硕士邦德聚合物系统EP21F是双组份高性能铸造和配方，在室温下固化，或在高温下更迅速地粘接环氧化合物，以一比一的比例混合，重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧化合物，是相对不敏感，混合比或基板清洗程序粘接强度高。 硕士邦德高分子化合物EP21F可应用于容易被传统的铸造和焊接技术。 它产生持久的高强度andtough铸件和债券是非常热循环和耐化学品，包括燃料，水，油和大多数有机溶剂在-60 ° F极宽的温度范围内，超过300 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 该化合物是一种硬化优良的电气绝缘。 A部分颜色发黑，B部分琥珀。 硕士邦德EP21F系统被广泛用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业的铸造，灌封，封装和粘接。

Master Bond Polymer System EP21F is a two component epoxy compound for high performance casting and bonding formulated to cure at room temperature or more rapidly at elevated temperature, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy compounds, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Compound EP21F can be applied readily by conventional casting and bonding techniques. It produces durable high strength andtough castings and bonds which are remarkably resistant to thermal cycling and chemicals including fuels, water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 300°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened compound is an excellent electrical insulator. Color of part A black, part B amber. Master Bond EP21F System is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries for casting, potting, encapsulation and bonding.

硕士邦德聚合物系统EP21F是双组份高性能铸造和配方，在室温下固化，或在高温下更迅速地粘接环氧化合物，以一比一的比例混合，重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧化合物，是相对不敏感，混合比或基板清洗程序粘接强度高。 硕士邦德高分子化合物EP21F可应用于容易被传统的铸造和焊接技术。 它产生持久的高强度andtough铸件和债券是非常热循环和耐化学品，包括燃料，水，油和大多数有机溶剂在-60 ° F极宽的温度范围内，超过300 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 该化合物是一种硬化优良的电气绝缘。 A部分颜色发黑，B部分琥珀。 硕士邦德EP21F系统被广泛用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业的铸造，灌封，封装和粘接。

Master Bond Polymer System EP21F is a two component epoxy compound for high performance casting and bonding formulated to cure at room temperature or more rapidly at elevated temperature, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy compounds, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Compound EP21F can be applied readily by conventional casting and bonding techniques. It produces durable high strength andtough castings and bonds which are remarkably resistant to thermal cycling and chemicals including fuels, water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 300°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened compound is an excellent electrical insulator. Color of part A black, part B amber. Master Bond EP21F System is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries for casting, potting, encapsulation and bonding.

硕士邦德聚合物系统EP21F是双组份高性能铸造和配方，在室温下固化，或在高温下更迅速地粘接环氧化合物，以一比一的比例混合，重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧化合物，是相对不敏感，混合比或基板清洗程序粘接强度高。 硕士邦德高分子化合物EP21F可应用于容易被传统的铸造和焊接技术。 它产生持久的高强度andtough铸件和债券是非常热循环和耐化学品，包括燃料，水，油和大多数有机溶剂在-60 ° F极宽的温度范围内，超过300 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 该化合物是一种硬化优良的电气绝缘。 A部分颜色发黑，B部分琥珀。 硕士邦德EP21F系统被广泛用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业的铸造，灌封，封装和粘接。

Master Bond Polymer System EP21F is a two component epoxy compound for high performance casting and bonding formulated to cure at room temperature or more rapidly at elevated temperature, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy compounds, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Compound EP21F can be applied readily by conventional casting and bonding techniques. It produces durable high strength andtough castings and bonds which are remarkably resistant to thermal cycling and chemicals including fuels, water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 300°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened compound is an excellent electrical insulator. Color of part A black, part B amber. Master Bond EP21F System is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries for casting, potting, encapsulation and bonding.