硕士邦德聚合物系统EP21FL – 1是一种低粘度，双组分环氧树脂高性能铸造，焊接，制定了在室温下固化，或在高温下更迅速，四（4）一（1）混合，密封树脂体系按重量比例。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和铸造或保税组件必须具有优异的尺寸稳定性。 固化后收缩率是非常低 – 0.0003英寸/英寸 硕士邦德聚合物系统EP21FL – 1生产超过了-60 ° F极宽的温度范围内具有高强度和艰难的铸件，债券和海豹是显着的抗热循环和包括水，油和大多数有机溶剂的化学品，超过250 ° F。 附着力既相似，不同的材料，包括金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 该化合物是一种硬化卓越的电气绝缘。 部分颜色一个是黑色的，B部分略带黄色。 硕士邦德聚合物系统EP21FL – 1被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车和化工等行业。

Master Bond Polymer System EP21FL-1 is a low viscosity, two component epoxy resin system for high performance casting, bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and cast or bonded assemblies must exhibit superior dimensional stability. Shrinkage after cure is exceptionally low – 0.0003 inches/in. Master Bond Polymer System EP21FL-1 produces high strength and tough castings, bonds and seals which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened compound is a superior electrical insulator. Color of part A is black, part B slightly yellow. Master Bond Polymer System EP21FL-1 is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

硕士邦德聚合物系统EP21FL – 1是一种低粘度，双组分环氧树脂高性能铸造，焊接，制定了在室温下固化，或在高温下更迅速，四（4）一（1）混合，密封树脂体系按重量比例。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和铸造或保税组件必须具有优异的尺寸稳定性。 固化后收缩率是非常低 – 0.0003英寸/英寸 硕士邦德聚合物系统EP21FL – 1生产超过了-60 ° F极宽的温度范围内具有高强度和艰难的铸件，债券和海豹是显着的抗热循环和包括水，油和大多数有机溶剂的化学品，超过250 ° F。 附着力既相似，不同的材料，包括金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 该化合物是一种硬化卓越的电气绝缘。 部分颜色一个是黑色的，B部分略带黄色。 硕士邦德聚合物系统EP21FL – 1被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车和化工等行业。

Master Bond Polymer System EP21FL-1 is a low viscosity, two component epoxy resin system for high performance casting, bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and cast or bonded assemblies must exhibit superior dimensional stability. Shrinkage after cure is exceptionally low – 0.0003 inches/in. Master Bond Polymer System EP21FL-1 produces high strength and tough castings, bonds and seals which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened compound is a superior electrical insulator. Color of part A is black, part B slightly yellow. Master Bond Polymer System EP21FL-1 is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

硕士邦德聚合物系统EP21FL – 1是一种低粘度，双组分环氧树脂高性能铸造，焊接，制定了在室温下固化，或在高温下更迅速，四（4）一（1）混合，密封树脂体系按重量比例。 这种化合物是100％反应，不含有任何溶剂或其他挥发性物质。 这是特别推荐在低粘度应用所必需的易用性和铸造或保税组件必须具有优异的尺寸稳定性。 固化后收缩率是非常低 – 0.0003英寸/英寸 硕士邦德聚合物系统EP21FL – 1生产超过了-60 ° F极宽的温度范围内具有高强度和艰难的铸件，债券和海豹是显着的抗热循环和包括水，油和大多数有机溶剂的化学品，超过250 ° F。 附着力既相似，不同的材料，包括金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 该化合物是一种硬化卓越的电气绝缘。 部分颜色一个是黑色的，B部分略带黄色。 硕士邦德聚合物系统EP21FL – 1被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车和化工等行业。

Master Bond Polymer System EP21FL-1 is a low viscosity, two component epoxy resin system for high performance casting, bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and cast or bonded assemblies must exhibit superior dimensional stability. Shrinkage after cure is exceptionally low – 0.0003 inches/in. Master Bond Polymer System EP21FL-1 produces high strength and tough castings, bonds and seals which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened compound is a superior electrical insulator. Color of part A is black, part B slightly yellow. Master Bond Polymer System EP21FL-1 is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.