硕士邦德高分子胶粘剂EP21AOHTLV是一种低粘度双组份环氧耐热胶粘剂，密封剂和密封剂配方，固化在室温或高温下更迅速，以一比一的比例混合，重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂，是相对不敏感，混合比或基板清洗程序粘接强度高。 它生产的高强度和坚韧耐用的债券是非常耐热循环和包括水，油和大多数有机溶剂的化学品在-60 ° F了极宽的温度范围）超过400 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 EP21AOHTLV具有良好的流动性，可作为灌封料在中型和大型铸件需要使用。 硬化胶粘剂具有高导热，是电绝缘体。 热膨胀系数是非常低的。 A部分颜色灰色，B部分琥珀。 硕士邦德EP21AOHTLV胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。

Master Bond Polymer Adhesive EP21AOHTLV is a low viscosity two component heat resistant epoxy adhesive, sealant and encapsulant formulated to cure at room temperature or more rapidly at elevated temperatures, with a one- to-one mix ratio,weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents) over the exceptionally wide temperature range of -60°F up to more than 400°F. Adhesion to metals, glass, ceramics,wood, vulcanized rubbers and many plastics is excellent. EP21AOHTLV has good flowability and can be used as a potting compound where medium and large size castings are required. The hardened adhesive exhibits high thermal conductivity and is an electrical insulator. The thermal expansion coefficient is remarkably low. Color of part A gray, part B amber. Master Bond EP21AOHTLV adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

硕士邦德高分子胶粘剂EP21AOHTLV是一种低粘度双组份环氧耐热胶粘剂，密封剂和密封剂配方，固化在室温或高温下更迅速，以一比一的比例混合，重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂，是相对不敏感，混合比或基板清洗程序粘接强度高。 它生产的高强度和坚韧耐用的债券是非常耐热循环和包括水，油和大多数有机溶剂的化学品在-60 ° F了极宽的温度范围）超过400 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 EP21AOHTLV具有良好的流动性，可作为灌封料在中型和大型铸件需要使用。 硬化胶粘剂具有高导热，是电绝缘体。 热膨胀系数是非常低的。 A部分颜色灰色，B部分琥珀。 硕士邦德EP21AOHTLV胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。

Master Bond Polymer Adhesive EP21AOHTLV is a low viscosity two component heat resistant epoxy adhesive, sealant and encapsulant formulated to cure at room temperature or more rapidly at elevated temperatures, with a one- to-one mix ratio,weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents) over the exceptionally wide temperature range of -60°F up to more than 400°F. Adhesion to metals, glass, ceramics,wood, vulcanized rubbers and many plastics is excellent. EP21AOHTLV has good flowability and can be used as a potting compound where medium and large size castings are required. The hardened adhesive exhibits high thermal conductivity and is an electrical insulator. The thermal expansion coefficient is remarkably low. Color of part A gray, part B amber. Master Bond EP21AOHTLV adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

硕士邦德高分子胶粘剂EP21AOHTLV是一种低粘度双组份环氧耐热胶粘剂，密封剂和密封剂配方，固化在室温或高温下更迅速，以一比一的比例混合，重量或体积。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂，是相对不敏感，混合比或基板清洗程序粘接强度高。 它生产的高强度和坚韧耐用的债券是非常耐热循环和包括水，油和大多数有机溶剂的化学品在-60 ° F了极宽的温度范围）超过400 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 EP21AOHTLV具有良好的流动性，可作为灌封料在中型和大型铸件需要使用。 硬化胶粘剂具有高导热，是电绝缘体。 热膨胀系数是非常低的。 A部分颜色灰色，B部分琥珀。 硕士邦德EP21AOHTLV胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。

Master Bond Polymer Adhesive EP21AOHTLV is a low viscosity two component heat resistant epoxy adhesive, sealant and encapsulant formulated to cure at room temperature or more rapidly at elevated temperatures, with a one- to-one mix ratio,weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents) over the exceptionally wide temperature range of -60°F up to more than 400°F. Adhesion to metals, glass, ceramics,wood, vulcanized rubbers and many plastics is excellent. EP21AOHTLV has good flowability and can be used as a potting compound where medium and large size castings are required. The hardened adhesive exhibits high thermal conductivity and is an electrical insulator. The thermal expansion coefficient is remarkably low. Color of part A gray, part B amber. Master Bond EP21AOHTLV adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.