硕士邦德聚合物系统EP19SC是一种单组分银充​​满了出色的耐化学性和热稳定性的特点导电环氧树脂胶ocmpound。 这种胶粘剂的特点离子杂质含量非常低，并提供持久的高强度电conducitve债券的金属和非金属基材等。 硕士邦德聚合物系统可固化温度从300-500 ° F。 一个典型的建议是35-45分钟治愈350 ° F。 一个典型的推荐治疗是35-45分钟300-350 ° F。

Master Bond Polymer System EP19SC is a one component silver filled electrically conductive epoxy adhesive ocmpound wiht excellent chemical resistant and thermal stability characteristics. This adhesive features very low levels of ionic impurities and provides durable high strength electrically conducitve bonds to variety of both metallic and nonmetallic substrates. Master Bond Polymer System can be cured at temperatures from 300-500°F. A typical recommended cure is 35-45 minutes at 350°F. A typical recommended cure is 35-45 minutes at 300-350°F.

硕士邦德聚合物系统EP19SC是一种单组分银充​​满了出色的耐化学性和热稳定性的特点导电环氧树脂胶ocmpound。 这种胶粘剂的特点离子杂质含量非常低，并提供持久的高强度电conducitve债券的金属和非金属基材等。 硕士邦德聚合物系统可固化温度从300-500 ° F。 一个典型的建议是35-45分钟治愈350 ° F。 一个典型的推荐治疗是35-45分钟300-350 ° F。

Master Bond Polymer System EP19SC is a one component silver filled electrically conductive epoxy adhesive ocmpound wiht excellent chemical resistant and thermal stability characteristics. This adhesive features very low levels of ionic impurities and provides durable high strength electrically conducitve bonds to variety of both metallic and nonmetallic substrates. Master Bond Polymer System can be cured at temperatures from 300-500°F. A typical recommended cure is 35-45 minutes at 350°F. A typical recommended cure is 35-45 minutes at 300-350°F.

硕士邦德聚合物系统EP19SC是一种单组分银充​​满了出色的耐化学性和热稳定性的特点导电环氧树脂胶ocmpound。 这种胶粘剂的特点离子杂质含量非常低，并提供持久的高强度电conducitve债券的金属和非金属基材等。 硕士邦德聚合物系统可固化温度从300-500 ° F。 一个典型的建议是35-45分钟治愈350 ° F。 一个典型的推荐治疗是35-45分钟300-350 ° F。

Master Bond Polymer System EP19SC is a one component silver filled electrically conductive epoxy adhesive ocmpound wiht excellent chemical resistant and thermal stability characteristics. This adhesive features very low levels of ionic impurities and provides durable high strength electrically conducitve bonds to variety of both metallic and nonmetallic substrates. Master Bond Polymer System can be cured at temperatures from 300-500°F. A typical recommended cure is 35-45 minutes at 350°F. A typical recommended cure is 35-45 minutes at 300-350°F.