硕士邦德高分子胶粘剂EP21CL – 1是一种双组份通用配方,固化在室温或用两对一的比例混合,重量或体积高温下更迅速地粘接环氧树脂粘合剂。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂,是相对不敏感,混合比或基板清洗程序粘接强度高。 硕士邦德高分子胶粘剂EP21CL – 1可以应用于无下垂或垂直的表面上,甚至滴水。 它产生持久的高强度的,哪些是显着的抗热循环和包括水,油和有机溶剂的化学品最艰难的债券,在-60 F极宽的温度范围超过250 ° F。 粘附于金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 该胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车,化工等行业。
Master Bond Polymer Adhesive EP21CL-1 is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures with a two-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Adhesive EP21CL-1 can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60 F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The adhesive is widely used in the electronic, electrical, computer, construction, metal working, appliance, automotive and chemical industries.
| Product type | Specialty Polymers and Resins |
| Electrical Properties | |
| Dielectric Strength | 360 to 450 kV/in |
| Dielectric Constant | 2.90 dB/km |
| Technology Type | Film; Solid; Two Component |
| Features | Antistatic; Conductive; High Dielectric; Nonconductive; EMI / RFI Shielding |
| Industry | Aerospace; Automotive; Electronics; Energy / Utilities; Government; General Industrial; Semiconductor; Chemical/Oil Processing/Metal Working |
EP21CL-1,硕士邦德公司,防静电产品,EP21CL-1, Master Bond, Inc., Static Control Products
EP21CL-1
硕士邦德高分子胶粘剂EP21CL – 1是一种双组份通用配方,固化在室温或用两对一的比例混合,重量或体积高温下更迅速地粘接环氧树脂粘合剂。 它易于开发超过3000磅在室温下它不像其他许多环氧粘合剂,是相对不敏感,混合比或基板清洗程序粘接强度高。 硕士邦德高分子胶粘剂EP21CL – 1可以应用于无下垂或垂直的表面上,甚至滴水。 它产生持久的高强度的,哪些是显着的抗热循环和包括水,油和有机溶剂的化学品最艰难的债券,在-60 F极宽的温度范围超过250 ° F。 粘附于金属,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 该胶粘剂被广泛应用于电子,电气,计算机,建筑,金属加工,家电,汽车,化工等行业。
Master Bond Polymer Adhesive EP21CL-1 is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures with a two-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. Master Bond Polymer Adhesive EP21CL-1 can be applied without sagging or dripping even on vertical surfaces. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60 F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The adhesive is widely used in the electronic, electrical, computer, construction, metal working, appliance, automotive and chemical industries.
| Product type | Specialty Polymers and Resins |
| Electrical Properties | |
| Dielectric Strength | 360 to 450 kV/in |
| Dielectric Constant | 2.90 dB/km |
| Technology Type | Film; Solid; Two Component |
| Features | Antistatic; Conductive; High Dielectric; Nonconductive; EMI / RFI Shielding |
| Industry | Aerospace; Automotive; Electronics; Energy / Utilities; Government; General Industrial; Semiconductor; Chemical/Oil Processing/Metal Working |
EP21CL-1,硕士邦德公司,防静电产品,EP21CL-1, Master Bond, Inc., Static Control Products