EP110F6

EP110F6 Master Bond, Inc.

硕士邦德聚合物体系EP110F6是双组份高的性能环氧树脂,在室温下长期锅生活,这是专门为密封,灌封,封装和铸造设计的系统。 它需要高温固化。 治愈EP110F6是一个“硬”系统具有杰出的抗热震性和精湛的热循环性能优良的电绝缘特性。 坚持以及金属和多种其他基材。 治愈EP110F6的物理和电气性能均优于与室温固化以及其他加热固化系统的大多数系统的。 它耐广泛的化学品。 部分的颜色是明确的,而B部分的颜色是琥珀色。 最重要的是,EP110F6通过“六角酒吧”海军测试,MIL – 16923C,10个循环,:-55 ° C至+155 ° C。 它被广泛用于在应用程序需要高性能的电气绝缘性能和耐热循环。 应该指出的是,典型的固化时间为EP110F6在125 ° C和增强的性能可与取得额外的2-3小时150℃后固化3-5小时固化。

Master Bond Polymer System EP110F6 is a two component high performance epoxy resin system with a long pot life at room temperature which is specifically designed for potting, sealing, encapsulating and casting. It requires an elevated temperature cure. The cured EP110F6 is a “tough” system with outstanding thermal shock resistance and superb thermal cycling properties along with excellent electrical insulation characteristics. It adheres well to metals and a wide variety of other substrates. The physical and electrical properties of the cured EP110F6 are superior to those of most systems with a room temperature cure as well as other heat cured systems. It resists a wide range of chemicals. The color of part A is clear while the color of part B is amber. Most importantly, EP110F6 passes the Navy “Hex Bar” Test, MIL I-16923C, consisting of 10 cycles, -55°C to +155°C. It is widely used in applications were high performance electrical insulation properties and resistance to thermal cycling are required. It should be noted that the typical cure schedule for EP110F6 consists of a 3-5 hour cure at 125°C and that enhanced performance properties can be achieved with an additional 2-3 hour 150°C post cure.

技术参数/Specifications

Type Thermally cured
Material System
Chemical System Epoxy
Filler Unfilled
Features & Industry / Applications
Industry Electronics; Electrical Power or High Voltage; Military

EP110F6,硕士邦德公司,铸造树脂,EP110F6, Master Bond, Inc., Casting Resins

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