硕士邦德高分子胶粘剂EP21AOHT是耐高温,双组份,导热,电气绝缘环氧树脂胶粘剂,密封胶,并用宽容1:1重量或体积混合比涂层。 这种多用途的系统将坚持多种承印物,包括金属,玻璃,陶瓷和多种塑料。 作为导热胶它形成超过2000磅的拉伸剪切强度高的债券。 EP21AOHT抗拒,包括水,油,燃料,在-60 ° F的温度范围内的一些化学溶剂,广泛+400 ° F。 它还具有优良的尺寸稳定性和扩展系数低。
Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive it forms high strength bonds of over 2000 psi tensile shear. EP21AOHT resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of -60°F to +400°F. It also possesses a low coefficient of expansion and excellent dimensional stability.
| Material System | |
| Chemical System | Epoxy |
| Composition | Filled |
| Cure / Technology | Two Component |
| Form / Shape | Liquid; Gap Filler, Foam in Place Gasket; Optional Premixed and Frozen |
| Composition & Features | |
| Industry | Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
| Features | Flexible; Dissimilar Substrates |
EP21AOHT,硕士邦德公司,导热胶和导热界面材料,EP21AOHT, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials
EP21AOHT
硕士邦德高分子胶粘剂EP21AOHT是耐高温,双组份,导热,电气绝缘环氧树脂胶粘剂,密封胶,并用宽容1:1重量或体积混合比涂层。 这种多用途的系统将坚持多种承印物,包括金属,玻璃,陶瓷和多种塑料。 作为导热胶它形成超过2000磅的拉伸剪切强度高的债券。 EP21AOHT抗拒,包括水,油,燃料,在-60 ° F的温度范围内的一些化学溶剂,广泛+400 ° F。 它还具有优良的尺寸稳定性和扩展系数低。
Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive it forms high strength bonds of over 2000 psi tensile shear. EP21AOHT resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of -60°F to +400°F. It also possesses a low coefficient of expansion and excellent dimensional stability.
| Material System | |
| Chemical System | Epoxy |
| Composition | Filled |
| Cure / Technology | Two Component |
| Form / Shape | Liquid; Gap Filler, Foam in Place Gasket; Optional Premixed and Frozen |
| Composition & Features | |
| Industry | Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
| Features | Flexible; Dissimilar Substrates |
EP21AOHT,硕士邦德公司,导热胶和导热界面材料,EP21AOHT, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials
EP21AOHT
硕士邦德高分子胶粘剂EP21AOHT是耐高温,双组份,导热,电气绝缘环氧树脂胶粘剂,密封胶,并用宽容1:1重量或体积混合比涂层。 这种多用途的系统将坚持多种承印物,包括金属,玻璃,陶瓷和多种塑料。 作为导热胶它形成超过2000磅的拉伸剪切强度高的债券。 EP21AOHT抗拒,包括水,油,燃料,在-60 ° F的温度范围内的一些化学溶剂,广泛+400 ° F。 它还具有优良的尺寸稳定性和扩展系数低。
Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive it forms high strength bonds of over 2000 psi tensile shear. EP21AOHT resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of -60°F to +400°F. It also possesses a low coefficient of expansion and excellent dimensional stability.
| Material System | |
| Chemical System | Epoxy |
| Composition | Filled |
| Cure / Technology | Two Component |
| Form / Shape | Liquid; Gap Filler, Foam in Place Gasket; Optional Premixed and Frozen |
| Composition & Features | |
| Industry | Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
| Features | Flexible; Dissimilar Substrates |
EP21AOHT,硕士邦德公司,导热胶和导热界面材料,EP21AOHT, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials