EP101

硕士邦德聚合物系统EP101是一种双组分，低粘度的半刚性高性能环氧复合粘接，密封和铸造。 其特点是在环境温度下工作寿命长，可随时在250-300 ° F的温度范围治愈。 治愈后收缩是最小的。 固化后的材料具有优异的附着力，以金属和许多其他基板。 物理强度和电绝缘性能优于那些大多数环境温度和许多其他热固化环氧树脂展出特别是关于耐冲击，振动和冲击。 该EP101也有在温度高于300 ° F。优良的热稳定性 化学抗水，盐，无机酸，碱和许多溶剂是非常令人满意的。 矿物填充的EP101版本为特殊应用。

Master Bond Polymer System EP101 is a two component, low viscosity semi-rigid epoxy compound for high performance bonding, sealing and casting. It features a long working life at ambient temperatures and can be readily cured at temperatures in the 250-300°F range. Shrinkage upon cure is minimal. The cured material has excellent adhesion to metals and many other substrates. Physical strength and electrical insulation properties are superior to those exhibited by most ambient temperature and many other heat curing epoxies particularly as regards resistance to impact, vibration and shock. The EP101 also has excellent thermal stability at temperatures above 300°F. The chemical resistance to water, salts, inorganic acids, alkalis and many solvents is highly satisfactory. Mineral filled versions of EP101 are available for special applications.