单组份，导电银填充，热冲击，耐热和耐化学腐蚀的环氧树脂粘合树脂体系，灌封，密封和涂层。 硕士邦德聚合物系统EP11SIC是一个新的优势和成本效益的一个组成部分环氧树脂系统，电气连接，粘接，密封和涂层结合了显着的热冲击，耐热和耐化学性，包括水和许多高物理强度性能，具有极高的导电性有机溶剂。 它的工作温度范围-60 ° F到超过3000 ° F。 金属和非金属基材的附着力非常出色。 硕士邦德的聚合物系统EP11SIC提供的一个组成部分额外的低导电环氧树脂系统不需要任何混合使用前，加上灵活的固化时间表，以最好地满足特定的应用需求的应用程序方便。 它是100％反应，不含有任何溶剂或稀释剂。 硕士邦德聚合物系统EP11SIC提供了一个银色的流动性粘贴了4个多月的最低储存稳定性的形式储存在温度约75,50 ° F。 制冷极大地扩展了这一环氧树脂系统的储存稳定性。 凝胶时间和固化时间表取决于温度。 在300 ° F，凝胶时间在20-25分钟秩序。 300℉的固化时间在60-80分钟蚂蚁在40-50分钟的顺序在350 ° F的顺序。

One component, Electrically Conductive (Silver Filled), Thermal Shock, Heat and Chemically Resistant Epoxy Resin System for Bonding, Potting, Sealing and Coating. Master Bond Polymer System EP11SIC is a new superior and cost effective one component epoxy resin system featuring exceptionally high electrical conductivity for electrical connections, bonding, sealing and coating which combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water and many organic solvents. It has a service temperature range of -60°F to over 3000°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11SIC offers the application convenience of a one component extra low conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP11SIC is supplied in the form of a silver colored flowable paste having a minimum storage stability of more than 4 months when stored at temperatures of around 75,50°F. Refrigeration greatly extends the storage stability of this epoxy resin system. Gel times and cure schedules depend upon temperature. The gel time at 300°F is in the order of 20-25 minute. The cure time at 300°F is in the order of 60-80 minutes ant at 350°F in the order of 40-50 minutes.

单组份，导电银填充，热冲击，耐热和耐化学腐蚀的环氧树脂粘合树脂体系，灌封，密封和涂层。 硕士邦德聚合物系统EP11SIC是一个新的优势和成本效益的一个组成部分环氧树脂系统，电气连接，粘接，密封和涂层结合了显着的热冲击，耐热和耐化学性，包括水和许多高物理强度性能，具有极高的导电性有机溶剂。 它的工作温度范围-60 ° F到超过3000 ° F。 金属和非金属基材的附着力非常出色。 硕士邦德的聚合物系统EP11SIC提供的一个组成部分额外的低导电环氧树脂系统不需要任何混合使用前，加上灵活的固化时间表，以最好地满足特定的应用需求的应用程序方便。 它是100％反应，不含有任何溶剂或稀释剂。 硕士邦德聚合物系统EP11SIC提供了一个银色的流动性粘贴了4个多月的最低储存稳定性的形式储存在温度约75,50 ° F。 制冷极大地扩展了这一环氧树脂系统的储存稳定性。 凝胶时间和固化时间表取决于温度。 在300 ° F，凝胶时间在20-25分钟秩序。 300℉的固化时间在60-80分钟蚂蚁在40-50分钟的顺序在350 ° F的顺序。

One component, Electrically Conductive (Silver Filled), Thermal Shock, Heat and Chemically Resistant Epoxy Resin System for Bonding, Potting, Sealing and Coating. Master Bond Polymer System EP11SIC is a new superior and cost effective one component epoxy resin system featuring exceptionally high electrical conductivity for electrical connections, bonding, sealing and coating which combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water and many organic solvents. It has a service temperature range of -60°F to over 3000°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11SIC offers the application convenience of a one component extra low conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP11SIC is supplied in the form of a silver colored flowable paste having a minimum storage stability of more than 4 months when stored at temperatures of around 75,50°F. Refrigeration greatly extends the storage stability of this epoxy resin system. Gel times and cure schedules depend upon temperature. The gel time at 300°F is in the order of 20-25 minute. The cure time at 300°F is in the order of 60-80 minutes ant at 350°F in the order of 40-50 minutes.

单组份，导电银填充，热冲击，耐热和耐化学腐蚀的环氧树脂粘合树脂体系，灌封，密封和涂层。 硕士邦德聚合物系统EP11SIC是一个新的优势和成本效益的一个组成部分环氧树脂系统，电气连接，粘接，密封和涂层结合了显着的热冲击，耐热和耐化学性，包括水和许多高物理强度性能，具有极高的导电性有机溶剂。 它的工作温度范围-60 ° F到超过3000 ° F。 金属和非金属基材的附着力非常出色。 硕士邦德的聚合物系统EP11SIC提供的一个组成部分额外的低导电环氧树脂系统不需要任何混合使用前，加上灵活的固化时间表，以最好地满足特定的应用需求的应用程序方便。 它是100％反应，不含有任何溶剂或稀释剂。 硕士邦德聚合物系统EP11SIC提供了一个银色的流动性粘贴了4个多月的最低储存稳定性的形式储存在温度约75,50 ° F。 制冷极大地扩展了这一环氧树脂系统的储存稳定性。 凝胶时间和固化时间表取决于温度。 在300 ° F，凝胶时间在20-25分钟秩序。 300℉的固化时间在60-80分钟蚂蚁在40-50分钟的顺序在350 ° F的顺序。

One component, Electrically Conductive (Silver Filled), Thermal Shock, Heat and Chemically Resistant Epoxy Resin System for Bonding, Potting, Sealing and Coating. Master Bond Polymer System EP11SIC is a new superior and cost effective one component epoxy resin system featuring exceptionally high electrical conductivity for electrical connections, bonding, sealing and coating which combines high physical strength properties with remarkable thermal shock, heat and chemical resistance including water and many organic solvents. It has a service temperature range of -60°F to over 3000°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP11SIC offers the application convenience of a one component extra low conductive epoxy resin system which does not require any mixing before use plus flexible cure schedules so as to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents. Master Bond Polymer System EP11SIC is supplied in the form of a silver colored flowable paste having a minimum storage stability of more than 4 months when stored at temperatures of around 75,50°F. Refrigeration greatly extends the storage stability of this epoxy resin system. Gel times and cure schedules depend upon temperature. The gel time at 300°F is in the order of 20-25 minute. The cure time at 300°F is in the order of 60-80 minutes ant at 350°F in the order of 40-50 minutes.