EP21ANHT

EP21ANHT Master Bond, Inc.

硕士邦德高分子胶粘剂EP21ANHT是双组分室温固化胶粘剂,密封剂和涂料,具有非常高的超过22 BTU•在/平方英尺•小时•° F.热传导 EP21ANHT推荐用于高温应用,使用温度可达400 ° F。 它的重量或体积混合比为1:1格外宽容。 虽然常温固化,加速治愈的可能,增加热量。 作为导热胶将坚持多种承印物,可提供超过1800磅的拉伸剪切强度。 其他值得注意的特征包括卓越的电气绝缘性能和增强的尺寸稳定性。 EP21ANHT提供了优越的抗,包括水,油,燃料,超过了-60℃的温度范围内的一些化学溶剂,广泛+400 ° F。

Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is recommended for high temperature applications where service temperatures may reach 400°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Although room temperature curable, accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1800 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability. EP21ANHT offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +400°F.

技术参数/Specifications

Type High Dielectric
Material System
Chemical System Epoxy
Composition Filled
Cure / Technology Two Component  
Form / Shape Gap Filler, Foam in Place Gasket; Grease, Paste; Optional Premixed and Frozen
Composition & Features
Industry Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working
Features Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Flexible; Dissimilar Substrates

EP21ANHT,硕士邦德公司,导热胶和导热界面材料,EP21ANHT, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials

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EP21ANHT

EP21ANHT Master Bond, Inc.

硕士邦德高分子胶粘剂EP21ANHT是双组分室温固化胶粘剂,密封剂和涂料,具有非常高的超过22 BTU•在/平方英尺•小时•° F.热传导 EP21ANHT推荐用于高温应用,使用温度可达400 ° F。 它的重量或体积混合比为1:1格外宽容。 虽然常温固化,加速治愈的可能,增加热量。 作为导热胶将坚持多种承印物,可提供超过1800磅的拉伸剪切强度。 其他值得注意的特征包括卓越的电气绝缘性能和增强的尺寸稳定性。 EP21ANHT提供了优越的抗,包括水,油,燃料,超过了-60℃的温度范围内的一些化学溶剂,广泛+400 ° F。

Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is recommended for high temperature applications where service temperatures may reach 400°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Although room temperature curable, accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1800 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability. EP21ANHT offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +400°F.

技术参数/Specifications

Type High Dielectric
Material System
Chemical System Epoxy
Composition Filled
Cure / Technology Two Component  
Form / Shape Gap Filler, Foam in Place Gasket; Grease, Paste; Optional Premixed and Frozen
Composition & Features
Industry Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working
Features Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Flexible; Dissimilar Substrates

EP21ANHT,硕士邦德公司,导热胶和导热界面材料,EP21ANHT, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials

Related posts

EP21ANHT

EP21ANHT Master Bond, Inc.

硕士邦德高分子胶粘剂EP21ANHT是双组分室温固化胶粘剂,密封剂和涂料,具有非常高的超过22 BTU•在/平方英尺•小时•° F.热传导 EP21ANHT推荐用于高温应用,使用温度可达400 ° F。 它的重量或体积混合比为1:1格外宽容。 虽然常温固化,加速治愈的可能,增加热量。 作为导热胶将坚持多种承印物,可提供超过1800磅的拉伸剪切强度。 其他值得注意的特征包括卓越的电气绝缘性能和增强的尺寸稳定性。 EP21ANHT提供了优越的抗,包括水,油,燃料,超过了-60℃的温度范围内的一些化学溶剂,广泛+400 ° F。

Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is recommended for high temperature applications where service temperatures may reach 400°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Although room temperature curable, accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1800 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability. EP21ANHT offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +400°F.

技术参数/Specifications

Type High Dielectric
Material System
Chemical System Epoxy
Composition Filled
Cure / Technology Two Component  
Form / Shape Gap Filler, Foam in Place Gasket; Grease, Paste; Optional Premixed and Frozen
Composition & Features
Industry Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC’s; Chemical/Oil Processing/Metal Working
Features Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Flexible; Dissimilar Substrates

EP21ANHT,硕士邦德公司,导热胶和导热界面材料,EP21ANHT, Master Bond, Inc., Thermal Compounds and Thermal Interface Materials

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