硕士邦德EP101M是一种单组分环氧树脂快速固化树脂体系，尤其是电气灌封和浸渍应用而设计的。 它是一种低粘度，100％的反应型树脂，其中不含任何溶剂或其他挥发性物质。 适当盆栽或封装部分是完全免费的孔隙度和空隙。 硕士邦德EP101M系统具有优良的电绝缘特性。 它可以很容易地通过各种方法，包括铸造，浸渍，浸涂层和层压处理。 使用时锅sikia砂，固化树脂，具有优良的导热性。

Master Bond EP101M is a single component epoxy fast curing resin system especially designed for electrical potting and impregnation applications. It is a low viscosity, 100% reactive resin which does not contain any solvents or other volatiles. Properly potted or encapsulated parts are completely free of porosity and voids. The Master Bond EP101M system has excellent electrical insulation characteristics. It can be readily processed by a variety of methods including casting, impregnation, dip coatings and laminating. When used to pot sikia sand, the cured resin features excellent thermal conductivity.

硕士邦德EP101M是一种单组分环氧树脂快速固化树脂体系，尤其是电气灌封和浸渍应用而设计的。 它是一种低粘度，100％的反应型树脂，其中不含任何溶剂或其他挥发性物质。 适当盆栽或封装部分是完全免费的孔隙度和空隙。 硕士邦德EP101M系统具有优良的电绝缘特性。 它可以很容易地通过各种方法，包括铸造，浸渍，浸涂层和层压处理。 使用时锅sikia砂，固化树脂，具有优良的导热性。

Master Bond EP101M is a single component epoxy fast curing resin system especially designed for electrical potting and impregnation applications. It is a low viscosity, 100% reactive resin which does not contain any solvents or other volatiles. Properly potted or encapsulated parts are completely free of porosity and voids. The Master Bond EP101M system has excellent electrical insulation characteristics. It can be readily processed by a variety of methods including casting, impregnation, dip coatings and laminating. When used to pot sikia sand, the cured resin features excellent thermal conductivity.

硕士邦德EP101M是一种单组分环氧树脂快速固化树脂体系，尤其是电气灌封和浸渍应用而设计的。 它是一种低粘度，100％的反应型树脂，其中不含任何溶剂或其他挥发性物质。 适当盆栽或封装部分是完全免费的孔隙度和空隙。 硕士邦德EP101M系统具有优良的电绝缘特性。 它可以很容易地通过各种方法，包括铸造，浸渍，浸涂层和层压处理。 使用时锅sikia砂，固化树脂，具有优良的导热性。

Master Bond EP101M is a single component epoxy fast curing resin system especially designed for electrical potting and impregnation applications. It is a low viscosity, 100% reactive resin which does not contain any solvents or other volatiles. Properly potted or encapsulated parts are completely free of porosity and voids. The Master Bond EP101M system has excellent electrical insulation characteristics. It can be readily processed by a variety of methods including casting, impregnation, dip coatings and laminating. When used to pot sikia sand, the cured resin features excellent thermal conductivity.