硕士邦德EP121AO是一种双组分，高性能的环氧树脂体系具有较高的热稳定性，高导热性，卓越的电气绝缘性能和出色的涂料，密封尺寸稳定性，灌封和封装服务高达450-500 ° F。 容易在高温下具有优异的长期耐用性和耐化学性，强硬的强大坚实的它即使暴露在恶劣环境条件下固化。 粘附到金属等基材是非常好的。 有没有裂纹或适当治愈EP121AO从金属等树脂分离，在很宽的温度范围。 物理强度和导热性树脂体系的固化EP121AO电气绝缘性能明显优于由典型的室温，也热固化环氧树脂体系的展出。 固化后的环氧树脂可满足所有使用温度可达475 ° F至500 °有限的时间段和长时间曝光400 – 450F F。 混合比例为100 A至80组件B零件的重量组成部分。 一个典型的固化时间为2-3 ° F在250小时由5-8小时后在300 ° F。 较高，导热版本称为具有类似特性EP121AN和固化时间也可以。 EP121AO被广泛应用于电子，电气和家电行业。

Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500°F. it cures readily at elevated temperatures to a tough strong solid with excellent long term durability and chemical resistance even when exposed to adverse environmental conditions. Adhesion to metals and other substrates is excellent. There is no cracking or separation of properly cured EP121AO resin from metal, etc., over a wide temperature range. Physical strength thermal conductivity and electrical insulation properties of the cured EP121AO resin system are significantly superior to those exhibited by typical room temperature and also thermally cured epoxy resin systems. The cured epoxy can meet all service temperatures up to 475°F to 500°F for limited time periods and 400-450F for prolonged exposures. The mix ratio is 100 parts of component A to 80 parts of component B by weight. A typical cure schedule is 2-3 hours at 250°F followed by 5-8 hours at 300°F. A higher, thermally conductive version called EP121AN with similar properties and cure schedule is also available. EP121AO is widely used in electronic, electrical and appliance industries.

硕士邦德EP121AO是一种双组分，高性能的环氧树脂体系具有较高的热稳定性，高导热性，卓越的电气绝缘性能和出色的涂料，密封尺寸稳定性，灌封和封装服务高达450-500 ° F。 容易在高温下具有优异的长期耐用性和耐化学性，强硬的强大坚实的它即使暴露在恶劣环境条件下固化。 粘附到金属等基材是非常好的。 有没有裂纹或适当治愈EP121AO从金属等树脂分离，在很宽的温度范围。 物理强度和导热性树脂体系的固化EP121AO电气绝缘性能明显优于由典型的室温，也热固化环氧树脂体系的展出。 固化后的环氧树脂可满足所有使用温度可达475 ° F至500 °有限的时间段和长时间曝光400 – 450F F。 混合比例为100 A至80组件B零件的重量组成部分。 一个典型的固化时间为2-3 ° F在250小时由5-8小时后在300 ° F。 较高，导热版本称为具有类似特性EP121AN和固化时间也可以。 EP121AO被广泛应用于电子，电气和家电行业。

Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500°F. it cures readily at elevated temperatures to a tough strong solid with excellent long term durability and chemical resistance even when exposed to adverse environmental conditions. Adhesion to metals and other substrates is excellent. There is no cracking or separation of properly cured EP121AO resin from metal, etc., over a wide temperature range. Physical strength thermal conductivity and electrical insulation properties of the cured EP121AO resin system are significantly superior to those exhibited by typical room temperature and also thermally cured epoxy resin systems. The cured epoxy can meet all service temperatures up to 475°F to 500°F for limited time periods and 400-450F for prolonged exposures. The mix ratio is 100 parts of component A to 80 parts of component B by weight. A typical cure schedule is 2-3 hours at 250°F followed by 5-8 hours at 300°F. A higher, thermally conductive version called EP121AN with similar properties and cure schedule is also available. EP121AO is widely used in electronic, electrical and appliance industries.

硕士邦德EP121AO是一种双组分，高性能的环氧树脂体系具有较高的热稳定性，高导热性，卓越的电气绝缘性能和出色的涂料，密封尺寸稳定性，灌封和封装服务高达450-500 ° F。 容易在高温下具有优异的长期耐用性和耐化学性，强硬的强大坚实的它即使暴露在恶劣环境条件下固化。 粘附到金属等基材是非常好的。 有没有裂纹或适当治愈EP121AO从金属等树脂分离，在很宽的温度范围。 物理强度和导热性树脂体系的固化EP121AO电气绝缘性能明显优于由典型的室温，也热固化环氧树脂体系的展出。 固化后的环氧树脂可满足所有使用温度可达475 ° F至500 °有限的时间段和长时间曝光400 – 450F F。 混合比例为100 A至80组件B零件的重量组成部分。 一个典型的固化时间为2-3 ° F在250小时由5-8小时后在300 ° F。 较高，导热版本称为具有类似特性EP121AN和固化时间也可以。 EP121AO被广泛应用于电子，电气和家电行业。

Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500°F. it cures readily at elevated temperatures to a tough strong solid with excellent long term durability and chemical resistance even when exposed to adverse environmental conditions. Adhesion to metals and other substrates is excellent. There is no cracking or separation of properly cured EP121AO resin from metal, etc., over a wide temperature range. Physical strength thermal conductivity and electrical insulation properties of the cured EP121AO resin system are significantly superior to those exhibited by typical room temperature and also thermally cured epoxy resin systems. The cured epoxy can meet all service temperatures up to 475°F to 500°F for limited time periods and 400-450F for prolonged exposures. The mix ratio is 100 parts of component A to 80 parts of component B by weight. A typical cure schedule is 2-3 hours at 250°F followed by 5-8 hours at 300°F. A higher, thermally conductive version called EP121AN with similar properties and cure schedule is also available. EP121AO is widely used in electronic, electrical and appliance industries.