EP21CLV, Master Bond, Inc., Thermosets and Thermoset Materials
Type: CastingResin ; Material System: ; Chemical System: Epoxy ; Filler: ; Form / Shape: Liquid ; Features & Industry / Applications: ; Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working ; Features: Electrically Conductive Compound ; Material Properties (Nominal / Typical): ; Thermal: ; Use Temperature: -60 to 250 F; Deflection Temperature: 180 F; Thermal Conductivity: 0.2880 to 0.4320 W/m-K; CTE: 22 to 33 µin/in-F; Mechanical: ; Tensile (Break) (psi): ; Tensile Modulus: 320 ksi; Elongation: 5.0 to 5.5 %; Electrical: ; Resistivity: 1.00E12 ohm-cm; Dielectric Strength: 360 to 450 kV/in; Dielectric Constant: 2.90 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Process & Physical: ; Water Absorption: 2.00 to 3.00 %; Melt Flow (g / 10 minutes): ; Viscosity (cP): ; Notes: Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose…
EP21CLV,硕士邦德公司,热固性塑料和热固性材料,EP21CLV, Master Bond, Inc., Thermosets and Thermoset Materials

EP21CLV, Master Bond, Inc., Thermosets and Thermoset Materials
Type: CastingResin ; Material System: ; Chemical System: Epoxy ; Filler: ; Form / Shape: Liquid ; Features & Industry / Applications: ; Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working ; Features: Electrically Conductive Compound ; Material Properties (Nominal / Typical): ; Thermal: ; Use Temperature: -60 to 250 F; Deflection Temperature: 180 F; Thermal Conductivity: 0.2880 to 0.4320 W/m-K; CTE: 22 to 33 µin/in-F; Mechanical: ; Tensile (Break) (psi): ; Tensile Modulus: 320 ksi; Elongation: 5.0 to 5.5 %; Electrical: ; Resistivity: 1.00E12 ohm-cm; Dielectric Strength: 360 to 450 kV/in; Dielectric Constant: 2.90 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Process & Physical: ; Water Absorption: 2.00 to 3.00 %; Melt Flow (g / 10 minutes): ; Viscosity (cP): ; Notes: Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose…
EP21CLV,硕士邦德公司,热固性塑料和热固性材料,EP21CLV, Master Bond, Inc., Thermosets and Thermoset Materials

EP21CLV, Master Bond, Inc., Thermosets and Thermoset Materials
Type: CastingResin ; Material System: ; Chemical System: Epoxy ; Filler: ; Form / Shape: Liquid ; Features & Industry / Applications: ; Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working ; Features: Electrically Conductive Compound ; Material Properties (Nominal / Typical): ; Thermal: ; Use Temperature: -60 to 250 F; Deflection Temperature: 180 F; Thermal Conductivity: 0.2880 to 0.4320 W/m-K; CTE: 22 to 33 µin/in-F; Mechanical: ; Tensile (Break) (psi): ; Tensile Modulus: 320 ksi; Elongation: 5.0 to 5.5 %; Electrical: ; Resistivity: 1.00E12 ohm-cm; Dielectric Strength: 360 to 450 kV/in; Dielectric Constant: 2.90 ; Optical: ; Index of Refraction (): ; Transmission (%): ; Process & Physical: ; Water Absorption: 2.00 to 3.00 %; Melt Flow (g / 10 minutes): ; Viscosity (cP): ; Notes: Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose…
EP21CLV,硕士邦德公司,热固性塑料和热固性材料,EP21CLV, Master Bond, Inc., Thermosets and Thermoset Materials