanced machinability) while adding more B part (e.g. 1:2 mix ratio) gives a more forgiving cure (greater impact resistance). The EP21FLVSP produces high strength, durable bonds which hold up well to thermal cycling and resists many chemicals including water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -65°F to +250°F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubbers, and many plastics. Once cured, EP21FLVSP is an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting epoxy. EP21FLVSP contains no solvents or diluents. While the standard color of the cured material is amber-clear, a wide variety of additional color choices are also available.