硕士邦德高分子胶粘剂EP21LVLP – 1是一种双组份通用配方,固化在室温或高温下更迅速地粘接环氧树脂粘合剂,以一比一的比例混合,重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂,是相对不敏感,混合比或基板清洗程序粘接强度高。 硕士邦德高分子胶粘剂EP21LVLP – 1可以应用于无下垂或垂直的表面上,甚至滴水。 它产生持久高强度的,哪些是显着的抗热循环和包括水,油和有机溶剂的化学品多数在-60 ° F非常宽的温度范围内,强硬债券超过250 ° F。 粘附于金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 A部分颜色灰色,B部分琥珀。 硕士邦德EP21LVLP – 1胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车和化工等行业。 固化后的胶粘剂充分满足了MIL – A – 81236要求(OS),MMM – A – 134型1。 其特点是粘度低,便于应用和长罐的使用寿命。
Master Bond Polymer Adhesive EP21LVLP-1 is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Adhesive EP21LVLP-1 can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber . Master Bond EP21LVLP-1 adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. The cured adhesive fully meets the requirements of MIL-A-81236 (OS), MMM-A-134 Type 1. It features low viscosity and a long pot life for easy application.
| Cure / Technology | Thermoplastic; Two Component ; Room Temperature Vulcanizing or Curing |
| Type / Form | Liquid |
| Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
| Composition & Features | |
| Features | High Dielectric |
| Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
EP21D,硕士邦德公司,热熔胶,EP21D, Master Bond, Inc., Hot Melt Adhesives
EP21D
硕士邦德高分子胶粘剂EP21LVLP – 1是一种双组份通用配方,固化在室温或高温下更迅速地粘接环氧树脂粘合剂,以一比一的比例混合,重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂,是相对不敏感,混合比或基板清洗程序粘接强度高。 硕士邦德高分子胶粘剂EP21LVLP – 1可以应用于无下垂或垂直的表面上,甚至滴水。 它产生持久高强度的,哪些是显着的抗热循环和包括水,油和有机溶剂的化学品多数在-60 ° F非常宽的温度范围内,强硬债券超过250 ° F。 粘附于金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 A部分颜色灰色,B部分琥珀。 硕士邦德EP21LVLP – 1胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车和化工等行业。 固化后的胶粘剂充分满足了MIL – A – 81236要求(OS),MMM – A – 134型1。 其特点是粘度低,便于应用和长罐的使用寿命。
Master Bond Polymer Adhesive EP21LVLP-1 is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Adhesive EP21LVLP-1 can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber . Master Bond EP21LVLP-1 adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. The cured adhesive fully meets the requirements of MIL-A-81236 (OS), MMM-A-134 Type 1. It features low viscosity and a long pot life for easy application.
| Cure / Technology | Thermoplastic; Two Component ; Room Temperature Vulcanizing or Curing |
| Type / Form | Liquid |
| Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
| Composition & Features | |
| Features | High Dielectric |
| Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
EP21D,硕士邦德公司,热熔胶,EP21D, Master Bond, Inc., Hot Melt Adhesives
EP21D
硕士邦德高分子胶粘剂EP21LVLP – 1是一种双组份通用配方,固化在室温或高温下更迅速地粘接环氧树脂粘合剂,以一比一的比例混合,重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂,是相对不敏感,混合比或基板清洗程序粘接强度高。 硕士邦德高分子胶粘剂EP21LVLP – 1可以应用于无下垂或垂直的表面上,甚至滴水。 它产生持久高强度的,哪些是显着的抗热循环和包括水,油和有机溶剂的化学品多数在-60 ° F非常宽的温度范围内,强硬债券超过250 ° F。 粘附于金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 A部分颜色灰色,B部分琥珀。 硕士邦德EP21LVLP – 1胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车和化工等行业。 固化后的胶粘剂充分满足了MIL – A – 81236要求(OS),MMM – A – 134型1。 其特点是粘度低,便于应用和长罐的使用寿命。
Master Bond Polymer Adhesive EP21LVLP-1 is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Adhesive EP21LVLP-1 can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A gray, part B amber . Master Bond EP21LVLP-1 adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. The cured adhesive fully meets the requirements of MIL-A-81236 (OS), MMM-A-134 Type 1. It features low viscosity and a long pot life for easy application.
| Cure / Technology | Thermoplastic; Two Component ; Room Temperature Vulcanizing or Curing |
| Type / Form | Liquid |
| Substrate Compatibility | Composites; Plastic; Porous Surfaces; Dissimilar Substrates |
| Composition & Features | |
| Features | High Dielectric |
| Industry | Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
EP21D,硕士邦德公司,热熔胶,EP21D, Master Bond, Inc., Hot Melt Adhesives