Bonding resin / encapsulation / sealing / epoxy Master Bond 粘接树脂/封装/密封/环氧树脂粘结
Characteristics
特点
Use:
使用：
for bonding, encapsulation, sealing
用于粘接，封装，密封
Type:
类型：
epoxy
环氧树脂
Technical characteristics:
技术特点：
single-component
单组分
Description
描述
Master Bond EP17HT-100 is a one component epoxy system for potting, encapsulation, bonding and sealing applications with a curing temperature of 200-220°F or higher. This epoxy requires no mixing, is not premixed and frozen, feautres superb high temperature resistance, is highly dimensionally stable, conducts heat while still being electrically isolating and can be cast in thicknesses up to 1/2 inch,
掌握债券ep17ht-100是盆栽，一一组分环氧系统封装、粘接和固化温度200-220°F或更高的密封应用。环氧树脂不需混合，不预冻、特征极好的耐高温、高尺寸稳定性、导热而仍被电隔离，可以铸造厚度为1 / 2英寸，
Bonding resin / encapsulation / sealing / epoxy Master Bond 粘接树脂/封装/密封/环氧树脂粘结