硕士邦德高分子胶粘剂EP21D – 1是一种双组份通用配方，固化在室温或高温下更迅速地粘接环氧树脂粘合剂具有conveninet，两至三年的混合比例，重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂，是相对不敏感，混合比或基板清洗程序粘接强度高。 硕士邦德高分子胶粘剂EP21D – 1可以应用于无下垂或垂直的表面上，甚至滴水。 它可生成具有高剥离强度是显着的抗热循环和包括水，油和大多数有机溶剂化学品的耐用强度高，弹性，坚韧债券和密封件在-60 ° F极宽的温度范围内，超过250 ° F. 粘附于金属，玻璃，陶瓷，木材和橡胶硫化许多塑料是非常好的。 硬化胶粘剂/密封胶是一种绝缘体。 A部分颜色灰色，B部分琥珀。 硕士邦德EP21D – 1胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车和化工等行业。 该EP21CL – 1版本是专为混凝土粘接。

Master Bond Polymer Adhesive EP21D-1 is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a conveninet two-to-three mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Adhesive EP21D-1 can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength, flexible, tough bonds and seals with high peel strength which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood vulcanized rubbers and many plastics is excellent. The hardened adhesive/sealant is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21D-1 adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. The EP21CL-1 version is especially designed for concrete bonding.

硕士邦德高分子胶粘剂EP21D – 1是一种双组份通用配方，固化在室温或高温下更迅速地粘接环氧树脂粘合剂具有conveninet，两至三年的混合比例，重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂，是相对不敏感，混合比或基板清洗程序粘接强度高。 硕士邦德高分子胶粘剂EP21D – 1可以应用于无下垂或垂直的表面上，甚至滴水。 它可生成具有高剥离强度是显着的抗热循环和包括水，油和大多数有机溶剂化学品的耐用强度高，弹性，坚韧债券和密封件在-60 ° F极宽的温度范围内，超过250 ° F. 粘附于金属，玻璃，陶瓷，木材和橡胶硫化许多塑料是非常好的。 硬化胶粘剂/密封胶是一种绝缘体。 A部分颜色灰色，B部分琥珀。 硕士邦德EP21D – 1胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车和化工等行业。 该EP21CL – 1版本是专为混凝土粘接。

Master Bond Polymer Adhesive EP21D-1 is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a conveninet two-to-three mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Adhesive EP21D-1 can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength, flexible, tough bonds and seals with high peel strength which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood vulcanized rubbers and many plastics is excellent. The hardened adhesive/sealant is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21D-1 adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. The EP21CL-1 version is especially designed for concrete bonding.