硕士邦德高分子胶粘剂EP21AO是双组份,导热,电绝缘用宽容1:1重量或体积混合比环氧粘合剂,密封剂和涂料。 这种多用途的系统将坚持多种承印物,包括金属,玻璃,陶瓷和多种塑料。 作为导热胶它形成超过1800磅的拉伸剪切强度高的债券。 EP21AO抗拒,包括水,油,燃料,在-60 ° F的温度范围内的一些化学溶剂,广泛+250 ° F。 它还具有优良的尺寸稳定性和扩展系数低。 低粘度的版本称为EP21AOLV也可用。 该系统特别适合于盆栽应用。
Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive it forms high strength bonds of over 1800 psi tensile shear. EP21AO resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of -60°F to +250°F. It also possesses a low coefficient of expansion and excellent dimensional stability. A low viscosity version called EP21AOLV is also available. That system is particularly well suited for potting applications.
| Material System | |
| Chemical System | Epoxy |
| Composition | Filled |
| Cure / Technology | Two Component |
| Form / Shape | Liquid; Gap Filler, Foam in Place Gasket; Optional Premixed and Frozen |
| Composition & Features | |
| Industry | Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
| Features | Flexible; Dissimilar Substrates |
EP21AO,硕士邦德公司,导热胶和导热界面材料,EP21AO, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials
EP21AO
硕士邦德高分子胶粘剂EP21AO是双组份,导热,电绝缘用宽容1:1重量或体积混合比环氧粘合剂,密封剂和涂料。 这种多用途的系统将坚持多种承印物,包括金属,玻璃,陶瓷和多种塑料。 作为导热胶它形成超过1800磅的拉伸剪切强度高的债券。 EP21AO抗拒,包括水,油,燃料,在-60 ° F的温度范围内的一些化学溶剂,广泛+250 ° F。 它还具有优良的尺寸稳定性和扩展系数低。 低粘度的版本称为EP21AOLV也可用。 该系统特别适合于盆栽应用。
Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive it forms high strength bonds of over 1800 psi tensile shear. EP21AO resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of -60°F to +250°F. It also possesses a low coefficient of expansion and excellent dimensional stability. A low viscosity version called EP21AOLV is also available. That system is particularly well suited for potting applications.
| Material System | |
| Chemical System | Epoxy |
| Composition | Filled |
| Cure / Technology | Two Component |
| Form / Shape | Liquid; Gap Filler, Foam in Place Gasket; Optional Premixed and Frozen |
| Composition & Features | |
| Industry | Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
| Features | Flexible; Dissimilar Substrates |
EP21AO,硕士邦德公司,导热胶和导热界面材料,EP21AO, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials
EP21AO
硕士邦德高分子胶粘剂EP21AO是双组份,导热,电绝缘用宽容1:1重量或体积混合比环氧粘合剂,密封剂和涂料。 这种多用途的系统将坚持多种承印物,包括金属,玻璃,陶瓷和多种塑料。 作为导热胶它形成超过1800磅的拉伸剪切强度高的债券。 EP21AO抗拒,包括水,油,燃料,在-60 ° F的温度范围内的一些化学溶剂,广泛+250 ° F。 它还具有优良的尺寸稳定性和扩展系数低。 低粘度的版本称为EP21AOLV也可用。 该系统特别适合于盆栽应用。
Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive it forms high strength bonds of over 1800 psi tensile shear. EP21AO resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of -60°F to +250°F. It also possesses a low coefficient of expansion and excellent dimensional stability. A low viscosity version called EP21AOLV is also available. That system is particularly well suited for potting applications.
| Material System | |
| Chemical System | Epoxy |
| Composition | Filled |
| Cure / Technology | Two Component |
| Form / Shape | Liquid; Gap Filler, Foam in Place Gasket; Optional Premixed and Frozen |
| Composition & Features | |
| Industry | Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working |
| Features | Flexible; Dissimilar Substrates |
EP21AO,硕士邦德公司,导热胶和导热界面材料,EP21AO, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials