硕士邦德聚合物系统EP21CLV化合物是一种双组分粘接或通用配方，固化在室温下或在高温下更迅速地浇铸环氧化合物，以一比一的比例混合，重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧化合物，是相对不敏感，混合比或基板清洗程序粘接强度高。 它产生持久的高强度的，哪些是显着的抗热循环和包括水，油和有机溶剂的化学品最艰难的铸件，在-60 ° F极宽的温度范围超过250 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化材料是绝缘体。 部分颜色清晰，B部分琥珀清楚。 硕士邦德EP21CLV系统广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。

Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy compounds, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough castings which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an electrical insulator. Color of part A clear, part B amber clear. Master Bond EP21CLV system is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

硕士邦德聚合物系统EP21CLV化合物是一种双组分粘接或通用配方，固化在室温下或在高温下更迅速地浇铸环氧化合物，以一比一的比例混合，重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧化合物，是相对不敏感，混合比或基板清洗程序粘接强度高。 它产生持久的高强度的，哪些是显着的抗热循环和包括水，油和有机溶剂的化学品最艰难的铸件，在-60 ° F极宽的温度范围超过250 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化材料是绝缘体。 部分颜色清晰，B部分琥珀清楚。 硕士邦德EP21CLV系统广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。

Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy compounds, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough castings which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an electrical insulator. Color of part A clear, part B amber clear. Master Bond EP21CLV system is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

硕士邦德聚合物系统EP21CLV化合物是一种双组分粘接或通用配方，固化在室温下或在高温下更迅速地浇铸环氧化合物，以一比一的比例混合，重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧化合物，是相对不敏感，混合比或基板清洗程序粘接强度高。 它产生持久的高强度的，哪些是显着的抗热循环和包括水，油和有机溶剂的化学品最艰难的铸件，在-60 ° F极宽的温度范围超过250 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化材料是绝缘体。 部分颜色清晰，B部分琥珀清楚。 硕士邦德EP21CLV系统广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。

Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy compounds, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough castings which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened material is an electrical insulator. Color of part A clear, part B amber clear. Master Bond EP21CLV system is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.